• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.11
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• pp.41-46
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• 2019

The purpose of this study is to examine and propose a high quality blade manufacturing method by applying ELID grinding technology to machining the tungsten carbide blade edge for MLCC sheet cutting. In this study, experiments are performed according to the abrasive type of grinding wheel, grinding method and grinding direction using the non-stop continuous dressing ELID grinding technology. By comparing and analyzing the chipping phenomena and surface roughness of both the blade grinding surface and the processed surface, a method for machining the tungsten carbide blade for cutting MLCC sheet is proposed. From the analysis of the surface roughness and chipping phenomena, it is confirmed that the use of diamond abrasive is advantageous for the blade machining. In addition, it succeeds in the machining of $6{\mu}m$ fine blade without any chipping, by using the grinding wheel #4000 with the diamond abrasive.

• Current Photovoltaic Research
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• v.11 no.1
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• pp.34-37
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• 2023

Solar energy had become the main energy industry of renewable energy along with hydroelectric power generation. One of the technologies that contributed to the popularization of photovoltaic power and the decrease in the unit price of photovoltaic modules was the large-area solar cell. However, as the area increased, the light receiving area increased and the current value increased accordingly. Since power loss occurs when the current value was large, the number of busbar was increased to increase the current collection rate, and a technology to lower the current value through half-cutting was developed. The bus bar of the solar cell served as a passage through which the generated current was transmitted. This was because when the number of busbar decreases, the moving distance of electrons increased, so the amount of power generation decreases and when it increases, shadows occured. An important aspect of the electrode design was the optimal balance of these busbars and number of fingers. Therefore, in this study, the characteristics of the solar cell according to the number of front bus bars of the large-area solar cell were simulated using Griddler 2,5 pro. After selecting the number of busbar with the best characteristics, the difference was compared by varying the number of fingers and a better direction for the number of cutting was presented.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.6
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• pp.486-491
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• 2000

The dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using neural network in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, five features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision, back-propagation neural network is adopted to classify the dicing process into normal and abnormal dicing, and normal and damaged blade. Experiments have been performed for GaAs semiconductor wafer in the case of normal/abnormal dicing and normal/damaged blade. Based upon observation of the experimental results, the proposed scheme shown has a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 6.5%.

• Journal of Korean Institute of Industrial Engineers
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• v.21 no.1
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• pp.51-65
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• 1995

This paper presents an automatic fixture planning system for machining processes of prismatic parts. A rationalized approach to integrate fixture planning with process planning is proposed and representation schemes for workpiece, part design information with features, machine tools, cutting tools and fixtures are developed. The proposed system implements two activities of fixture planning such as machining of reference surfaces and machining of features. For machining of reference surfaces, the machining sequence of reference surfaces is determined by using decision tables, which are drawn from relations of part dimension, degree of surface roughness, fixture type and its capacity, cutting tool's capacity and experienced planners' knowledge. For machining of features, a preferential machining orientation is selected for its feature which can be machined in more than one direction, and features with the same machining orientation are grouped, and the machining sequence of features is determined by interactive mode. A case study is performed to show the performance of the proposed system.

• Journal of Korean Institute of Industrial Engineers
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• v.9 no.2
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• pp.27-35
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• 1983

This paper describes a procedure of generating economic cutter-location(CL) data for the machining of sculptured surfaces on a multi-axis NC milling machine. Measures of economy are the machining time (cutter move distance) and the length of NC tape (number of CL data points). The presented procedure minimizes both the number of CL data and the total distance of cutter moves, for a given cutter (spherical end-mill) size and parameteric cutting direction, while satisfying given tolerance requirements. The procedure has been implemented in FORTRAN for a smooth composite Bezier surface. The maximum allowable cutter size is calculated by the program so that a user can choose a cutter size. CL data can be generated in both parametric directions u and v. Experimental results show that there are significant differences between the parametric directions, and that cutter size should be as large as possible in order to minimize the cutting time and NC tape length.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.729-732
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting condition. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In order to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber, breaker, and precision servo mechanism in order to dice an semiconductor wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1158-1161
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• 2003

For underwater milling of parts of nuclear reactor, a waterproof main spindle system was developed. which used a servo meter. Particularly, a waterproof system is available to cope with emergencies such as an electricity failure so that it prevents hazards from cutting radioactive materials. A developed spindle was designed to be capable of horizontal and vertical cutting and structural analysis was conducted with a FEM tool(Design Space) when the forces were loaded in each axis-direction.

• Journal of the Korean Society of Industry Convergence
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• v.4 no.4
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• pp.365-369
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• 2001

This paper presented a new model of virtualized CNC milling machine. The model verifies the over cut, the under cut and the surface roughness using NC file generated from CAM and cutting condition. The model uses Z-map model to verify workpiece. In this paper, the model used the velocities of x, y and z direction and obtained a center point of a hall end mill for modeling Z-map of workpiece. To investigate the performance of the model, simulation study was carried out. As the results, the model gave geometry accuracy of workpiece, the surface roughness and the chip loads in finish cutting that can predict tool chipping. The virtualized CNC machine can he used a flat end mill, a ball end mill and a rounded end mill.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.725-729
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• 2000

This paper presented a new model of NC verification in ball end milling. The model verifies the over cut the under cut and the surface roughness using NC file generated from CAM and cutting condition. The model uses Z-map model to verify workpiece. In this paper, the model used the velocities of x, y and z direction and obtained a center point of a ball end mill for modeling Z-map of workpiece. To investigate the performance of the model simulation study was carried out. As the results, the model gave geometry accuracy of workpiece, the surface roughness and the chip loads in finish cutting that can predict tool chipping.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.5
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• pp.70-75
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• 2000

After the patterning and probe process of wafer have been achieved, the dicing process is necessary to separate chips from a wafer. The dicing process cuts a wafer to lengthwise and crosswise direction to make many chips by using narrow circular rotating diamond blade. But inferior goods are made under the influence of complex dicing environment such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using feature extraction in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, two features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision. a threshold method is adopted to classify the dicing process into normal and abnormal dicing. Experiment have been performed for GaAs semiconductor wafer. Based upon observation of the experimental results, the proposed scheme shown a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 12.8%.