• 한국재료학회지
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• 제14권7호
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• pp.462-469
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• 2004

The effect of Cu addition on the corrosion characteristics of Zr alloys that developed for nuclear fuel cladding in KAERI (Korea Atomic Energy Research Institute) was evaluated. The alloys having different element of Nb, Sn, Fe, Cr and Cu were manufactured and the corrosion tests of the alloys were performed in static autoclave at $360^{\circ}C$, distilled water condition. The alloys were also examined for their microstructures using the optical microscope and the TEM equipped with EDS and the oxide property was characterized by using X-ray diffraction. From the result of corrosion test more than 450 days, the corrosion rate of the Zr-based alloys was changed with alloying element such as Nb, Sn, Fe, Cr and especially affected by Cu addition. The corrosion resistance was increased with increasing the Cu content and the tetragonal $ZrO_2$ layer was more stabilized on the Cu-containing alloys.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.91-97
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• 2014

본 연구에서는 고속 전단시험의 변형속도를 500 mm/s로 설정한 상태에서 Sn-Ag-Cu계(Sn-1.0wt.%Ag-0.5Cu 및 Sn-4.0Ag-0.5Cu)뿐만이 아니라 4종의 4원계 Sn-Ag-Cu-In 조성(Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, Sn-1.2Ag-0.7Cu-0.4In)을 포함하는 무연 솔더 접합부의 솔더링 직후 및 시효 시간에 따른 파면 생성결과, 접합강도 및 접합부 파괴에너지값의 변화를 측정, 비교해 보았다. 그 결과, 리플로우 솔더링 직후 및 $125^{\circ}C$에서의 500 시간 시효까지 주로 연성 파괴모드 및 준연성 파괴모드가 관찰되었으며, 준연성 파괴모드의 발생 빈도를 분석할 때 고속 전단조건에서 상용 무연 솔더 조성인 Sn-3.0Ag-0.5Cu 이상의 연성파괴 특성을 나타내는 것으로 파악되었다. 또한 4원계 무연 솔더 조인트는 평균적으로 Sn-Ag-Cu계 조성 수준의 파단에너지값을 나타내었는데, 약 100 시간의 시효 후 최고의 파단에너지값이 관찰되었으나 500 시간의 시효 후에는 파단에너지값의 확연한 감소가 관찰되어 500 시간의 시효시점부터 솔더 접합 계면부의 신뢰성 감소가 가속화되는 경향을 관찰할 수 있었다.

• 열처리공학회지
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• 제17권1호
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• pp.2-9
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• 2004

This study has examined the metallurgical microstructures and alloy compositions of 3 bronze artifacts, a vessel, a spoon and a chopstick, manufactured in the Koryo Dynasty. The results show that they were made from Cu-Sn alloys whose Sn content ranges from 22 to 24% by weight. It is of significant importance to find that they were all given special thermo-mechanical treatments during their manufacturing. It has been found that the Koryo bronze workers were well aware of the mechanical properties of ${\alpha}$, ${\beta}$, ${\gamma}$ and ${\delta}$ phases that appear in the Cu-Sn alloys. Knowing how to promote or suppress the formation of each phase, they were able to find proper alloy compositions and temperatures for the high Sn alloys to be successfully forged. The present study will detail the Koryo bronze technology as estimated from the microstructures of the 3 bronze artifacts. The results of the reproduction experiments with Cu-24%Sn will also be presented to explain how the microstructures develop and to estimate the mechanical properties of each phase.

• Journal of the Korean Physical Society
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• 제73권9호
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• pp.1370-1376
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• 2018

