• Title/Summary/Keyword: Cure Catalyst

검색결과 58건 처리시간 0.026초

전하전이착체형 잠재성 촉매를 사용한 반도체 성형용 자소성 에폭시 수지 시스템의 경화 반응속도 연구 (Cure Kinetics of Self-Extinguishing Epoxy Resin Systems with Charge Transfer Complex Type Latent Catalyst for Semiconductor Encapsulation)

  • 김환건
    • 반도체디스플레이기술학회지
    • /
    • 제13권4호
    • /
    • pp.27-32
    • /
    • 2014
  • The cure properties of self-extinguishing epoxy resin systems with different charge transfer type latent catalysts were investigated, which are composed of YX4000H as a biphenyl epoxy resin, MEH-7800SS as a hardener, and charge transfer type latent catalysts. We designed and used five kinds of charge transfer type latent catalyst and compared to epoxy resin systems with Triphenylphosphine-Benzoquinone(TPP-BQ) as reference system. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The epoxy resin systems with Triphenylphosphine-Quinhydrone(TPP-QH), Triphenylphosphine-Benzanthrone(TPP-BT) and Triphenylphosphine-Anthrone(TPP-AT) as a charge transfer type latent catalyst showed a cure conversion rate of equal or higher rate than those with TPP-BQ. These systems with TPP-QH and Triphenylphosphine-Tetracyanoethylene(TPP-TCE) showed a critical cure reaction conversion of equal or higher conversion than those with TPP-BQ. The increases of cure conversion rates could be explained by the decrease of the activation energy of these epoxy resin systems. It can be considered that the increases of critical cure reaction conversion would be dependent on the crystallinity of the biphenyl epoxy resin systems.

고체 추진제 접착용 코팅제 조성 연구(I) (Study on Coating Agent Composition for Adhesion of Solid Propellant(I))

  • 정재윤;김경민;박정호;최성한
    • 한국추진공학회지
    • /
    • 제24권5호
    • /
    • pp.84-90
    • /
    • 2020
  • 본 논문은 이종추진제(1차 추진제/2차 추진제) 접착에 필요한 코팅제에 대해 기술하였다. 코팅제는 유기용매, 고분자 경화제, 경화촉매로 구성되어 있다. 경화촉매인 FeAA를 0.14 wt% 이상 적용한 코팅제는 2차 추진제 경화 직후 시험한 결과 접착계면이 아닌 추진제가 파단되는 결과를 확인하였으며, 0.10 wt% 이하에서는 접착계면이 파단되었다. 경화촉매는 2차 추진제 경화 직후 접착계면이 파단되는 결과를 확인하였다. 또한 TPB 경화촉매를 적용한 코팅제의 경우 시간이 경과함에 따라 1차 추진제와 2차 추진제간의 접착력이 증가하는 결과를 확인하였다.

이미다폴(2E4MZ-CN) 촉매 첨가에 의한 에폭시/폴리아미드/MPD 반응성 블렌드의 경화 반응, 형태학적 특징 및 접착력 향상 연구 (Characterizations of Adhesion Property, Morphology and Cure Reaction of Epoxy/Polyamide/MPD Reactive Blend with Imidazole(2E4MZ-CN) Catalyst)

  • 송현우;강학수;김원호;스테판말지;김병민;최영선
    • 폴리머
    • /
    • 제33권4호
    • /
    • pp.290-296
    • /
    • 2009
  • 본 연구에서는 에폭시(DGEBA)/폴리아미드/MPD/2E4MZ-CN 반응성 블렌드의 경화 촉진제 함량에 따른 블렌드계의 형태학적 특징 및 기계적 물성에 대해 고찰하였다. 본 블렌드계의 경화거동은 DSC, 기계적 강도는 UTM, 형태학적 특징 변화는 SEM을사용하여 관찰하였다. 이미다졸(2E4MZ-CN) 경화촉진제의 함량을 $0{\sim}3\;phr$까지 조절 하였으며, 경화 반응 온도는 $170^{\circ}C$에서 30분간 유지하였다. 경화 촉진제의 함량이 증가함에 따라 최대 발열 온도가 미세하게 감소하는 경향을 보였으며, 이는 에폭시와의 상용성이 우수한 폴리아미드에 의해 경화 반응이 거의 방해받지 않았음을 보여 준다. 폴리아미드 함량이 20 phr인 조건에서 에폭시 블렌드계는 co-continuous한 분산상을 보이며, 이 조건에서 경화 촉진제의 첨가에 의해 더욱 균일한 co-continuous한 분산상이 나타났다. 상압 플라즈마 표면처리에 의해 표면장력이 증가되어 집착력이 향상되었으며, 경화 촉진제의 함량이 2 phr에서 가장 우수한 집착력을 보여 20% 이상의 집착력 향상 효과가 있었다. 이것은 경화 촉진제에 의한 블렌드계의 형태학적 조절을 고려하면 구조용 접착제에서 보다 향상된 집착력과 연신율을 동시에 기대할 수 있음을 보여 준다.

