• 대한금속재료학회지
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• 제49권12호
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• pp.995-1000
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• 2011

The microstructure of Cu-24 wt.%Ag filamentary nanocomposite fabricated by a thermo-mechanical process has been investigated by transmission electron microscopy (TEM) observations. This study is focused on the stability of Ag filaments formed by cold drawing; the effects of thermal treatment on the precipitation behavior and distribution of Ag-rich precipitates were also investigated. The Ag filaments elongated along the <111> orientation were observed in Cu-rich ${\alpha}$ phase of the as-drawn specimen and the copper matrix and the silver filament have a cube on cube orientation relationship. Annealing at temperatures lower than $200^{\circ}C$ for the as-drawn specimen caused insignificant change of the fibrous morphology but squiggly interfaces or local breaking of the elongated Ag filaments were easily observed with annealing at $300^{\circ}C$. When samples were annealed at $400^{\circ}C$, discontinuous precipitation was observed in supersaturated Cu solid solution. Ag precipitates with a thickness of 7-20 nm were observed along the <112> direction and the orientation relationship between the copper matrix and the Ag precipitates maintained the same orientation relationship in the as-drawn specimen. The interface between the copper matrix and the Ag precipitates is parallel to {111} and micro-twins were observed in the Ag precipitates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• 대한금속재료학회지
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• 제49권12호
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• pp.930-936
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• 2011

In the present study, we show that the addition of Ag, an element having a positive enthalpy of mixing with Cu in the liquid state, enables the simultaneous enhancement of the glass forming ability and the plasticity in Cu-Zr-Ag bulk metallic glasses (BMGs). Rods of 4 mm diameter could be prepared with a fully amorphous structure and values of plastic strain up to 18% were measured under a compression mode for compositions around $Cu_{42.5}Zr_{47.5}Ag_{10}$. The possible role of Ag in the change of the atomic structure and the enhancement of the plastic strain in the ternary Cu-Zr-Ag BMGs is discussed based on analyses from transmission electron microscopy and EXAFS (extended X-ray absorption fine structure).

• 한국표면공학회지
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• 제35권1호
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.841-842
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• 2013

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.757-758
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• 2011

• 멤브레인
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• 제34권1호
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• pp.50-57
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• 2024

본 실험에서는 α-Al₂O₃ 지지체에 무전해도금을 이용하여 Pd-Ag-Cu 분리막을 제조하였다. Pd, Ag, Cu는 각각 무전해도금을 통해 지지체 표면에 코팅하였고, 합금의 형성을 위해 무전해도금 중간에 H₂, 500℃의 조건에서 18 h 동안 열처리를 진행하였다. 이를 통해 제조된 Pd-Ag-Cu 분리막은 SEM을 통해 표면을 관찰하였으며, Pd 분리막의 두께는 7.82 ㎛, Pd-Ag-Cu 분리막의 두께는 3.54 ㎛로 측정되었다. EDS와 XRD 분석을 통해 Pd-Ag-Cu 합금이 Pd-78%, Ag-8.81%, Cu-13.19%의 조성으로 형성된 것을 확인하였다. 기체투과 실험은 H₂ 단일가스와 H₂/N₂ 혼합가스에서 실험을 진행하였다. H₂ 단일가스에서 측정한 수소 분리막의 최대 H₂ flux는 Pd 분리막의 경우 450℃, 4 bar에서 74.16 ml/cm²·min이고, Pd-Ag-Cu 분리막의 경우 450℃, 4 bar에서 113.64 ml/cm²·min인 것을 확인하였고, H₂/N₂ 혼합가스에서 측정한 separation factor의 경우 450℃, 4 bar에서 각각 2437, 11032의 separation factor가 측정되었다.

• 대한화학회지
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• 제34권6호
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• pp.527-533
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• 1990

AgI(80 mol%)를 기질로 하여 AgBr 15 mol% + CuI 5mol%, AgBr 10 mol% + CuI 10mol%, AgBr 5 mol% + CuI 5mol%의 계를 제조하여 이들의 이온 전도성을 상온에서 200$^{\circ}C$까지 임피던스분석기(impedance analyzer)를 이용하여 측정한다. 이 온도영역에서 활성화에너지는 0.6∼0.7 eV를 얻을 수 있었으며, 5 mol% AgBr계의 이온 전도성이 가장 컸으며 활성화에너지는 가장 작음을 보였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.177-177
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• 2013

DC 마그네트론 스퍼터링을 이용하여 열처리 온도 변화에 따른 금속 박막의 물성 변화 및 특성 분석을 위해 유리기판 위에 박막의 두께 10 nm로 증착하여 열처리 공정을 진행하였다. 상온에서 Ag 박막의 비저항은 평균 $6.9{\times}10^{-6}{\Omega}.cm$로 Cu 박막의 $4.9{\times}10^{-5}{\Omega}.cm$보다 낮은 전기 전도성을 가지는 것을 확인 할 수 있었다. 또한 Ag 박막은 열처리 온도의 증가와 관계없이 전기전도성에 대한 큰 차이가 없으나 Cu 박막의 경우 열처리 온도 $150^{\circ}C$에서 $2.5{\times}10^{-4}{\Omega}.cm$로 비저항의 변화를 가졌다. 광학적 특성으로 Ag 박막은 58%에서 42%로 감소하는 반면 Cu 박막은 50%에서 75%이상의 광 투과도를 가지는 것을 확인 하였다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1207-1208
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• 2006

We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.