Journal of Institute of Control, Robotics and Systems (제어로봇시스템학회논문지)

Institute of Control, Robotics and Systems (제어로봇시스템학회)
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Monitoring of Wafer Dicing State by Using Back Propagation Algorithm

역전파 알고리즘을 이용한 웨이퍼의 다이싱 상태 모니터링

  • 고경용 (원광대학교 기계공학과) ;
  • 차영엽 (원광대학교 기계공학과) ;
  • 최범식 (원광대학교 기계공학과)
  • Published : 2000.06.01
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Abstract

The dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using neural network in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, five features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision, back-propagation neural network is adopted to classify the dicing process into normal and abnormal dicing, and normal and damaged blade. Experiments have been performed for GaAs semiconductor wafer in the case of normal/abnormal dicing and normal/damaged blade. Based upon observation of the experimental results, the proposed scheme shown has a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 6.5%.

Keywords

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