• Journal of the Korean institute of surface engineering
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• v.35 no.3
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• pp.141-148
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• 2002

Fe-C alloy layers were produced by pulse plating and the properties were compared with those produced by D.C. plating. When the pulse on time ($T_{on}$ ) was the same, both the duty cycle and peak current density($I_{p}$ ) had little influence on the carbon content and the hardness of the layer. The structure and hardness of the direct current plating were similar to those of the pulse current plating. However, the ductility was enhanced when the pulse current was applied due to the release of residual stress during the pulse off time($T_{off}$).).

• Journal of the Korean institute of surface engineering
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• v.22 no.4
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• pp.197-206
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• 1989

The Composition and throwing power-of Pb-Sn alloy deposits are investigated in tems of the pulse parameters in pulse plating. Microhardness and intermal srress of alloy deposots are measured. The current efficiency of pulse plating is lower than that of D.C.plating while cathode overpotential and macro-throwing power noticebly increase with increasing peak current density. The Pb content of P.C. plated alloy deposits with increasing average current density, is relatively lower than of D.C. plated deposits at the same average current density. The internal stress of Pb-Sn alloy is not detected and the microhardness are 9.0kg/mm2 and 11kg/mm2 for D.C. plated P.C. plated deposits, respectively.

• Journal of Power System Engineering
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• v.8 no.3
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• pp.36-43
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• 2004

The effect of bath composition, plating condition and plating rate on the magnetic property of electroless Co-Cu-P deposits were investigated. With increasing $CuCl_2$ concentration in the bath, plating rate increased, while the Br value of deposit decreased sharply. Deposited surface were inferiority by the increase pH above 10.5, bath temperature higher than $80^{\circ}C$. Plating reaction had been ceased by the increase of pH above 11, bath temperature higher than $90^{\circ}C$ and under $40^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent(sodium citrate) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer (thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(20min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

• Journal of Power System Engineering
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• v.5 no.2
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• pp.71-78
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• 2001

Using sodium hypophosphite as reducing agent, bath composition and plating condition of electroless copper plating on plating rate have been studied. The followings were determined as optimum, bath composition; $CuSO_4\;0.025M,\;NiSO_4\;0.002M,\;NaH_2PO_2\;0.4M$, sodium citrate 0.06M, $H_3BO_3$ 0.6M, thiourea or 2-MBT $0.2mg/{\ell}$, and operation conditions; pH $9{\sim}10$ at bath temperature rage of $60{\sim}70^{\circ}C$. A small amount of nickel ion($Ni^{2+}/Cu^{2+}$=0.002/0.025) to the hypophosphite reduced solution promotes autocatalysis and continuous plating. An additive such as thiourea or 2-MBT of a small amount($0.2mg/{\ell}$) can be used to stabilize the solution without changing plating rate much. The attivation energy between $20^{\circ}C\;and\;70^{\circ}C$ were calculated to be 11.3kcal/mol for deposition weight. Plating reaction had been ceased by the adjustment of pH above 13, temperature higher than $90^{\circ}C\;and\;under\;20^{\circ}C$. Deposited surface became worse in the case of increment of bath temperature above $80^{\circ}C$.

• Journal of Powder Materials
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• v.25 no.5
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• pp.375-378
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• 2018

Conductive and dielectric SiC are fabricated using electroless plating of Ni-Fe films on SiC chopped fibers to obtain lightweight and high-strength microwave absorbers. The electroless plating of Ni-Fe films is achieved using a two-step process of surface sensitizing and metal plating. The complex permeability and permittivity are measured for the composite specimens with the metalized SiC chopped fibers dispersed in a silicone rubber matrix. The original non-coated SiC fibers exhibit considerable dielectric losses. The complex permeability spectrum does not change significantly with the Ni-Fe coating. Moreover, dielectric constant is sensitively increased with Ni-Fe coating, owing to the increase of the space charge polarization. The improvements in absorption capability (lower reflection loss and small matching thickness) are evident with Ni-Fe coating on SiC fibers. For the composite SiC fibers coated with Ni-Fe thin films, a -35 dB reflection loss is predicted at 7.6 GHz with a matching thickness of 4 mm.

• Journal of the Korean institute of surface engineering
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• v.30 no.2
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• pp.104-110
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• 1997

Conventional hexavlent chromium electroplating baths deposit the matal at low cathode efficiency and have poor covering and throwing power. The processs also generate hazardous wastes. To overcome many of the disadvantages of hexavalent chromium plating the use of trivalent chromium has advocted. After Yoshida, who first studied trivalent chromium plating, using ammonium sulfate and urea, there are numerous report describing the trivalent chromium electropating process using complexing agents. This study investigaten trivalent chromium plating electrolyte solutious containing formate as a complexing agent and ammouim chloride for conducting agent. The effects of composition and operating conditions on deposits and current efficiencies were investigated in trivalent chromium plating baths by analyzing the relationship pulse conditions and surface morphology The surface morphology of the deposits was observed by SEM. pulse electrolysis has been effective on obtaining a smooth with high current efficiency comparing with D.C. electrolysis in trivalent chromium solution.

• Journal of Power System Engineering
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• v.5 no.3
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• pp.80-87
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• 2001

Decorative properties of chromium depositions from oxalic acid bath containing chromium oxide and ammonium sulfate have been examined over a wide range of bath compositions and plating conditions. The obtained results from this experiment are summarized as follow: The followings were determined as a optimum conditions, bath compositions; $CrO_3\;200{\sim}250\;g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700\;g/{\ell},\;(NH_4)_2SO_4\;40{\sim}120\;g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density $15{\sim}250\;A/dm^2$ at bath temperature range of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration and bath temperature. Decorative property for chromium deposition was adopted to apply stoichiometric ratio of $CrO_3$ concentration and $H_2C_2O_4{\cdot}2H_2O$.

• 한국전산유체공학회:학술대회논문집
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• 2008.08a
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• pp.60.2-60.2
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• 2008

• Journal of the Korean Society of Clothing and Textiles
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• v.29 no.1 s.139
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• pp.149-156
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• 2005

The purpose of this study was to produce the high quality of electromagnetic wave shielding fabrics. In this study, we have produced polyester fabrics by electroless Ag plating. The untreated polyester was etched with $4\%$ NaOH solution added accelerant(Benzyl Dimethyl Dodecyl Ammonium Chloride) then it was catalyzed by $SnCl_2$ solution and activated by $PdCl_2$ solution. Electroless Ag plating was carried out by changing conditions such as temperature. time, weight loss rate of polyester and kind of reducing agents. The electromagnetic wave shielding effectiveness of polyester fabric by electroless Ag plating was measured by RF Impedance Analyzer and element of electromagnetic wave shielding substance was measured using Electron probe micro analyzer. The results were as follows; The plating bath using potassium sodium tartrate by reducing agent was excellent electromagnetic wave shielding effectiveness. Element of electromagnetic wave shielding substance was silver. Electromagnetic wave shielding effectiveness was shown over 64dB at the temperature of $40^{\circ}C$, treating time 30min., weight loss rate $20\%$.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.3-3
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• 2001

Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.