Cationic Cure of Epoxy Resin by an Optimum Concentration of N-benzylpyrazinium Hexafluoroantimonate

  • Lee, Jong-Keun;Park, Yusong;Jae-Rock lee;Park, Jaekyeung
    • Macromolecular Research
    • /
    • 제10권1호
    • /
    • pp.34-39
    • /
    • 2002
  • Cure behavior of an epoxy resin was investigated at different cure temperatures (110, 120, 130, 140, and 150 $^{\circ}C$) and cure times in the presence of 2 wt% of an N-benzylpyrazinium hexafluoroantimonate (BPH) cationic catalyst by means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The glass transition temperature ( $T_{g}$) and chemical conversion (x) at the different temperatures were determined from DSC thermograms. The $T_{g}$ and x vs. In time data were superposed up to $T_{g}$ = 10$0^{\circ}C$ and x = 0.70 by shifting horizontally at a reference temperature of $T_{g}$ = 13$0^{\circ}C$. It is interesting that the $T_{g}$ and x of the superposed data increase rather slowly in the early stage of cure and rapidly thereafter. Therefore, the increase of the $T_{g}$ and x can be divided into two regions; $R_{I}$= -18.4(= $T_{go}$ ) ~5$^{\circ}C$ and $R_{II}$ = 5 ~ 10$0^{\circ}C$ in $T_{g}$, and $R_{I}$ : 0~0.24 and $R_{II}$ : 0.24~0.70 in x. The $R_{I}$ is closely related to the initiation reactions between BPH and epoxy and between hydroxy group and epoxy in this epoxy/catalyst system. From the kinetic analysis of the $T_{g}$-shift, activation energy was 12.5 kcal/mol. The relationship between $T_{g}$ and x was also considered. The gelation and vitrification times for different cure temperatures were obtained from DMA curves.urves. DMA curves.urves.

WLP(Wafer Level Package)적용을 위한 SEMC(Sheet Epoxy Molding Compounds)용 Naphthalene Type Epoxy 수지의 경화특성연구 (Cure Characteristics of Naphthalene Type Epoxy Resins for SEMC (Sheet Epoxy Molding Compound) for WLP (Wafer Level Package) Application)

  • 김환건
    • 반도체디스플레이기술학회지
    • /
    • 제19권1호
    • /
    • pp.29-35
    • /
    • 2020
  • The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

상아질 표면 처리에 의한 상아질과 복합레진의 결합에 관한 연구 (STUDIES ON THE BOND BETWEEN COMPOSITE RESIN AND DENTIN TREATED BY DENTIN BONDING AGENTS)

  • 윤동호;박상진
    • Restorative Dentistry and Endodontics
    • /
    • 제17권1호
    • /
    • pp.36-54
    • /
    • 1992
  • The purpose of this study was to compare the shear bond strengths to ground dentin surfaces of four dentinal bonding agents in 193 teeth. Various dentin surfaces treated with four dentin bonding agents were attached with two restorative composite resins. The effectiveness of the bonding were tested by the monitoring the shear bond strength. The shear bond strengths were measured after 2 hours and 24 hours after surface conditioning with four dentin bonding agents. Effects of EDTA, the additive illumination, and sealer treatments without primer on bond strength to dentin surfaces were assessed. In addition the effects of the thickness of specimens ranging from 0.65 mm to 1.95 mm and the ratio of catalyst and base paste on the bond strength of chemical cure composite resin were estimated. The shear bond strength was determined by testing specimens in the Instron universal testing machine (Model No. 1122) at a crosshead speed of 1.0 mm/min. Following condusions were drawn: 1. The highest mean shear bond strengths of chemical cure composite resin to dentin conditioning with dentin bonding agents aged 2 hours were obtained, and then that was decreased with time followed by EDTA treatment. 2. In light cure composite resin, the shear bond strength was increased following dentin conditioning with bonding agents with time, irradiation time and EDTA treatment except in SB group. 3. The thicker the composite resin specimen was, the less the shear bond strength in chemical cure composite resin was. 4. In light cure composite resin, there was a little change in shear bond strength following dentin conditioning with bonding agents. 5. In chemical cure composite resin, the shear bond strength was the highest in the ratio of 1/1 of catalyst and base part. 6. Without a dentin primer, shear bond strength to dentin conditioned only with UB sealer was the highest among four sealers in light cure composite resin.

