• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 춘계학술발표회 초록집
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• pp.96-97
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• 2003

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.72-72
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• 2005

• 한국결정학회지
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• 제16권2호
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• pp.107-127
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• 2005

Five Cu(II) compounds were obtained from different copper salts with btp ligands, and their structures were determined by X-ray crystallography. The structure of coordination polymer 2 contains btp-bridged tetranuclear Cu(II) units weakly connected by nitrate ions, and the structure of a discrete Cu(II) molecule 1 contains acetates and btp ligands. With perchlorate anions, two btp ligands bridge Cu(II) ions to form a double zigzag chain 3, while a single zigzag chain 4 is created with sulfate anions. The reaction of $Cu(NO_{3})_{2}$ containing $NH_{4}PF_{6}$ with btp ligands also produced a polymeric compound 5 containing $Cu(H_{2}O)_{2}^{2+}$ and $Cu(NO_{3})_{2}$ units alternatively bridged by btp ligands with H-bonds between copper bonded water and nitrate oxygen atoms. Five Zn(II) compounds were obtained from different zinc salts with btp ligands, and the structures of polymeric compounds (6, 7 and 8) and monomeric compounds (9 and 10) were determined by X-ray crystallography. With nitrate, chloride and bromide anions, btp ligands bridge Zn(II) ions to form polymeric compounds (6, 7 and 8), but btp ligands coordinate to a Zn(II) ion to form monomeric complexes (9 and 10) with $PF_{6}^{-}$ and perchlorate anions. Four silver salts and btp ligands produced two kinds of structures, dinuclear 20-membered rings and one-dimensional zigzag chain depending on different anions. For $ClO_{4}^{-}$ and OTf anions, weak interactions between Ag(I) and anions make dinuclear 20-membered rings construct polymeric compounds (11 and 13). For $PF_{6}^{-}$ anion, there are also weak interactions between Ag(I) and $F(PF_{6}^{-})(12)$, but they do not construct a polymeric compound. For $O_{2}CCF_{3}^{-}$ anion, btp ligands bridge Ag(I) atoms to make one-dimensional zigzag chain (14), and there are also interactions between Ag(I) and anions.

• 한국표면공학회지
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• 제42권1호
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• 한국주조공학회지
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• 제17권3호
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• 대한화학회지
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• 제37권10호
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• pp.888-894
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• 1993

아세토니트릴 용액 중에서 copper-1-(2-pyridylazo)-2-naphthol(Cu-PAN) 착물의 전기화학적 성질을 순환 전압전류법, 직류 폴라로그래프법, 정전위 전기분해법 및 UV-Vis 분광광도법으로 조사하였다. 아세토니트릴 용액 중에서 Cu-PAN 착물은 3개의 환원파를 보였다. 환원파의 환원전위는 각각 -1.27 V, -1.64 V 와 -2.08 V vs. Ag/AgNO$_3$(AN)였다. 각 환원단계에 관여하는 전자수는 일정전위 전기분해법으로 구하였으며, 전기분해한 전해 생성물의 UV-Vis Spectrum으로부터 전해 생성물을 확인하였다. 이상의 실험 결과로부터 아세토니트릴 용액 중에서 Cu-PAN 착물의 환원 반응기구를 제안하였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권4호
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• pp.209-212
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• 2006

The electromagnetic effect observed in a BiSrCaCuO superconductor was studied. The electromagnetic properties of a $Ag_2O$ doped BiSrCaCuO superconductor and an undoped superconductor were evaluated to investigate the contribution of the pinning effect. It was confirmed experimentally that a large amount of magnetic flux was trapped in the $Ag_2O$ doped BiSrCaCuO than that in the undoped one, indicating that the pinning centers of magnetic flux are related closely to the occurrence mechanism of magnetic phenomena. It was considered that by adding $Ag_2O$, the area where normal conduction takes place increases and the magnetic flux penetrating through the sample increases. It also was considered that $Ag_2O$ acts to increase pinning centers of magnetic flux.

• Journal of Welding and Joining
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• 제32권1호
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.23-30
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• 2004

무연솔더 $Sn0.7wt{\%}Cu,\;Sn3.8wt{\%}Ag0.7wt{\%}Cu$ 솔더와 Pt층의 시효처리에 따른 계면반응에 대한 연구를 수행하였다. $250^{\circ}C$에서 30 초간 리플로한 $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$시편과, $260^{\circ}C$에서 30초간 리플로한 $Sn0.7wt{\%}Cu/Pt$ 시편을 이용하여 125, 150, $170^{\circ}C$에서 25-121 시간동안시효처리 하였다. 시효처리 온도와 시간에 따른 계면 금속간화합물의 두께 및 형상변화를 주사전자현미경 (scanning electron microscopy, SEM), energy dispersive x-ray spectroscopy (EDS) 및 x-ray diffractometry (XRD)를 이용하여 분석하였다. 분석 결과 계면에서 $PtSn_4,\;PtSn_2$가 발견되었고, 이런 금속간화합물 성장은 확산에 의해 지배됨을 발견하였다. 시효처리 온도와 시간에 따른 금속간화합물의 두께 변화를 이용하여 각 솔더에서의 계면 금속간화합물의 생성 활성화 에너지를 구해본 결과 $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$는 145.3 kJ/mol, $Sn0.7wt{\%}Cu/Pt$는 165.1 kJ/mol의 값을 가지고 있었다.

• Journal of Welding and Joining
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• 제30권2호
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.