• Resources Recycling
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• v.4 no.3
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• pp.26-31
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• 1995

The leaching characteristics of manganese nodules were investigated in dilute hydrochloric acid solution using copper malie as a reductant. Thc capper matte has been found to be an effective reductant for exhacting morc than 96% of Mn, 95% of Ni, 91% of Ca, 88% of Cu and 36% of Fe when leached in 2.5 M HCI at 70$^{\circ}$C for 2hr. The dissolutions of Mu, Co, and Ni depend on thc amaunt of added cappcr matte. 7he ratin of liquid and solid is an important [actor on the extraction of metals during leaching The dissolution af Mn, Co, Ni and Cu incrcascd w~th the increase in temperalure of leachant. The leaching rates of Mn, Co, NI and Cu from manganese nodule m the presznce of copper matte is limited by bath thc surface chemical reaction and pare diffusion processes. Thc activation energies far Mn. Co: Ni and Cu were 17. 61, 12.8, 17.2 and 57.88 KcaUmol, rcspcctively.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.15-20
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• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.

• Journal of the Korean Society for Marine Environment & Energy
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• v.19 no.3
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• pp.203-210
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• 2016

In this study, nine heavy metals were analyzed in seaweeds collected from market and laver culture farm of Korea and a food safety assessment were also carried out for these heavy metals. The level of heavy metal concentrations in seaweeds was in the following order: Fe>As>Zn>Cu>Cd>Pb>Cr>Ni>Hg. Except for zinc and cadmium, seven heavy metals were significantly higher in cultured laver than in processed laver. Significant correlation was observed Cr-Fe in cultured laver and Cu-Zn, Cd-Cu, Cd-Zn and Pb-Ni in processed laver and Cu-Cr, Cu-Zn, Cd-Cr and Ni-Fe in sea tangle and Zn-Fe, Cr-Fe, Cr-Zn, Cd-Ni, Cu-Cd and Cu-Pb in processed sea mustard. Considering differences in heavy metal concentration between processed laver and cultured laver and in correlation among heavy metals, removal efficiency of heavy metals may be attributed to seaweed treatment process. The average weekly intakes of Cu, Cd, Zn, Fe and Hg via seaweeds consumption were about 0.1~7.6% of PTWI (Provisional Tolerable Weekly Intakes). Therefore, it was found that heavy metals in the seaweeds were very safe for consumption.

• Progress in Superconductivity
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• v.7 no.2
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• pp.145-151
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• 2006

Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.841-842
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• 2013

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.86.1-86.1
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• 2007

• Journal of the Korean Ceramic Society
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• v.36 no.11
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• pp.1235-1242
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• 1999

• Korean Journal of Materials Research
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• v.23 no.7
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• pp.385-391
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• 2013

The influence of Cu and Ni on the ductile-brittle transition behavior of metastable austenitic Fe-18Cr-10Mn-N alloys with N contents below 0.5 wt.% was investigated in terms of austenite stability and microstructure. All the metastable austenitic Fe-18Cr-10Mn-N alloys exhibited a ductile-brittle transition behavior by unusual low-temperature brittle fracture, irrespective of Cu and/or Ni addition, and deformation-induced martensitic transformation occasionally occurred during Charpy impact testing at lower temperatures due to reduced austenite stability resulting from insufficient N content. The formation of deformation-induced martensite substantially increased the ductile-brittle transition temperature(DBTT) by deteriorating low-temperature toughness because the martensite was more brittle than the parent austenite phase beyond the energy absorbed during transformation, and its volume fraction was too small. On the other hand, the Cu addition to the metastable austenitic Fe-18Cr-10Mn-N alloy increased DBTT because the presence of ${\delta}$-ferrite had a negative effect on low-temperature toughness. However, the combined addition of Cu and Ni to the metastable austenitic Fe-18Cr-10Mn-N alloy decreased DBTT, compared to the sole addtion of Ni or Cu. This could be explained by the fact that the combined addition of Cu and Ni largely enhanced austenite stability, and suppressed the formation of deformation-induced martensite and ${\delta}$-ferrite in conjunction with the beneficial effect of Cu which may increase stacking fault energy, so that it allows cross-slip to occur and thus reduces the planarity of the deformation mechanism.

• Journal of the Korean Ceramic Society
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• v.16 no.4
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• pp.225-236
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• 1979

The effect of $Ti^{+4}$ addition on the sinterability, microstructure, and temperature dependence of electromechanical coupling factor of magnetostrictive Ni-Cu-Co ferrite was investigated. The density of Ni-Cu-Co ferrite slightly increased by 2.0 mole % addition of either $TiO_2$ or $Fe_2TiO_4$, but tended to decrease by more than 2.0 mole % addition of $TiO_2$ or $Fe_2TiO_4$. As the content of either $TiO_2$ or $Fe_2TiO_4$ increased, the magnetocrystalline anisotropy compensation temperature also increased. Microstructure studies showed the stable grains when Ni-Cu-Co ferrite was sintered above 1, 20$0^{\circ}C$.

• Journal of Welding and Joining
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• v.14 no.1
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• pp.47-56
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• 1996

The purpose of this study is to develope an insert metal which can be brazed at lower temperature than the conventionally used insert metal and provide higher strength joint than base metal. In the review of binary phase diagram concerning Ti, Cu and Ni resulted in the discovery of Si having eutectic composition with them. The microstructure and the distribution of elements in reaction zone between CP Ti and insert metal were investigated by Optical Microscopy, SEM/EDX, EPMA, X-RAY. The newly developed insert metal is Ti-15wt%Cu-18wt%Ni-2wt%Si, which can yield the lower brazing temperature(1183K) compared with the conventional Ti-Cu-Ni system insert metal. The joints with this insert metal had tensile strength of 385MPa in the bonding temperature range of 1183K to 1243K.