• Corrosion Science and Technology
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• 제20권5호
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• pp.249-255
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• 2021

In this work, we proposed a facile method to fabricate the three-dimensional porous copper current collector (3D Cu CC) for a Si-dominant anode in a Li-ion battery (LiB). The 3D Cu CC was prepared by combining chemical etching and thermal reduction from a planar copper foil. It had a porous layer employing micro-sized Cu balls with a large surface area. In particular, it had strengthened attachment of Si-dominant active material on the CC compared to a planar 2D copper foil. Moreover, the increased contact area between a Si-dominant active material and the 3D Cu could minimize contact loss of active materials from a CC. As a result of a battery test, Si-dominant active materials on 3D Cu showed higher cyclic performance and rate-capability than those on a conventional planar copper foil. Specifically, the Si electrode employing 3D Cu exhibited an areal capacity of 0.9 mAh cm^-2 at the 300^th cycles (@ 1.0 mA cm^-2), which was 5.6 times higher than that on the 2D copper foil (0.16 mAh cm^-2).

• 대한치과재료학회지
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• 제45권4호
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• pp.243-256
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• 2018

본 연구에서는 생체활성 타이타늄 차폐막의 제조에 필요한 기초적인 자료를 얻기 위해서 타이타늄 박판의 양극산화처리와 석회화 순환처리의 조건 및 이들 표면처리가 표면특성과 생체활성도에 미치는 영향에 대하여 조사하였다. $30{\times}20{\times}0.08mm$의 타이타늄 판을 준비한 다음 $HNO_3:HF:H_2O$를 12 : 7 : 81 로 혼합한 용액에서 10 초 동안 산세처리 후 사용하였다. 타이타늄 차폐막의 비표면적을 증가시키기 위해서 나노튜브 $TiO_2$층을 형성한 후, 하이드록시아파타이트의 석출에 따른 생체활성도를 개선하기 위해서 석회화 순환처리를 하였다. 표면처리된 표면특성을 평가하기 위해서, 부식에 대한 저항성시험, 젖음성 검사, 유사체액 침적시험을 실시하였다. 양극산화처리로 형성된 나노튜브들은 상대적으로 큰 직경의 튜브들과 작은 직경의 튜브들로 구성되어 있었으며, 내부는 비어있고 외벽은 서로 결합되어 있는 구조를 보였다. 연속적으로 시행된 석회화 순환처리로 나노튜브층에 하이드록시아파타이트 석출물이 침투되어 결합이 일어났으며, 순환처리 회수가 증가함에 따라서 HAp 의 석출량이 비례적으로 증가하는 경향을 보였다. 결론적으로, 타이타늄 차폐막의 표면에 나노튜브 $TiO_2$ 층을 형성한 후 석회화 순환처리를 하여서 HAp 의 석출을 유도하는 것은 생체활성도 개선에 크게 기여할 수 있다는 것을 확인하였다.

• 한국강구조학회 논문집
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• 제28권5호
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• pp.373-382
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• 2016

도장 또는 금속용사는 강구조물의 방식에 널리 사용되고 있으며, 금속용사와 도장의 복합방식법은 혹독한 부식환경하에 놓인 강구조물에 고내후성 피복방식법으로 적용되고 있다. 본 연구에서는 아연(Zn), 아연-알루미늄(ZnAl)합금, 알루미늄(Al), 알루미늄-마그네슘(AlMg)합금의 4종류 금속용사 후 실링 처리한 시편, 4종류 금속용사 후 중방식 도장한 시편과 도장만 실시한 시편을 대상으로 175일간의 ISO 20340 부식촉진실험을 실시하여, 각 방식법의 상대적인 내후성능을 비교, 검토하였다. 강재표면까지 도달하는 원형 및 선형 초기결함으로부터의 표면상태 변화 및 도막의 노화면적에 근거한 내후성능의 평가 결과, 금속용사 후 실링 처리한 시편의 경우에는 알루미늄(Al) 및 알루미늄-마그네슘(AlMg)금속용사 후 실링 처리한 시편이 가장 우수한 내후성능을 보였으며, 금속용사 후 도장을 실시한 금속용사와 도장의 복합방식법의 경우에는 아연(Zn)용사에 도장을 실시한 복합방식 시편이 가장 우수한 내후성능을 나타내었다.

