• Journal of the Semiconductor & Display Technology
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• v.11 no.3
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• pp.63-67
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• 2012

The films were deposited at evaporator system and were annealed at heat treatment. The films had a dense microstructure with fine grains. The electrical properties of the films were dramatically controlled with annealing. Samples Preparation were analyzed in term of positive temperature coefficient of Resistivity Samples were made in the substrate tempera-true of $400^{\circ}C$ deposition time of 10 hours, and forward power of 210watt. R-T(resistivity-temperature) Characteristics of the samples were investigated as a function of the substrate type and the ambient temperature. The resistivity of the thin film specimens was compared with that of the bulk type specimens. By using RF/DC magnetron sputtering system, we obtained lower resistivity in the thermistor with thin $BaTiO_3$ film than that in the bulk type thermistor.

• Journal of the Korean Magnetics Society
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• v.8 no.4
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• pp.216-223
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• 1998

DC magnetron sputtering 방법에 의해 Corning glass 가판 위에 제작한 buffer/[CoFe/Cu]N 형태의 다층작막에 대하여 자기저항비의 비자성층 Cu두께, 기저층 종류(Fe, Cu, Cr, Ta)와 두께, Ardkqfur, 다층 층수 및 열처리 의존성을 조사하였다. 자기저항비는 비자성층 Cu 두께에 따라 진동하였다. 기저층 Fe 및 Cr의 두께가 60$\AA$이고, 층수 N=15, Ardkqfur 5mTorr에서 극대자기저항비 14%를 보였으며 25$0^{\circ}C$까지의 시료에 대한 열처리는 다층박막의 주기성을 유지한 채 더 큰 결정립을 갖게 하여 자기저항비는 증가하였으나 그 이상의 온도에서는 계면 혼합 및 계면 확산에 의한 감소를 나타내었다. Cr기저층 시료가 Fe 기저층 시료보다 열적안정성이 더 좋은 것을 알 수 있었다.

• Korean Journal of Materials Research
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• v.6 no.6
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• pp.626-631
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• 1996

Reactive dc magnetron sputtering 법을 이용하여 증착한 molybdenum mitride 박막의 Cu 확산 방지막 특성을 조사하였다. Cu 확산 방지막으로서 molybdenum nitride 박막의 열적안정성을 관찰하기 위하여 molybdenum nitride 박막 위에 Cu를 evaporation 법으로 증착하고 진공 열처리하였다. Cu/r-Mo2N/si 구조는 $600^{\circ}C$, 30분간 열처리 시까지 안정하였다. 확산 방지막의 파괴는 $650^{\circ}C$, 30분간 열처리 시부터 격자 확산(lattice diffusion)이나 입계(grain boundary)과 결함(defect)을 통한 확산에 의해 나타나기 시작하였고, 이 때 molybdenum silicide과 copper silicide의 형성에 기인된 것으로 생각되었다. 열처리 이후 Cu/r-Mo2N/Si 사이의 상호반응이 증가하였다. 이는 Rutherford backscattering spectrometry, Auger electron spectroscopy 그리고 Nomarski microscopy 등의 분석을 통해 조사되었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.476-479
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• 2000

In this study, mesh-type PECVD system was suggested to minimize the hydrogen concentration. The main structural difference between the triode system and a conventional system is that a mesh was attached to the substrate holding electrode. We investigated several conditions to compare with conventional PECVD. The main effect of mesh was to minimize the substrate damage by ion bombardment and to enhance the surface reaction to induce hydrogen desorption. It was also found that hydrogen concentration decreased but deposition rate increased as increasing applied dias. Applied DC bias enhanced sputtering process. Intense ion bombardment causes the weakly bonded hydrogen or hydrogen-containing species to leave the growing film and increased adatom mobility. Furthermore, addition of hydrogen gas enhance the surface diffusion of adatom. The structural properties of poly-Si films were analyzed by scanning electron microscopy(SEM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.97-100
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• 2001

This paper presents the characteristics of Ta-N thin-film strain gauges as high-temperature strain gauges, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(4∼16 %)N$_2$). These films were annealed for 1 hour in 2x10$\^$-6/ Torr vaccum furnace range 500∼1000$^{\circ}C$. The optimized conditions of Ta-N thin-film strain gauges were annealing condition(900$^{\circ}C$, 1 hr.) in 8% N$_2$ gas flow ratio deposition atmosphere. Under optimum conditions, the Ta-N thin-films for strain gauges is obtained a high resistivity, $\rho$=768.93 ${\mu}$Ω cm, a low temperature coefficient of resistance, TCR=-84 ppm/$^{\circ}C$ and a high temporal stability with a good longitudinal gauge factor, GF=4.12.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1430-1432
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• 2003