The electronic structures, magnetic properties and half-metallicity in $Zr_2RuZ$ (Z = Ga, In, Tl, Ge, Sn, and Pb) alloys with $AlCu_2Mn-$ and $CuHg_2Ti$-type structures were investigated using first-principles density functional theory (DFT) calculations. The calculations showed that $Zr_2RuIn$, $Zr_2RuTl$, $Zr_2RuSn$, and $Zr_2RuPb$ compounds with $CuHg_2Ti$-type structures were half-metallic ferromagnets with half-metallic band gaps of 0.18, 0.24, 0.22, and 0.27 eV, respectively. The half-metallicity originated from d-d and covalent hybridizations between the transition metals Zr and Ru. The total magnetic moments of the $Zr_2RuZ$ (Z = In, Tl, Sn, and Pb) compounds with $CuHg_2Ti$-type structures were integer values of $1{\mu}B$ and $2{\mu}B$, which is in agreement with Slater-Pauling rule ($M_{tot}=Z_{tot}-18$). Among these compounds, $Zr_2RuIn$ and $Zr_2RuTl$ were half-metals over relatively wide regions of the lattice constants, indicating that these two new Heusler alloys are ideal candidates for use in spintronic devices.

• 한국재료학회지
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• 제31권12호
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• pp.690-696
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• 2021

The purpose of this study is to develop a zirconium-based alloy with low modulus and magnetic susceptibility to prevent the stress-shielding effect and the generation of artifacts. Zr-7Cu-xSn (x = 1, 5, 10, 15 mass%) alloys are prepared by an arc melting process. Microstructure characterization is performed by microscopy and X-ray diffraction. Mechanical properties are evaluated using micro Vickers hardness and compression test. The magnetic susceptibility is evaluated using a SQUID-VSM. The average magnetic susceptibility value of the Zr-7Cu-xSn alloy is 1.176 × 10^-8 cm³g^-1. Corrosion tests of zirconium-based alloys are conducted through polarization test. The average Icorr value of the Zr-7Cu-xSn alloy is 0.1912 ㎂/cm². The elastic modulus value of 14 ~ 18 GPa of the zirconium-based alloy is very similar to the elastic modulus value of 15 ~ 30 GPa of the human bone. Consequently, the Sn added zirconium alloy, Zr-7Cu-xSn, is very interesting and attractive as a biomaterial that reduces the stress-shielding effect caused by differences of elastic modulus between human bone and metallic implants. In addition, this material has the potential to be used in metallic dental implants to effectively eliminate artifacts in MRI images due to low magnetic susceptibility.

• Journal of Welding and Joining
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• 제25권3호
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• 한국결정성장학회지
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• 제28권3호
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• pp.130-134
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• 2018

솔더(solder) 재료는 수 천년 이상 인류 문명과 함께해온 대표적인 금속 합금으로서 현재까지도 전자 패키징(electronic packaging) 및 표면 실장(SMT, surface mount technology) 분야의 핵심 소재로 사용되고 있다 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu(weight%) 조성의 무연납 솔더바 샘플을 주조법으로 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 샘플에 대한 결정구조, 화학조성 및 미세구조를 XRD, XRF, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 조사하였다. 분석결과, 제조된 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ 및 ${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었을 확인할 수 있었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.83-85
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• 2003

This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.169-171
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• 2006

Solderability and reaction properties were investigated for four Pb-free alloys as a function of Ag contents; Sn-4.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, Sn-2.5Ag-0.5Cu, and Sn-1.0Ag-0.5Cu. The alloy of the lowest Ag content, i.e., Sn-1.0Ag-0.5Cu, showed poor wetting properties as the reaction temperature decreased to 230oC. Variation of Ag concentration in the Sn-xAg-0.5Cu alloy shifted exothermic peaks indicating the undercooling temperature in DSC curve. For the aging process at 170oC, the thickness of IMCs at the board-side solder/Cu interface increased with the Ag concentration.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.39-43
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• 2002

48 $\mu$BGA 패키지에 Sn-37Pb 공정 솔더와 Sn-0.7Cu, Sn-3.5 Ag, Sn-2.0Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi 4종류의 무연 솔더를 적용하여, 미세 솔더 볼의 경도와 조성에 따른 솔더 접합부의 전단강도에 대해서 연구하였다. 실험 결과, 솔더 볼의 짖눌림은 Sn-2.0Ag-0.7Cu-3.0Bi에서 0.043mm로 큰 경도값을 얻었다. 또한 전단 강도 값은 무연 솔더가 Sn-37Pb 솔더보다 높았으며, Sn-2.0Ag-0.7Cu-3.0 Bi에서 최대 52% 높은 값을 나타내었다.