• Analytical Science and Technology
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• v.14 no.6
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• pp.530-534
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• 2001

Effect of stripping solutions on the Duolite GT-73 chelating resin for ten elements, Ag(I), Al(III), Ca(II), Cd(II), Cu(II), Fe(II), Hg(II), Mn(II), Pb(II), and Zn(II), was investigated. Relation between affinities of the metal ions and solubility products of metal sulfides was studied. The smaller the solubility product of metal sulfideis, the larger the affinitie with the ionsis. The ions which have the solubility products larger than $10^{-23}$ could be effectively desorbed with nitric acid. Complexation with chloride ion enhanced the desorption efficiencies of the ions having moderately strong affinity with the resin. The ions which have very strong affinity by the chelating resin can be desorbed by complextion with thiourea and hydrochloric acid.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.57-57
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• 1998

최근 건식도금 분야에 있어서 경제성의 확보를 위해 고속 증착에 관한 연구가 활발히 진행 중에 있다. 이러한 고속 증착의 방법으로서는 high current arc, laser arc, hollow cathode discharge 및 magnetron sputtering법 등이 대두되고 있다. 특히 이중 magnetron sputtering 법은 고밀도의 박막을 고속으로 증착활 수 있는 장점으로 인해 고속 증착의 효과적인 방법으로 크게 대두되고 있다. 이러한 magnetron sputtering 법을 이용한 고속 증착에 관한 연구는 Cu, Ag와 같은 순수 금속 박막의 경우 $1~3\mu\textrm{m}/min$의 증착율까지 확보한 연구결과가 이미 발표되 고 있다. 그러나 이러한 고속 증착에 관한 연구들은 순금속 박막의 증착에 한정되어 있고 화합물 박막의 고속 증착에 관한 연구결과는 거의 전무한 결과이다. 따라서 본 연구에서는 magnetron sputtering 법을 이용하여 Ti계와 Cr계의 화합물 박막을 고속으로 증착하였다. 포한 박막의 증착율 및 특성 분석을 위혜 a-step, XRD 및 SEM을 이용하였다. 본 연구의 결과 $0.25~0.38\mu\textrm{m}/min$. 증착율을 확보하였으며 XRD 분석을 통하여 화합물 박막의 합성여부를 확인하였고, 박막의 미소 경도값도 2300~2500HK의 값을 얻었다.

• Journal of Welding and Joining
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• v.23 no.5
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• pp.49-54
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• 2005

The effective charge number and the critical current density of electromigration in eutetic SnPb and Pb Free $(SnAg_{3.8}Cu_{0.7)$ flip chip solder bumps are studied. The effective charge number of electromigration in eutectic SnPb solder is obtained as 34 and the critical current density is $j=0.169{\times}({\delta}_{\sigma}/{\delta}_x})\;A/cm^2,\;where\;({\delta}_{\sigma}/{\delta}_x})$ is the electromigration-induced compressive stress gradient along the length of the line. While the effect of electromigration in Pb free solder is much smaller than that in eutectic SnPb, the product of diffusivity and effective charge number $DZ^{\ast}$ has been assumed as $6.62{\times}10^{-11}$. The critical length for electromigration are also discussed.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Laser Solutions
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• v.5 no.2
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• pp.31-38
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• 2002

This paper describes the process of nanoparticle synthesis by laser ablation of consolidated microparticles. We have generated nanoparticles by high-power pulsed laser ablation of Al, Cu and Ag microparticles using a Q-switched Nd:YAG laser (wavelength 355 nm, FWHM 5 ㎱, fluence 0.8∼2.0 J/㎠). Microparticles of mean diameter 18∼80 ㎛ are ablated in the ambient air The generated nanoparticles are collected on a glass substrate and the size distribution and morphology are examined using a scanning electron microscope and a transmission electron microscope. The effect of laser fluence and collector position on the distribution of particle size is investigated. The dynamics of ablation plume and shock wave is analyzed by monitoring the photoacoustic probe-beam deflection signal. Nanosecond time-resolved images of the ablation process are also obtained by laser flash shadowgraphy. Based on the experimental results, discussions are made on the dynamics of ablation plume.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.287-294
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• 2005

전자 패키지가 열을 받을 때 회로기판과 칩의 열팽창계수 차이에 의해 발생되는 응력은 솔더 조인트의 파손에 영향을 미친다. 본 연구에서는 이 영향을 정량적으로 규명하기 위하여 열충격시험기를 이용해 얻어진 솔더조인트의 전기저항 변화와 수명과의 상관관계를 규명하였고, BGA 솔더조인트의 수명을 정량적으로 도출하였다. 또한 Sn-3.5Ag-0.5Cu 무연솔더와 63Sn-37Pb 유연솔더를 위의 실험에 동시에 적용시켜 건전성을 FORM(first-order reliability method)과 Weibull Function Model을 이용해 비교하였다.

