Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Microstructure of Cu-Ag Filamentary Nanocomposite Wires Annealed at Different Temperatures

어닐링한 Cu-Ag 나노복합재 와이어의 미세조직

  • Kwak, Ho Yeon (Department of Nano Materials Engineering, Chungnam National University) ;
  • Hong, Sun Ig (Department of Nano Materials Engineering, Chungnam National University) ;
  • Lee, Kap Ho (Department of Nano Materials Engineering, Chungnam National University)
  • 곽호연 (충남대학교 공과대학 나노소재공학과) ;
  • 홍순익 (충남대학교 공과대학 나노소재공학과) ;
  • 이갑호 (충남대학교 공과대학 나노소재공학과)
  • Received : 2011.08.29
  • Published : 2011.12.25
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Abstract

The microstructure of Cu-24 wt.%Ag filamentary nanocomposite fabricated by a thermo-mechanical process has been investigated by transmission electron microscopy (TEM) observations. This study is focused on the stability of Ag filaments formed by cold drawing; the effects of thermal treatment on the precipitation behavior and distribution of Ag-rich precipitates were also investigated. The Ag filaments elongated along the <111> orientation were observed in Cu-rich ${\alpha}$ phase of the as-drawn specimen and the copper matrix and the silver filament have a cube on cube orientation relationship. Annealing at temperatures lower than $200^{\circ}C$ for the as-drawn specimen caused insignificant change of the fibrous morphology but squiggly interfaces or local breaking of the elongated Ag filaments were easily observed with annealing at $300^{\circ}C$. When samples were annealed at $400^{\circ}C$, discontinuous precipitation was observed in supersaturated Cu solid solution. Ag precipitates with a thickness of 7-20 nm were observed along the <112> direction and the orientation relationship between the copper matrix and the Ag precipitates maintained the same orientation relationship in the as-drawn specimen. The interface between the copper matrix and the Ag precipitates is parallel to {111} and micro-twins were observed in the Ag precipitates.

Keywords

Acknowledgement

Supported by : 지식경제부

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