• 한국표면공학회지
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• 제41권5호
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• pp.226-231
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• 2008

Titanium and its alloy have been widely used in dental implant and orthopedic prostheses. Electrochemical characteristics of dental implant in the various simulated body fluids have been researched by using electrochemical methods. Ti-6Al-4V alloy implant was used for corrosion test in 0.9% NaCl, artificial saliva and simulated body fluids. The surface morphology was observed using scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDX). The electrochemical stability was investigated using potentiosat (EG&G Co, 263A). The corrosion surface was observed using scanning electron microscopy (SEM). From the results of potentiodynamic test in various solution, the current density of implant tested in SBF and AS solution was lower than that of implant tested in 0.9% NaCl solution. From the results of passive film stability test, the variation of current density at constant 250 mV showed the consistent with time in the case of implant tested in SBF and AS solution, whereas, the current density at constant 250mV in the case of implant tested in 0.9% NaCl solution showed higher compared to SBF and AS solution as time increased. From the results of cyclic potentiodynamic test, the pitting potential and |$E_{pit}\;-\;E_{corr}$| of implant tested in SBF and AS solution were higher than those of implant tested in 0.9% NaCl solution.

• 한국결정성장학회지
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• 제14권5호
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• pp.199-203
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• 2004

유사구강 분위기인 인공타액 조건하에서 인공치아용 상부구조물 재료 중 하나인 3Y-TZP를 500~3000 N의 하중 조건으로 $10^6$ 횟수까지 헤르찌안 반복하중을 가하여 그 피로특성을 압입손상과 강도저하현상으로 관찰하였다. 500 N의 하중에서 $5\times10^5$ 반복 횟수까지 피로실험결과, 강도저하 및 균열현상은 관찰되지는 않았지만 반복하중 값이 증가함에 따라 링 균열에서 방사상 균열로 전이되었을 때 급격한 강도 저하현상이 관찰되었다. 또한 강도 저하 현상은 유사 구강분위기하에서 반복 하중 접촉시 발생한 균열을 통해 침투한 인공타액의 화학적 침식으로 가속화 되었다.

• Structural Engineering and Mechanics
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• 제53권5호
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• pp.867-880
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• 2015

Mechanical fastening is still one of the main methods used for joining components. Different techniques have been applied to reduce the effect of stress concentration of notches like fastener holes. In this work we evaluate the feasibility of combining laser shock peening (LSP) and cold expansion to improve fatigue crack initiation and propagation of open hole specimens made of 6061-T6 aluminum alloy. LSP is a new and competitive technique for strengthening metals, and like cold expansion, induces a compressive residual stress field that improves fatigue, wear and corrosion resistance. For LSP treatment, a Q-switched Nd:YAG laser with infrared radiation was used. Residual stress distribution as a function of depth was determined by the contour method. Compact tension specimens with a hole at the notch tip were subjected to LSP process and cold expansion and then tested under cyclic loading with R=0.1 generating fatigue cracks on the hole surface. Fatigue crack initiation and growth is analyzed and associated with the residual stress distribution generated by both treatments. It is observed that both methods are complementary; cold expansion increases fatigue crack initiation life, while LSP reduces fatigue crack growth rate.

• 전기화학회지
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• 제3권2호
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• pp.90-95
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• 2000

겔형 VRLA전지의 파손방식을 조사하기 위하여 $100\%$ 방전심도에서 5시간율 전류로 충방전 수명시험을 하였다. 정전압 충전방식을 사용하여 충전전압을 2.40V와 2.50V로 하였을 때 1,000회 이상의 수명을 나타내었으며, 전지의 무게변화를 측정한 결과 각각 426.4g과 391.2g의 전해액이 감소하였다 2.50V로 충전한 전지가 우수한 수명특성을 나타내었으며, 전해액 손실량이 충전계수와 비례하는 것을 알 수 있었다 1,000회의 충방전 수명시험을 한 전지의 양극기판에는 약 $50{\mu}m$의 부식층이 관찰되었고, 활성물질의 미세구조는 크게 변하였다. 양극판의 파손방식은 활물질 탈락이며, 전해액 손실이 방전용량 감소의 원인인 것을 알 수 있었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 대한기계학회논문집A
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• 제40권12호
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• pp.1027-1035
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• 2016

내식성과 기계적 성능이 우수한 316L 스테인리스 강의 저주기 변형률제어 피로시험에서 3가지 변형률진폭과 3가지 변형률비의 조건이 피로수명에 미치는 효과를 분석하였다. 낮은 변형률범위에서 곡선이 거의 중첩되는 Masing 거동이 나타나고, 높은 변형률범위에서 비선형거동 응력범위가 서로 크게 벗어나는 non-Masing 거동과 함께 평균응력의 감소가 나타났다. 소성 변형률에너지를 이용하여 저주기 피로수명을 예측하고 non-Masing 거동을 고려한 수명예측 방법의 정확성 여부를 검토하였다. 각각의 변형률진폭과 변형률비의 조건에서 초기 수 사이클 동안 반복경화 현상 후 장시간동안 점진적으로 낮아져 연화하다가 파괴 되었다. 저사이클 피로수명을 정확히 예측하기 위해서는 변형률진폭에 따라 Masing 및 non-Masing 거동을 구분하고, 이를 반영한 수명예측식을 적용해야 함을 알았다.