• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.34 no.1
• /
• pp.16-21
• /
• 2024

Using electrochromic devices (ECD), smart window films that can change the colors from tinted state into transparent state by applying an external voltage were manufactured. Polyethylene terephthalate (PET) film was used as a substrate instead of conventional glass, and ECD modules having a total thickness of about 50 ㎛ were manufactured by sequentially introducing an ITO/Ag/ITO electrode layer, a WO3/TIC2 organic discoloration layer, and a Nafion fluorine electrolyte layer. Through a series of sputtering, bar coating, and thermal compression processes, a large scale smart window with a horizontal and vertical length of more than 80 mm was manufactured. When DC 3.5 V was applied, the transmittance decreased from 54 % to 24 % and moreover the color change could be confirmed even with the naked eye. Reversible color change capability at low external voltage implies that external sunlight can be selectively blocked which is effective in terms of energy saving.

• Journal of the Korean Ceramic Society
• /
• v.39 no.10
• /
• pp.928-934
• /
• 2002

Gallium doped Zinc Oxide(GZO) films were deposited by dc magnetron sputtering using a GZO ceramic target at various conditions such as substrate temperature (RT, 400), residual water pressure ($P_{H_2O}$; 1.61${\times}10^{-4}∼2.2{\times}10^{-3}$ Pa), introduction of $H_2$ gas (8.5%) and different magnetic field strengths(250, 1000G). GZO films deposited without substrate heating showed clear degradation in film crystallinity and electrical properties with increasing $P_{H_2O}$. The resistivity increased from 3.0${\times}10^{-3}$ to 3.1${\times}10^{-2}{\Omega}㎝$ and the grain size of the films decreased from 24 to 3 nm when PH2O was increased from 1.61${\times}10^{-4}$ to 2.2${\times}10^{-3}$ Pa. However, degradation in electrical properties with increasing $P_{H_2O}$ was not observed for the films deposited with introduction of 8.5% $H_2$. When magnetic field strength of the cathode increased from 250G to 1000G, crystallinity and electrical properties of GZO films improved remarkably about all the $P_{H_2O}$. This result could be attributed to the decrease in film damage caused by the decrease in plasma impedance.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.19 no.6
• /
• pp.282-287
• /
• 2009

$Ni_xFe_{100-x}$ films with a thickness of about 100nm were deposited on Si(100) substrates at room temperature by a DC magnetron co-sputtering using Fe and Ni targets. Compositional, structural, electrical and magnetic properties of the films were investigated. $Ni_{67}Fe_{33}$, $Ni_{55}Fe_{45}$, $Ni_{50}Fe_{50}$, $Ni_{45}Fe_{55}$, $Ni_{40}Fe_{60}$ films are obtained by increasing the sputtering power of the Fe target. The films of x < 55 have BCC structure and show the phase transformation after annealing at the range of $300{\sim}450^{\circ}C$ for 2 h. On the other hand, the films of x < 50 have the mixed crystalline phases of BCC and FCC after the annealing treatment. The saturation magnetization was decreased initially by the phase transformation effect but then increased again after annealing at $450^{\circ}C$ due to the grain growth and crystallization of BCC phases.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.170-170
• /
• 2010

Thin-film transistors (TFT) have become the key components of electronic and optoelectronic devices. Most conventional thin-film field-effect transistors in display applications use an amorphous or polycrystal Si:H layer as the channel. This silicon layers are opaque in the visible range and severely restrict the amount of light detected by the observer due to its bandgap energy smaller than the visible light. Therefore, Si:H TFT devices reduce the efficiency of light transmittance and brightness. One method to increase the efficiency is to use the transparent oxides for the channel, electrode, and gate insulator. The development of transparent oxides for the components of thin-film field-effect transistors and the room-temperature fabrication with low voltage operations of the devices can offer the flexibility in designing the devices and contribute to the progress of next generation display technologies based on transparent displays and flexible displays. In this thesis, I report on the dc performance of transparent thin-film transistors using amorphous indium tin zinc oxides for an active layer. $SiO_2$ was employed as the gate dielectric oxide. The amorphous indium tin zinc oxides were deposited by RF magnetron sputtering. The carrier concentration of amorphous indium tin zinc oxides was controlled by oxygen pressure in the sputtering ambient. Devices are realized that display a threshold voltage of 4.17V and an on/off ration of ${\sim}10^9$ operated as an n-type enhancement mode with saturation mobility with $15.8\;cm^2/Vs$. In conclusion, the fabrication and characterization of thin-film transistors using amorphous indium tin zinc oxides for an active layer were reported. The devices were fabricated at room temperature by RF magnetron sputtering. The operation of the devices was an n-type enhancement mode with good saturation characteristics.

• Proceedings of the KIEE Conference
• /
• 1999.07d
• /
• pp.1989-1991
• /
• 1999

This paper presents characteristics of CrN thin-film strain gauges, which were deposited on glass by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-$(5{\sim}25%)N_2$). The physical and electrical characteristics of these films investigated with the thickness range $3500{\AA}$ of CrN thin films, annealing temperature $(100{\sim}300^{\circ}C)$ and annealing $(24{\sim}72hr)$. The optimized condition of CrN thin-film strain gauges were thickness range of $3500{\AA}$ and annealing condition($300^{\circ}C$, 48 hr) in Ar-10 %$N_2$ deposition atmosphere. Under optimum conditions, the CrN thin-films for strain gauge is obtained a high resistivity, ${\rho}=1147.65{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=$-186ppm/^{\circ}C$ and a high temporal stability with a good longitudinal, 11.17. And change in resistance after annealing for the CrN thin-films were quitely linear and stable.

