• Architectural research
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• v.8 no.1
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• pp.57-68
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• 2006

Global competition and reduced project life cycle ultimately puts greater performance requirements on the capital project delivery systems used to maintain competitiveness. Despite continuing improvements in delivery cycle time, business owners of facilities continue to demand greater improvements in project delivery cycle time. Therefore, it is very important to investigate the various techniques and methods leading to reduction in project cycle time and also identify the applicability of identified techniques and methods. This paper introduces reduction techniques identified through literature review (i.e, Schedule Reduction Techniques (SRTs), Management Techniques (MTs), and Construction Institute Industry (CII) Best Practices (BPs). In order to collect applicability of these techniques under different project phases (Pre-project planning (PPP), Design (D), Material Management (MM), Construction (C), and Start-up (SU)), the Essence Applicability Matrices (EAM) is used.

• Architectural research
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• v.7 no.2
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• pp.69-79
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• 2005

There are no formal decision tools or guidelines to assist owners and contractors in choosing delivery systems and project strategies that would allow for a radical reduction in project cycle time - from the preplanning phase through project start up. Therefore, it is important to identify the state-of-practice and the state-of-art on methods of achieving radical reduction defined as a reduction of 25% or more in overall project cycle time. A comprehensive literature review, three questionnaire surveys, and the seven case studies were conducted and the data obtained from them were analyzed to establish the state-of-practice and state-of-art for project cycle time reduction techniques.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.197-198
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• 2013

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2001.10a
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• pp.298-301
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• 2001

In semiconductor manufacturing, wafer fabrication is the most complicated and important process, which is composed of several hundreds of process steps and several hundreds of machines involved. The productivity of the manufacturing mainly depends on how well they control balance of WIP flow to achieve maximal throughput under short manufacturing cycle time. In this paper mathematical formulation is suggested for the stepper scheduling, in which cycle time reduction and maximal production is achieved.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.23-27
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• 2005

Generally, when the injection molds are made in advanced nations, the improvement of a quality and production rate is obtained by using CAE. In this paper, the methodology which is possible to reduce the cycle time of injection molding process is studies by using the cooling analysis with CAE(Moldmax). In case of changing the cooling system design with the analysis result of CAE, the manimum reduction of the cycle time runs into 30 percent. Finally, the average reduction of the cycle time is 17.8 percent.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.2
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• pp.248-255
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• 2002

Miller cycle was studied and analyzed by engine performance simulation to achieve very low fuel consumption and to meet the IMO NOx regulation on a medium speed diesel engine. Based on the performance simulation results the intake valve closing time for HYUNDAI HiMSEN 6H21/32 engine was set at 0deg.ABDC(After Bottom Dead Center). Also, the simulation results indicated that significant NOx reduction could be achieved with low reduction of fuel consumption. The performance simulation investigated the effect of compression ratio and turbocharger on fuel consumption and NOx concentration in combination with Miller cycle. The results indicated a significant reduction of fuel consumption with keeping NOx concentration. The results of performance simulation were compared with measured data to verify simulation results. The comparison showed the maximum error was 2.34% in exhaust temperature. Also, the experimental result showed that improvement in BSFC(Brake Specific Fuel Consumption) was 5.8g/kwh with keeping NOx level similar to simulation result.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.33-38
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• 2012

The wafer positioning robot in the semiconductor industry is required to operate at high speed for the improvement of productivity. The residual vibration caused by the high speed of the wafer positioning robot, however, makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the improvement of the cycle time. The followings are the process for the reduction and the improvement; 1) System modeling of the wafer positioning robot, 2) Verification of dynamic characteristics of the wafer positioning robot, 3) Input shaping plan using impulse response reiteration, 4) Simulation test using SIMULINK program, 5) Analysis of result.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.1
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• pp.34-44
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• 1997

This study presents the recursive constraint bounding(RCB) method to reduce the cycle time in internal cylindrical plunge grinding process. This method can cope with process noise as well as modeling bias. The main features of RCB method are its utilization of measurements at the end of each cycle and its use of monotonicity analysis for determining the extremes of bias and noise. This method is investigated in simulation and evaluated by experiment in internal cylindrical plunge grinding operation. The results from simulation and experiment show that it is effective in reducing cycle time in spite of modeling uncertainty in the forms of process noise and modeling bias.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.559-563
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• 2005

The wafer positioning robot used in the semiconductor industry is required to operate at high speed for the improvement of productivity. However, the residual vibration produced by the high speed of the wafer positioning robot makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the optimization of the cycle time. The followings are the process for the reduction and the optimization; 1)System modeling of wafer positioning robot, 2)Verification of dynamic characteristic of wafer positioning robot, 3)Input shaping plan using impulse response reiteration, 4)Simulation test using simulink, 6)Analysis of result.