Al doped Zinc Oxide(ZnO:Al) films, which is widely used as a transparent conductor in optoelectronic devices such as solar cell, plasma display panel, thermal heater, and other sensors, were prepared by using the capacitively coupled DC magnetron sputtering method. The influence of the substrate temperature, working gas pressure and deposition time on the electrical, optical and morphological properties were investigated experimentally. ZnO:Al films with the optimum growth conditions of working gas pressure and substrate temperature showed resistivity of $9.64{\times}10^{-4}\;{\Omega}$-cm and transmittance of 90.02% for a film 860nm thick in the wavelength range of the visible spectrum.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1553-1555
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• 2003

Coatings on glass with highly transparent conducting oxide films(TCOs) are performed mostly by using indium tin oxide(ITO). This Oxide material is very common for applications where both high electrical conductivity. Photovoltaic cells, transparent electrical heater, selective optical filter, and a optical transmittance are essential. In this study, ITO thin films were deposited on $SiO_2$/soda-line glass plates by a dc magnetron sputtering technique. The crystallinity and electrical properties of the films were investigated by X-ray diffraction(XRD), atomic force microscopy(AFM) scanning and 4-point probe. The optical transmittance of ITO films in the range of 300-800nm were measured with a spectrophotometer. As a result, we obtained polycrystalline structured ITO films with (222), (400), and (440) peak. Transmittance of all the films were higher than 90% in the visible range.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.242-244
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• 1996

Platinum thin films were deposited on Si-wafer by DC magnetron sputtering for RTD (Resistance Thermometer Devices). We investigated the physical and electrical characteristics of these films under various conditions, the input power, working vacuum, temperature of substrate and also after annealing these films. The Resistivity and Sheet Resistivity were decreased with increasing the temperature of substrate and the annealing time at $1000^{\circ}C$. At substrate temperature $300^{\circ}C$, input power 7(w/$cm^2$), working vacuum 5mtorr and annealing conditions $1000^{\circ}C$, 240min we obtained $10.65{\mu}{\Omega}{\cdot}cm$, Resistivity of Pt thin film and $3000{\sim}3900ppm/^{\circ}C$, TCR(temperature coefficient of resistance) closed to the bulk value.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.91-92
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• 2007

In-Sn-Zn-O (ISZO)박막과 In-Zn-Sn-O (IZSO)박막은 상온에서 2개의 캐소드 (DC, RF)를 이용하여 마그네트론 2원 동시 방전법에 의해 polyethylene terephthalate (PET)기판 위에 실온에서 증착되었다. ISZO 박막의 경우, Zn함량이 증가함에 따라 비저항은 증가하였지만, Zn원자의 도입에 의해 표면 조도는 개선되었다. 반면, IZSO 박막의 경우, 최저비저항 ($3.17$ ${\times}$ $10^{-4}$ ${\Omega}cm$)은 $SnO_2$ 타켓의 RF power 40W에서 얻어졌지만, Sn원자의 도입에 의해 표면 조도는 거칠어졌다. XRD 측정 결과 모든 박막은 비정질 구조로 사료되고, 가시광선 영역에서 80% 이상의 높은 투과율을 보였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.97-98
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• 2007

DC magnetron sputtering법을 이용하여 다양한 $Al_2O_3:$ 함량비( 1, 2, 3 wt%)를 가진 고밀도 세라믹 타겟을 사용하여 기판온도 $RT{\sim}300^{\circ}C$에서 AZO박막을 제작하였다. $Al_2O_3:$함량 및 기판온도의 증가에 따라 AZO박막의 결정성은 향상됨을 확인할 수 있었다. 결과적으로 기판온도 $300^{\circ}C$에서 $Al_2O_3:$ 3 wt%를 함유한 AZO 타겟을 사용하여 증착한 AZO박막은 가시광 영역에서 85%이상의 높은 투과율과 $7.8{\times}10^{-4}{\Omega}cm$의 비저항 값을 나타내었다.