• Journal of Sensor Science and Technology
• /
• v.15 no.2
• /
• pp.120-126
• /
• 2006

Physicochemical and electrical properties for hydrogen gas sensors based on Pd-deposited $WO_3$ thin films were investigated as a function of Pd thickness, annealing temperature, and operating temperature. $WO_3$ thin films were deposited on an insulating material by thermal evaporator. XRD, FE-SEM, AFM, and XPS were used to evaluate the crystal structure, microstructure, surface roughness, and chemical property, respectively. The deposited films were grown $WO_3$ polycrystalline with rhombohedral structure after annealing at $500^{\circ}C$. The addition effect of Pd is not the crystallinity but the suppression of grain growth of $WO_3$. Pd was scattered an isolated small spherical grain on $WO_3$ thin film after annealing at $500^{\circ}C$ and it was agglomerated as an irregular large grain or diffused into $WO_3$ after annealing at $600^{\circ}C$. 2 nm Pd-deposited $WO_3$ thin films operated at $250^{\circ}C$ showed good response and recovery property.

• Journal of Surface Science and Engineering
• /
• v.46 no.6
• /
• pp.242-247
• /
• 2013

Zr-Al-N coatings were synthesized by the hybrid coating system combining arc ion plating and DC magnetron sputtering from a Zr and an Al target in argon-nitrogen atmosphere, respectively. By changing the power applied on the Al cathodes, the Zr-Al-N coatings with various Al contents were deposited. The microstructure and chemical compositions of the Zr-Al-N coatings were studied by X-ray diffraction (XRD), high-resolution transmission electron microscopy (HRTEM). With increasing of Al content in the coatings, the solid solution (Zr, Al)N crystallites were observed in the Zr-Al-N coatings. The nanohardness of the Zr-Al-N coatings exhibited a maximum value of 42 GPa for the Zr-Al (7.9 at.%)-N, and decreased with further increase in Al content in the coatings. The oxidation and corrosion behavior of the Zr-Al-N coatings revealed better properties compared than those of ZrN coatings due to the formation of a solid solution.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.71.2-71.2
• /
• 2010

CIS(CuInSe2)계 화합물 태양전지는 높은 광흡수계수와 열적 안정성으로 고효율의 태양전지 제조가 가능하여 화합물 태양전지용 광흡수층으로서 매우 이상적이다. 또한 In 일부를 Ga으로 치환하여 밴드갭을 조절할 수 있는 장점이 있다. 미국 NREL에서는 Co-evaporation 방법을 이용해 20%의 에너지 변환 효율을 달성하였다고 보고된바가 있다. 본 연구에서는 미국의 NREL과 같은 3 stage 방식을 이용하여 광흡수층을 제조하고자 한다. 본 실험에서는 Se 증기압을 각각 $200^{\circ}C$, $230^{\circ}C$, $240^{\circ}C$, $245^{\circ}C$로 달리 하며 실험을 실시하였다. 이때 1st stage의 시간은 15분으로 고정하였으며 기판온도는 약 $250^{\circ}C$로 고정 하였다. 2nd stage는 실시간 온도 감지 장치를 이용하여 Cu와 In+Ga의 조성비가 1:1이 되는 시간을 기준으로 Cu의 조성을 30%더 높게 조절하였으며 기판 온도는 약 $520^{\circ}C$로 고정 후 실험을 실시하였다. 3rd stage의 경우 Cu poor 조성으로 조절하기 위해 모든 조건을 10분으로 고정 후 실험을 실시하였다. 각각의 Se 증기압에 따른 물리적, 전기적 특성을 알아보기 위해 FE-SEM, EDS, XRD 분석을 실시하였다. 본 연구에서 기판은 Na이 첨가되어있는 soda-lime glass를 사용 하였으며 후면 전극으로 약60nm 두께의 Mo를 DC Sputtering 방법을 이용해 증착 하였다.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.114.1-114.1
• /
• 2010

A highly performed Pd-based hydrogen membrane has prepared successfully on a modified porous nickel support. The porous nickel support modified by impregnation method of $Al(NO_3)_3{\cdot}9H_2O$ (Aldrich Co.) over the nickel powder showed a strong resistance to hydrogen embrittlement and thermal stability. Plasma surface modification treatment was introduced as a pre-treatment process instead of conventional HCl wet activation. Ceramic barrier was coated on the external surface of the prepared nickel supports to prevent intermetallic diffusion and to enhance the affinity between the support and membrane. Palladium and copper were deposited at thicknesses of $4\mu}m$ and $0.5{\mu}m$, respectively, on a barrier-coated support by DC sputtering process. The permeation measurement was performed in pure hydrogen at $400^{\circ}C$. The single gas permeation of our membrane was two times higher than that of the previous membrane which do not have ceramic barrier.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.307-307
• /
• 2012

In this study, we investigated that the resistance switching characteristics of Al-doped MgOx films with increasing Al doping concentration and increasing film thickness. The Al-doped MgOx based ReRAM devices with a TiN/Al-doped MgOx/Pt/Ti/SiO2 were fabricated on Si substrates. The 5 nm, 10 nm, and 15 nm thick Al-doped MgOx films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16 sccm, O2: 24 sccm). Micro-structure of Al-doped MgOx films and atomic concentration were investigated by XRD and XPS, respectively. The Al-doped MgOx films showed set/reset resistance switching behavior at various Al doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased with decreasing thickness of Al-doped MgOx films. Besides, the initial current of Al-doped MgOx films is increased with increasing Al doping concentration in MgOx films. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen of Al-doped MgOx.