• Journal of the Korean Wood Science and Technology
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• v.31 no.4
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• pp.38-43
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• 2003

This is the second in a series of reports on the evaluation of weathering durability of waterborne preservative treated wood by accelerated weathering. The leaching of copper from ACQ-, CCA-, and CuAz-treated samples during weathering was increased by UV irradiation, when compared between full weathering and water-only weathering. The FTIR spectra of the weathered ACQ-, CCA, CuAz-treated samples at 1731 cm^-1, 1625 cm^-1, 1510 cm^-1, which are related to the fixation of copper, were different from those of unweathered controls. This result means that UV irradiation can weaken the chemical bond between lignin and copper and/or extraction of lignin-copper complex can be occured when lignin erode away by weathering.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.4
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• pp.180-184
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• 2020

The crystallographic texture plays an important role in both the plastic deformation and the macroscopic anisotropy of magnesium alloys. In previous study for AZ80 magnesium alloy, it was found that the main texture components of the textures vary with the deformation conditions at high temperatures. Also, the basal texture was formed at stress of more than 15-20 MPa and the non-basal texture was formed at stress of less than 15-20 MPa. Therefore, in this study, uniaxial compression deformation of AZ80 magnesium alloy was carried out at high temperature (stress of 15-20 MPa). The uniaxial compression deformation is performed at temperature of 723 K and strain rate 3.0 × 10^-3s^-1, with a strain range of between -0.4 and -1.3. Texture measurement was carried out on the compression planes by the Schulz reflection method using nickel filtered Cu Kα radiation. EBSD measurement was also conducted in order to observe spatial distribution of orientation. As a result of high temperature deformation, the main component of texture and its development vary depending on deformation condition of this study.

• Journal of the Korean Wood Science and Technology
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• v.36 no.1
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• pp.110-123
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• 2008

The use of CCA as a wood preservative was recently inhibited due to its environmental pollution and human harmfulness. Instead of CCA, copper azole (CuAz) and alkaline copper quaternary (ACQ) have been used as alternative wood preservatives, but the price of the preservatives is much more expensive than that of CCA. As a substitute for high-priced CuAz and ACQ, environmentally friendly wood preservatives were formulated with okara, which is an organic waste from the production of tofu. Prior to formulating the preservatives, okara was hydrolyzed by three levels of sulfuric acid concentration (1, 2.5 and 5%) to easily penetrate the effective components of the preservatives into wood blocks. Final preservative solutions were formulated with the hydrolyzed okara and metal salts, such as copper sulfate, copper chloride and borax. The preservatives were treated into wood blocks by vacuum-pressure method to measure the treatability of the preservatives, and the treated wood blocks were placed in hot water for three days to measure the leachability of the preservatives. The effective components of the preservatives might be successfully penetrated into wood blocks through the uses of hydrolyzed okara and ammonia water. However, the leached amount of effective components was increased as the concentration of acid used for the hydrolysis of okara increased. The treatability and leachability of the preservatives were not affected by hydrolysis temperature but negatively affected by the addition of borax. Based on the results above, the optimal conditions for formulating okara-based wood preservatives cost-effectively and environmentally might be 1% acid hydrolysis of okara and the use of $CuCl_2$ as a metal salt. In addition, the treatability and leachability of okara-based wood preservatives were superior or no differences comparing with those of CuAz. Therefore, it is concluded that okara-based wood preservatives might have a potential to be used as an environmentally friendly wood preservative.

• Journal of the Korean Wood Science and Technology
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• v.39 no.4
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• pp.344-350
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• 2011

In this study, LVLs of radiata pine were fabricated with non-preservative treated veneers, CuAz treated veneers, and ACQ treated veneers, using aqueous vinyl urethane adhesive and phenol modified resorcinol resin adhesive. Then density gradient, bonding strength, bending properties and decay resistance of LVLs were evaluated. As results, the cone-shaped and higher density gradient pattern was found in layer close to glueline. After cyclic water boiled test, the LVL bonded with aqueous vinyl urethane resin adhesive was delaminated in all layers or partly delaminated including check, chasm in glueline layer. In the case of LVL bonded with phenol modified resorcinol resin adhesive, despite slight cupping due to great glueline stress and vertical check between glueline layers, it was observed that the bonding strength to delamination was higher, owing to most absence of delamination through overall glueline. On the other hand, in the decay test, mass loss by brown rot fungi was greater than white rot fungi in LVL bonded with aqueous vinyl urethane resin adhesive. However, in LVL bonded with phenol modified resorcinol resin adhesive, the mass loss by brown rot fungi was slight and non-preservative treated LVL was low. The mass loss of preservative-treated LVL was 0 (zero), showing the high decay resistance effect.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.511-521
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• 2000

