• Journal of the Korean Vacuum Society
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• v.3 no.4
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• pp.434-441
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• 1994

메탄과 수소 혼합가스로 직류 플라즈마 화학 증착법을 이용하여 방전전류 반응압력 메탄농도 및 피착체의 온도를 변화시키면서 다이아몬드 유산탄소 박막(DLCF)을 Si(111)-웨이퍼 위에 합성하였다. 주 사전자 현미경(SEM)과 레이져 Raman 스펙트로포토메터로 확인된 양질의 DLCF를 얻은 조건은 방전전 류 반응 압력, 메탄농도 그리고 피착체의 온도가 각각 480mA, 32 Torr, 1.0 vol% 및 85$0^{\circ}C$ 였다. 이 DLCF는 대부분 sp3 탄소결합으로 된 구형의 알갱이들로 구성되어 있고 그굴절률은 2.2로 천연다이아몬 드와 비슷한 값을 가지고 있다. 또한 DLCF 성장에서 수소피복이 매우 중요한 것으로 밝혀졌다.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.212-217
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• 2013

Ultra hard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) magnetron sputtering techniques. The effects of ICP power, ranging from 0 to 300 W, on the coating microstructure, crystallographic, and mechanical properties were systematically investigated with FE-SEM, AFM, HR-XRD and nanoindentation. The results show that ICP power has a significant influence on the coating microstructure and mechanical properties of TiN coatings. With an increasing ICP power, the film microstructure evolves from an apparent columnar structure to a highly dense one. Grain sizes of TiN coatings decreased from 12.6 nm to 8.7 nm with an increase of the ICP power. A maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at an ICP power of 300 W. The crystal structure and preferred orientation in the TiN coatings also varied with the ICP power, exerting an effective influence on film nanohardness.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.4
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• pp.63-69
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• 1994

The Ultrahigh Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition(UHV-ECRCVD) system whose base pressure is 1${\times}10^{9}$ torr has been constructed. In-situ cleaning prior to the epitaxial growth was carried out at 56$0^{\circ}C$ by ECR generated uniform hydrogen plasma whose density is $10^{10}/cm{3}$. The natural oxide was effectively removed without damage by applying positive DC bias(+10V) to the substrate. RHEED(Reflection High Energy Electron Diffraction) analysis has been used to confirm the removal of the surgace oxide and the streaky 2$\times$1 reconstruction of the Si surface, and the suppression of the substrate damage is anaylized by X-TEM(cross-sectional Transmission Electron Microscopy). Surface cleaning technique by ECR hydrogen plasma confirmed good quality epitaxial growth at low temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.2
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• pp.95-100
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• 1998

A helical inductively coupled plasma asher, which produces low energy and high density plasma, has been built and investigated for photoresist stripping process. Oxygen ion density in the order of $10^{11}/cm^3$ is measured by Langmuir probe, and higher oxygen radical density is observed by Optical Emission Spectrometer. As RF source power is increased, the plasma density and thus photoresist stripping rate are increased. Independent RF bias power to the wafer stage provides a dc bias to the wafer and an ability to add the ion assisted reaction. At 1 KW of the source power, the coupling mechanism of the RF power to the plasma is changed from the inductive mode to the capacitive one at about 1 Torr. This change causes the plasma density and ashing rate decreases abruptly. The critical pressure of the mode change becomes larger with larger RF power.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.208-211
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• 2003

The dielectric carbon nitride thin films were deposited onto Si(100) using a pulsed laser ablation of pure graphite target combined with a high voltage discharge plasma in nitrogen gas atmosphere. We can be calculated dielectric constant, ${\varepsilon}_s$, with a capacitance Sobering bridge method. We reported to investigate the influence of the laser ablation of graphite target and DC high voltage source for the plasma. The properties of the deposited carbon nitride thin films were influenced by the high voltage source during the film growth. Deposition rate of carbon nitride films were found to increase drastically with the increase of high voltage source. Infrared absorption clearly shows the existence of C=N bonds and $C{\equiv}N$ bonds. The carbon nitride thin films were observed crystalline phase, as confirmed by x-ray diffraction data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.124-125
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• 2005

