• Journal of the Korea Society for Simulation
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• v.28 no.2
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• pp.15-22
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• 2019

Simulation methods are being studied for various service models that can be used in industries as the development of web technology. DEVS is being used as a tool to simulate through scenarios using various information. In addition, DEVS/WS integrates web-based DEVS models through a distributed computing environment and can be used as tools for high-performance computing and data distribution. This paper describes a method for simulating an intelligent transportation system in DEVS/WS environment. This paper propose dynamic interest management model(DIMM) applied the genetic algorithm, manage efficiently road information of moving node. And, this paper evaluates performance of the dynamic interest management model in comparing to the none interest management model(NIMM). The transmitted messages and simulation time of the DIMM is saved than that of the NIMM.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.31-39
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• 2004

This paper illustrates the noise characteristics under chip's core operations according to types of packages and modules for DDR DRAM For analyzing this, the impedance profiles and power noises are analyzed with DRAM chips having commercial TSOP package and commercial FBGA package on TSOP-based DIMM and FBGA-based DIMH In controversy with common concepts, we find that the noise-isolation characteristics of FBGA package are more weak and sensitive on transferred noises than those of the TSOP package. In addition, the simulated results show that the decoupling capacitor locations of modules are more important to control the self and transfer noise characteristics than the lead inductance of the packages. Therefore, satisfying the target spec of the noise suppression and isolation can be achieved through the design of power distribution systems only with considering not only the package types but also the whole module system.

• Proceedings of the Korean Society of Computer Information Conference
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• 2017.07a
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• pp.275-278
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• 2017

기존의 임베디드 기기의 하드웨어는 리눅스의 장점에도 불구하고 임베디드 기기들의 프로세서나 메모리 등의 하드웨어 자원이 Built-in 형태로 제공되어 시스템 운용 환경 변화에 맞춘 대응이 어렵다. 이러한 문제를 해결하기 위해 본 논문에서는 i.MX6Q SABRE Board for Smart Devices를 참조하여 메모리를 교체할 수 있도록 SO-DIMM을 장착하고 PCIe 이더넷을 추가한 개발보드를 만들었다. 그리고 개발보드에 추가 및 변경 된 하드웨어 디바이스를 활성화한 새로운 임베디드 시스템을 이식하는 방법을 제시한다. 구현 및 성능 분석 결과 새로운 임베디드 시스템에서 운용자는 시스템 운용 시 환경 변화에 대응하여 메모리를 바꾸어 장착할 수 있게 되었고 이로 인해 시스템의 요구사항에 따라 자원의 확정성 및 유연성이 높아짐을 확인하였다.

• Proceedings of the IEEK Conference
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• 2007.07a
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• pp.347-348
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• 2007

Most of the power consumption of a LCD TV is form the back light unit. Therefore, technoledge for decreasing the power consumption of the backlight unit is crucial for LCD Tvs. This research suggests a method of decreasing the power comsumption of LCD TV by analyzing the image's RGB info to dimm partitioned backlights independently.

• Publications of The Korean Astronomical Society
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• v.18 no.1
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• pp.37-41
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• 2003

We have developed a seeing monitoring system and measured seeing variation of the Bohyunsan Optical Astronomy Observatory (BOAO) and the Sobaeksan Optical Astronomy Observatory (SOAO) using a small telescope system. Our seeing monitoring system is similar to the differential image motion monitor (DIMM) installed at the ESO. The ooly difference between the BOAO and the SOAO seeing monitoring system is a detector system, a video camera at the BOAO and ST-4 camera at the SOAO. We confirmed that the seeing monitoring system at the SOAO can measure average seeing size inspite of its simple detector system. From the BOAO seeing measurement, we found that the seeing size changes fast. We expect that our seeing monitoring system could be used for real time seeing monitoring after some improvement, and the data to be obtained would be very useful when we build adaptive optic system in the future.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.3
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• pp.200-209
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• 2008

This paper describes bandwidth linearization techniques in phase-locked loop (PLL) design for common-clock serial link applications. Utilizing a continuously tunable single-input dual-path LC VCO and a constant-gain phase detector, a proposed architecture is well suited to implementing PLLs that must be compliant with standards that specify minimum and maximum allowable bandwidths such as PCI Express Gen2 or FB-DIMM applications. A prototype 4.75 to 6.1-GHz PLL is implemented in 90-nm CMOS. Measurement results show that the PLL bandwidth and random jitter (RJ) variations are well regulated and that the use of a differentially controlled dual-path VCO is important for deterministic jitter (DJ) performance.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.5
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• pp.476-484
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• 2015

Due to the recent advances in non-volatile memory technologies such as PCM, a new memory hierarchy of computer systems is expected to appear. In this paper, we explore the performance of PCM-based swap systems and discuss how this system can be managed efficiently. Specifically, we introduce three management techniques. First, we show that the page fault handling time can be reduced by attaching PCM on DIMM slots, thereby eliminating the software stack overhead of block I/O and the context switch time. Second, we show that it is effective to reduce the page size and turn off the read-ahead option under the PCM swap system where the page fault handling time is sufficiently small. Third, we show that the performance is not degraded even with a small DRAM memory under a PCM swap device; this leads to the reduction of DRAM's energy consumption significantly compared to HDD-based swap systems. We expect that the result of this paper will lead to the transition of the legacy swap system structure of "large memory - slow swap" to a new paradigm of "small memory - fast swap."