  • PDF

Properties and Curing Behavior of Urea-Modified Phenolic Resins

  • Lee, Sang-Min;Park, Sang-Bum;Park, Jong-Young
    • 한국응용과학기술학회지
    • /
    • 제24권4호
    • /
    • pp.339-346
    • /
    • 2007
  • The influence of adding urea to phenol-formaldehyde (PF) resins as a co-polymer component were investigated aiming at synthesizing useful phenol-urea-formaldehyde resins. Urea was added at 10% by total resin weight. Several methods for the addition of urea to the PF resins during synthesizing resins to see the co-polymerization occurs between urea and PF resins. The urea was added at the beginning, at three different middle stages, and at the end of PF resin synthesis. The copolymerized methylene bridges between phenol and urea molecules were not observed by $^{13}C-NMR;$ no signal around 50ppm. The curing of urea-modified PF resins, evaluated by dynamic mechanical analysis(DMA), showed some differences among the resins. DMA gel times ranged from 2.75 min to 3.25 min and the resins made with earlier urea additions showed slightly shorter gel times. The longest cure time and gelation time was observed for the resin PFU. Catalyst effects on the DMA cure time values of resins were not significant with different amounts of catalyst or different types of catalyst for all resins tested. Gel times of urea-modified PF resins shortened the most by triacetin catalyst.

촉매를 이용한 저온경화 폴리이미드 박막의 광학적/열적 특성 변화 (Changes in the Optical and Thermal Properties of Low-Temperature Cured Polyimide Thin Films Using the Catalyst)

  • 박명순;김광인;남기호;한학수
    • 공업화학
    • /
    • 제24권3호
    • /
    • pp.320-326
    • /
    • 2013
  • 본 연구에서는 저온경화 공정으로 합성한 다양한 폴리이미드의 물성 변화를 이해하기 위하여 4,4'-oxydianiline (ODA) 단일 다이아민(diamine)에 여러 가지 주쇄(backbone)를 가지는 산무수물(dianhydride)들을 [4,4'-oxydiphthalicanhydride (ODPA), 4,4-hexafluoroisopropylidenediphthalic dianhydride (6FDA), 3,3', 4,4'-benzophenonetetracarboxylic dianhydride (BTDA)]사용하였다. 폴리아믹산(poly(amic acid); PAA)의 합성 후, 저온경화 촉매인 1,4-diazabicyclo[2.2.2]octane (DABCO)를 여러 wt%로 첨가하여 폴리이미드 박막을 제작하고 촉매를 넣지 않은 박막과 FT-IR, UV-Vis 투과도, DSC/TGA, WAXD 분석을 통해 그 특성 변화를 비교 분석하였다. 촉매를 이용한 폴리이미드의 저온경화 시 산무수물의 종류에 따라 광학특성 및 열특성 변화량의 차이가 나타났고, 이는 촉매에 의한 mean intermolecular distance의 감소량이 산무수물의 주쇄구조에 따라 다르기 때문으로 확인되었다. 1 wt%의 촉매를 사용 시 광학특성 증가는 최대가 되고 열특성 저하는 최소가 됨을 확인하였다. 이러한 실험결과를 통해 촉매를 이용한 저온경화 폴리이미드 박막의 특성변화는 그 화학구조와 밀접한 관련이 있음을 확인할 수 있다.

치환기 변화에 따른 열잠재성 양이온 촉매의 합성과 잠재특성 연구 (Synthesis and Latent Characteristics of Thermal Cationic Latent Catalysts by Change of Substituent)

  • 박수진;허건영;이재락;심상연;서동학
    • 폴리머
    • /
    • 제25권4호
    • /
    • pp.558-567
    • /
    • 2001
  • 피라진염의 치환기를 변화시킨 열잠재성 양이온 촉매를 합성하고, 이관능성 에폭시(diglycidylether of bisphenol-A, DGEBA)에 개시제로서 1 wt% 촉매를 혼합하여 동적 DSC방법을 이용한 경화 거동과 열잠재 특성에 대해 연구하였다. 그 결과 합성된 촉매들은 에폭시 시스템에서 우수한 열잠재성을 가지고 있음을 확인하였다. 치환기의 염기도(basicity)가 높을수록 경화온도와 활성화 에너지는 높아지고 활성은 낮아졌는데 이는 활성과 경화거동이 링 스트레인(ring strain) 및 도입된 치환기의 염기도(basicity)에 의해 조절되기 때문인 것으로 사료된다. 결론적으로, 전자공여 그룹인 메틸기를 도입한 촉매의 활성은 경화시 개시단계에서 염기도 증가로 인한 피라진의 이탈능과 벤질 양이온의 안정성이 감소되었기 때문에 낮아졌으며, 전자수용 그룹인 시아노기를 도입한 촉매의 활성은 유기효과와 공명에 인해서 벤질 양이온의 안정성이 증가됨으로써 높아졌다.

  • PDF