Investigation was carried out lean burn de-NOx properties of Pt-$TiO_2$ bifunctional catalyst by propylene in order to get the high de-NOx activity and the wide temperature window under coexistence of $SO_2$ and $H_2O$. Only noncatalyst and carrier catalyst themselves had NOx conversion activity at high temperature over $400^{\circ}C$. NOx conversion activity of catalysts exchanged copper ion resulted in Cu-$TiO_2$>Cu-ZSM-5>Cu-$Al_2O_3$>CU-YZ>Cu-AZ. Catalysts impregnated with platinum based on titania gave the results of high NOx conversion activity at low temperature. $250^{\circ}C$. Bifunctional catalysts based on Pt-$TiO_2$ showed high NOx conversion activity both at a low zone of $300^{\circ}C$ and a high zone of $500^{\circ}C$. Pt-$TiO_2$/$Al_2O_3$ catalyst gave the highest NOx conversion activity at a low temperature zone. and Pt-$TiO_2$/$Mn_2O_3$(21) catalyst gave the highest NOx conversion activity at a high temperature zone. Under the coexistence of $SO_2$ and $H_2O$. NOx conversion activities of 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst was high both at a low and high temperature zone, and increased depending on oxygen concentration. 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst showed the best correlation between de-NOx activities and the propyl ere conversion rates to CO on the log function.

• Journal of the Korean Wood Science and Technology
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• v.43 no.6
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• pp.804-809
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• 2015

Since Korea is home to Reticulitermes speratus, a kind of subterranean termites that prefer dark and humid conditions, there have been increasing damages to wooden structures by termites. One noticeable attribute of Korean subterranean termites is that they prefer than Pinus densiflora, the major construction material for Korean traditional houses. And because wide varieties of termites are distributed all over the world, it is not so easy to choose appropriate control methods depending on specific areas. This necessitates careful applications of the following control methods depending on the kinds of termites: fumigation treatment, soil termiticide, preservatives and insect treatment, termite colony elimination system, chemical treatment, and other physical and biological treatment methods. The purpose of this study is to investigate the control effects of environmentally-friendly Alkaline copper quaternary (ACQ), Copper Azole (CuAZ) and Micronized copper quarter (MCQ) on the termites contributing to the damage of wooden structures. It was found in this study that wood with preservative treatment produced a significantly higher termicidal efficacy than untreated wood.

• Journal of the Korean Wood Science and Technology
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• v.40 no.3
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• pp.212-227
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• 2012

Current research trends in wood preservatives for enhancing durability was reviewed. Due to leaching of recent Copper-Based Preservatives commonly used as chemicals for pressure treatment; they have been a growing concern, especially in improving the fixation of the copper as alkyl ammonium quat. and azol in wood and preventing the leaching of active ingredients. With the appearance of emulsion type chemicals using micronized and nano-sized wood preservatives, researchs on characteristics of Copper-Based Preservatives regarding penetration and fixation in wood are debatable. Moreover, unlike the case of CCA, the recent alkyl ammonium quat. and azol bear a serious threat in the decrease of antimicrobial effectiveness against wood destroying fungi with copper tolerance. Therefore, development and research of co-biocide is needed.

• Korean Journal of Metals and Materials
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• v.46 no.1
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• pp.13-19
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• 2008

To develop a recycling process of magnesium alloy scrap, a fundamental study on the distillation of magnesium alloy melt was carried out. Melt temperature, vacuum degree and reaction time were considered as experimental variables. The amount of vaporized magnesium melt per unit surface area of melt increases with the increase of melt temperature, reaction time and vacuum degree. The vapor condensed at the tip of water cooling Cu-condenser as a form of pine cone. Magnesium and zinc were vaporized easily from the melt. However, It's difficult to separate magnesium and zinc by vacuum distillation because vapor pressure of zinc is similar to one of magnesium. The contents of aluminum, manganese and iron, etc. in residual melt increase due to the decrease of magnesium and zinc content after the distillation of magnesium alloy.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.