• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.2-123.2
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• 2017

Fe-Ni-Cu 합금 전주를 위하여 황화물 용액에의 상의 열역학적 안정도를 작성하고 전주 조건을 선정하였다. $Fe-Ni-Cu-S-H_2O$ 용액의 열역학적 상의 안정도를 전산모사하기 위한 프로그램은 C#으로 작성하였다. JANAF 자료를 근거한 적정 전주 조건은 $130mA/cm^2$, $50{\sim}55^{\circ}C$, pH 2.4 이었다. XRF을 이용한 Fe-Ni-Cu의 합금 도막의 평균 조성은 Fe-42Ni-1Cu [wt.%] 이었다, 전류밀도가 낮아질수록 Ni과 Cu량은 증가하였다. 구리 농도가 증가하면 표면조도는 60 nm로 변화하였다.

• Proceedings of the Korean Magnestics Society Conference
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• 1998.05a
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• pp.50-51
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• 1998

• Journal of the Korean Chemical Society
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• v.38 no.2
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• pp.136-145
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• 1994

Polymeric complexes such as M(Ⅱ)(PVPS)(SND), M(Ⅱ)(PVPS)(SOPD) have been prepared with monomeric complexes, M(Ⅱ)(SND) and M(Ⅱ)(SOPD)[M: Co(Ⅱ), Ni(Ⅱ), and Cu(Ⅱ)] and polymer PVPS. These complexes have been indentified by elemental analysis, spectroscopy, and T.G.A. From the results, it was found that M(Ⅱ)(PVPS)(SND), M(Ⅱ)(PVPS)(SOPD) complexes were penta-coordinated configuration. Electrochemical properties of these complexes studied by cyclic voltammetry and differential pulse polarography in 0.1 M TEAP-DMF solution at glassy carbon electrode. Co(Ⅱ)(PVPS)(SND) and Co(Ⅱ)(PVPS)(SOPD) showed irreversible two step reduction, such as Co(Ⅲ)/Co(Ⅱ) and Co(Ⅱ)/Co(Ⅰ), and Ni(Ⅱ)(PVPS)(SND), Ni(Ⅱ)(PVPS)(SOPD), Cu(Ⅱ)(PVPS)(SND), and Cu(Ⅱ)(PVPS)(SOPD) complexes showed irreversible one step reduction, such as Ni(Ⅱ)/Ni(Ⅰ) and Cu(Ⅱ)/Cu(Ⅰ), respectively.

• Journal of the Korean Magnetics Society
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• v.3 no.4
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• pp.310-313
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• 1993

The effect of Ni content in Cu underlayer on the magnetoresistance of Cu/Co artificial superlattice has been investigated. As the content of Ni increased, the preferred orientation of artificial superlattice changed from fec (100) to fcc (111) due to the change of the preferred orientation of the underlayer. When the content of Ni was 6 %, 26.7 % of magnetoresistance with 175 Oe of saturation field could be obtained in ${[Cu(19\AA)/Co(30\AA)]}_{20}|Cu-6%Ni(200\AA)/Si$.

• Journal of Powder Materials
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• v.9 no.1
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• pp.19-24
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• 2002

This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.953-954
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• 2006

Ti-Cu-Ni-Sn quaternary amorphous alloys of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$ composition were prepared by mechanical alloying in a planetary high-energy ball-mill (AGO-2). The amorphization of all three alloys was found to set in after milling at 300rpm speed for 2h. A complete amorphization was observed for $Ti_{50}Cu_{32}Ni_{15}Sn_3$ and $Ti_{50}Cu_{25}Ni_{20}Sn_5$ after 30h and 20h of milling, respectively. Differential scanning calorimetry analyses revealed that the thermal stability increased in the order of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.570-574
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• 1995

Magnetoresistance of NiFeCo/Cu/NiFeCo/FeMn uncoupled exchange biased sandwiches has been studied. The magnetoresistance change ratio, ${\Delta}R/R_{s}$ showed 4.1 % at a saturation field as low as 11 Oe in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(23\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. In this system, the magnetoresistance was affected by interlayer material and thickness. When Ti and Cu were used as the interlayer material in this structure, maximum magnetoresistance change ratio were 0.32 % and 4.1 %, respectively. 6.1 % MR ratio was obtained in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(15\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. The magnetoresistance change ratio decreased monotonically as the interlayer thickness increased. It was found that the exchange bias field exerted by FeMn layer to the adjacent NiFeCo layer was ~25 Oe, far smaller than that reported in NiFe/Cu/NiFe/FeMn spin valve structure(Dieny et. al., ~400 Oe). The relationship between the film texture and exchange anisotropy ha been examined for spin valve structures with Ti, Cu, or non-buffer layer.

• Journal of the Korean Magnetics Society
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• v.5 no.6
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• pp.963-967
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• 1995

Ultra thin layers of NiFeCo or NiFe were inserted at the interfaces of Ni and Cu to form a multilayer structure. In case of inserting a NiFe layer, the magnetoresistance was about 6%, the saturation magnetic field was 50 Oe and the hysteresis of R-H (resistance-magnetic field) was very small. In case of inserting a NiFeCo layer, the magnetoresistance increased to about 7% but the saturation magnetic field and hysteresis were also increased. The increase of the output under biased magnetic field was much larger in case of inserting a NiFe layer because of relatively smaller hysteresis in R-H behavior.

• Journal of Powder Materials
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• v.10 no.2
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• pp.83-88
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• 2003

Nanocrystalline materials of Ni and Ni-Cu alloy have been synthesized by the pulsed wire evaporation (PWE) method and these abnormal magnetic properties in the magnetic ordered state have been characterized using both VSM and SQUID in the range of high and low magnetic fields. Ni and Ni-Cu particles with an average size of 20 to 80 nm were found to influence magnetic hysterisis behavior and the results of powder neutron diffraction patterns and saturation magnetization curves are shown to indicate the absence of the NiO phase. The shifted hysterisis loop and irreversibility of the magnetization curve in the high field region were observed in the magnetic-ordered state of both Ni and Ni-Cu. The virgin magnetization curve for Ni slightly spillover on the limited hysterisis loop ($\pm$20kOe). This irreversibility in the high field of 50 kOe can be explained by non-col-linear behavior and the existence of the metastable states of the magnetization at the surface layer (or core) of the particle in the applied magnetic field. Immiscible alloy of Cu-Ni was also found to show irreversibility having two different magnetic phases.