ZnS:Mn thin films have attracted great interest as electroluminescence devices. In this study, inductively coupled BCl$_3$/Ar plasma was used to etch ZnS:Mn thin films. We obtained the maximum etch rate of ZnS:Mn thin films was 2209 ${\AA}$/min at a BCl$_3$(20%)/Ar(80%) gas mixing ratio, an RF power of 700 W, a DC bias voltage of-250 V, a total gas flow of 20 sccm, and a chamber pressure of 1 Pa. It was proposed that sputter etching is dominant etching mechanism while the contribution of chemical reaction is relatively low due to low volatility of etching products.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.404-407
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• 2003

Among the ferroeletric thin films that have been widely investigated for ferroelectric random access memory (FRAM) applications, the $SrBi_2Ta_2O_9$ (SBT) thin film is appropriate as a memory capacitor material due to its excellent fatigue endurance. SBT thin films were etched in high-density $Cl_2/Ar$ in inductively coupled plasma. The maximum etch rate of SBT film is $1834\;{\AA}/min$ under $Cl_2/(Cl_2+Ar)$ of 30 %, rf power of 700 W, dc-bias voltage of -250 V, chamber pressure of 11 mTorr and gas flow rate of 20 sccm.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.98.2-98.2
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• 2017

본 연구에서는 다양한 농도의 수산화나트륨 수용액에서 AZ31 마그네슘 합금의 양극산화 거동에 미치는 인가 전류밀도의 영향에 대해 알아보았다. 다양한 크기의 DC 전류를 인가하여 양극산화 거동을 확인하였으며, 형성된 피막의 표면구조를 optical microscope, confocal scanning laser microscope 등을 이용하여 관찰하였다. 연구결과, 인가 전류밀도에 따라 세 가지 유형의 voltage-time curve를 얻을 수 있었으며, voltage-time curve의 유형에 따라 서로 다른 피막 색상과 표면구조를 형성함을 발견하였다. 수산화나트륨 전해액에서 AZ31 마그네슘 합금의 플라즈마 전해산화 피막은 0.6 M 이상의 농도를 가진 수산화나트륨 용액에서 임계값 이상의 전류밀도를 인가하였을 경우에만 형성됨을 확인하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.4
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• pp.632-637
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• 2003

In this study, the effect of surface treatment of CFRP and aluminum on the fracture toughness of CFRP/aluminum composites was investigated. CFRP was surface-treated by Ar$^{+}$ ion beam under oxygen environment, and the aluminum was surface-treated by DC plasma. CFRP was adhesively bonded to aluminum using the secondary bonding procedure. Cracked lap shear specimens were used to determine fracture toughness. Three cases of cracked lap shear specimens were made depending on the surface treatment. The values of fracture toughness of three cases were compared to each other It was found that the fracture toughness of ion beam-treated CFRP/aluminum composites was almost 72 % higher than that of unrented CFRP/aluminum composites. The fracture toughness of CFRP/plasma-treated aluminum composites was 50 % higher than that of untreated CFRP/aluminum composites.s.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.454-454
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• 2012

Magnetron sputtering에서, 영구자석의 자속은 target 표면 가까이에 전자를 구속한다. 구속된 전자는 Ar중성기체와 충돌하여 Ar이온을 발생시킬 수 있으므로, target 근처에서의 플라즈마 밀도를 높여, 자석이 없을 때보다 낮은 압력 또는 낮은 전압에서 방전할 수 있다. 구속 전자가 밀집된 공간에서 sputtering 현상이 주로 발생하기 때문에, planar target을 사용할 경우에는 target이 불균일하게 식각되어 target의 사용효율이 좋지 못하다. 이에 대한 한 가지 대안은 target을 원통형으로 만들어 회전시키는 것이다. Cylindrical target 의 내부에 위치한 영구자석은 고정시키고, target만을 회전시키면 비교적 균일하게 식각되므로 target의 사용효율을 높일 수 있다. 본 연구에서는 기존의 planar target에 대한 Particle-In-Cell Simulation을 Cylindrical target 에 적용시키기 위한 방법을 알아본다. 또한, 개발된 Simulator를 이용하여, Sputtering 조건의 변화에 대한 I-V curve의 변화를 살펴본다.