• Economic and Environmental Geology
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• v.42 no.5
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• pp.445-455
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• 2009

Microbiological sulfate reduction is the transformation of sulfate to sulfide catalyzed by the activity of sulfate-reducing bacteria using sulfate as an electron acceptor. Low solubility of metal sulfides leads to precipitation of the sulfides in solution. The effects of microbiological sulfate reduction on in-situ precipitation of arsenic and copper were investigated for the heavy metal-contaminated soil around the Songcheon Au-Ag mine site. Total concentrations of As, Cu, and Pb were 1,311 mg/kg, 146 mg/kg, and 294 mg/kg, respectively, after aqua regia digestion. In batch-type experiments, indigenous sulfate-reducing bacteria rapidly decreased sulfate concentration and redox potential and led to substantial removal of dissolved As and Cu from solution. Optimal concentrations of carbon source and sulfate for effective microbial sulfate reduction were 0.2~0.5% (w/v) and 100~200 mg/L, respectively. More than 98% of injected As and Cu were removed in the effluents from both microbial and chemical columns designed for metal sulfides to be precipitated. However, after the injection of oxygen-rich solution, the microbial column showed the enhanced long-term stability of in-situ precipitated metals when compared with the chemical column which showed immediate increase in dissolved As and Cu due to oxidative dissolution of the sulfides. Black precipitates formed in the microbial column during the experiments and were identified as iron sulfide and copper sulfide. Arsenic was observed to be adsorbed on surface of iron sulfide precipitate.

• Journal of the Mineralogical Society of Korea
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• v.27 no.1
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• pp.31-40
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• 2014

In present study, we geochemically investigated the fresh coal ashes and the saline ash pond of an electric power plant in Korea, which burns imported bituminous coals. The goals are to see the chemical changes of the ash pond by reaction with coal ashes and to investigate the relative leachability of elements from the ashes by reaction with saline waters. For this study, one fresh fly ash, one fresh bottom ash, and 7 water samples were collected. All the ash samples and 2 water samples were analyzed for 55 elements. The results indicated that the fly ashes are enriched with chalcophilic elements such as Cu, Zn, Ga, Ge, Se, Cd, Sb, Au, Pb, and B relative to other elements. On the other hand, concentrations of As, Ba, Co, Ga, Li, Mn, Mo, Sb, U, V, W, and Zr are much higher in the ash pond than those dissolved in the seawater. Ag, Bi, Li, Mo, Rb, Sb, Sc, Se, Sn, Sr, and W show high ratios of elemental concentrations in pond water to those in the fly ash. Our results imply that the leaching of trace elements is regulated by geochemical controls such as solubility and adsorption even though the trace elements are relatively enriched on the ash surfaces after the coal combustion due to their volatilities.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Korean Journal of Soil Science and Fertilizer
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• v.21 no.2
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• pp.129-134
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• 1988

Enzymatical properties of Streptomyces sp. S-45 producing chitinase and ${\beta}$-1.3-glucanase isolated from soil were investigated. Chitinase activity was 3.01(U/ml) and ${\beta}$-1.3-glucanase activity was 2.49(U/ml). The optimum medium for mycolytic enzyme production of strain was composed of 0.7% colloidal chitin, 0.3% glucose, 0.5% asparagine, 0.2% peptone, 0.01% NaCl, 0.01% $K_2HPO_4$ and 0.01% $MgSO_4{\cdot}7H_2O$ in intial pH 7.0. The optimal condition for mycolytic enzyme activities were: pH 6.5-7.0, $45-50^{\circ}C$. Enzyme activities were activated by metal ion as $10^{-2}M\;Co^{{+}{+}}$, $Cu^{{+}{+}}$, $Mn^{{+}{+}}$, $Al^{{+}{+}{+}}$ and $10^{-3}M\;Sn^{{+}{+}}$ but $Ag^{{+}{+}}$, $Hg^{{+}{+}}$ inhibited.