• Title/Summary/Keyword: Cu wire

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The relation between $Cu_{2}O$ growing velocity and current of copper wire (연동선의 아산화동증식속도와 전류와의 관계)

  • Choi, Chung-Seog;Kim, Hyang-Hon;Kim, Hyung-Rae;Chung, Hun-Sang;Lee, Hyung-Sup
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1513-1515
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    • 2000
  • In this paper, we studied the $Cu_{2}O$ growing with current at the contacts of copper wires and analyzed surface states and structures, crystalline structures, compositions and thermal characteristics of $Cu_{2}O$ growing wires by using stereo microscope, SEM, metallurgical microscope, EDX and DSC. We expect that the results of this experiment can be applied to the electrical fire investigation.

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A novel low resistivity copper diffusion joint for REBa2Cu3O7-δ tapes by thermocompression bonding in air

  • Wei, Ren;Zhen, Huang;Fangliang, Dong;Yue, Wu;Zhijian, Jin
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.4
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    • pp.16-24
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    • 2022
  • Applications of REBa2Cu3O7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa2Cu3O7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm2 (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.

A Comparison Study of Heat Loss Characteristics in Monofilament and Multifilament Superconducting Coils Driven with AC Currents (단일필라멘트와 다중필라멘트 초전도 코일의 교류 전류에 의한 발열 특성 비교 평가)

  • Hwang, S.M.;Kim, K.;Kang, C.S.;Lee, S.J.;Lee, Y.H.
    • Progress in Superconductivity
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    • v.13 no.2
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    • pp.111-116
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    • 2011
  • Since superconducting wires have no resistance, electromagnets based on the superconducting wires produce no resistive heating with DC current as long as the current does not exceed the critical current of the wire. However, unlike resistive wires, superconducting wires exhibit AC heat loss. Embedding fine superconducting filaments inside copper matrix can reduce this AC loss to an acceptable level and opens the way to AC-capable superconducting coils. Here, we introduce an easy and accurate method to measure AC heat loss from sample superconducting coils by measuring changes in the rate of gas helium outflow from the liquid helium dewar in which the sample coil is placed. This method provides accurate information on total heat loss of a superconducting coil without any size limit, as long as the coil can fit inside the liquid helium dewar. With this method, we have evaluated AC heat loss of two superconducting solenoids, a 180-turn solid NbTi wire with 0.127 mm diameter (NbTi coil) and a 100-turn filamented wire with 1.4 mm diameter where 7 NbTi filaments were embedded in a copper matrix with copper to NbTi ratio of 6.7:1 (NbTi-Cu coil). Both coils were wound on 15 mm-diameter G-10 epoxy tubes. The AC heat losses of the NbTi and NbTi-Cu coils were evaluated as $53{\pm}4.7\;{\mu}W/A^2Hzcm^3$ and $0.67{\pm}0.16\;{\mu}W/A^2Hzcm^3$, respectively.

Enhancing Die and Wire Bonding Process Reliability: Microstructure Evolution and Shear Strength Analysis of Sn-Sb Backside Metal (다이 및 와이어 본딩 공정을 위한 Sn-Sb Backside Metal의 계면 구조 및 전단 강도 분석)

  • Yeo Jin Choi;Seung Mun Baek;Yu Na Lee;Sung Jin An
    • Korean Journal of Materials Research
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    • v.34 no.3
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    • pp.170-174
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    • 2024
  • In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni3Sn4 and Ag3Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni3Sn4 and Ag3Sn IMCs. After the wire bonding process, the interface is composed of Ni3Sn4, Ag3Sn and (Ag,Cu)3Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

Development & Practical Installation of 400kV XLPE 1C${\times}$2500SQ Enamel coating Power Cable Accessories (400kV Enameled Cu 1C${\times}$2500SQ 케이블 접속재 개발 및 실선로 적용)

  • Kim, Young-Tek;Kim, Hyun-Ju;Kim, Han-Hwa;Park, Jeong-Ki;Han, Du-Hyun;Choi, Man-Ok
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1614-1616
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    • 2011
  • 지중송전라인에서 전압등급의 상승은 선로손실을 줄이면서 밀집된 전력수요에 대응하거나 특별히 고전압 수요를 맞추기 위한 것으로 이것은 XLPE Cable의 제조기술이 향상되면서 지속적으로 진행되어온 초고압송전계통의 일반적 추세이다. 이러한 경향으로 해외에서는 케이블 도체의 송전용량을 증대시킬 수 있는 방법으로 케이블 도체에 에나멜 코팅을 하여 집합을 한다. 그러므로써 기존 케이블에서 발생되는 표피현상 및 근접효과에 의한 AC 저항 요소를 줄여 요구하는 전류용량을 기존 비소선절연 케이블에 비해 더 많이 송전할 수 있다. 하지만, 소선절연 케이블이 전류 용량을 증대 시킬 수 있는 장점은 있으나 접속재의 경우 도체의 에나멜 코팅을 제거해야 하는 문제점이 있다. 당사는 에나멜 코팅을 제거하는 방법을 개발 완료함으로써 본 접속재의 개발을 앞당길 수 있었다. 당사는 쿠웨이트 400kV MEW/C/3931 Project에 400kV XLPE 1C${\times}$2500SQ 소선절연 초고압송전라인을 적용하였는데 본고에서는 여기에 적용된 400kV XLPE 1C${\times}$25000SQ 소전절연 케이블 부속재의 신뢰성을 높이기 위한 설계방법, 시험 및 시공에 대하여 요약하였다.

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Low Temperature Pyrolysis for Valuable Resources Recovery from Waste Wire (I) (폐전선으로부터 유가자원 회수를 위한 저온열분해(I))

  • Han, Seong-Kuk;Kim, Jae-Yong
    • Applied Chemistry for Engineering
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    • v.20 no.2
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    • pp.223-226
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    • 2009
  • In this study, we investigated the recovery of copper and synthetic fuel from the waste wire by low temperature pyrolysis which can overcome problems of the recent incineration methods. Through thermal decomposition process of waste wire, we achieved the big advantage of getting usable resources as the forms of copper and fuel with a very high value. The TG/DTA and small-scale reaction experiments were carried out to determine an optimum temperature for waste wire pyrolysis. And the pyrolysis was done at 350, 450, and $550^{\circ}C$, respectively, and heating rate of the TG/DTA was $5^{\circ}C/min$ untill $700^{\circ}C$. The result shows that the optimum temperature range for dehydrochlorination of PVC was $280{\sim}350^{\circ}C$, as a lower temperature range than $400{\sim}550^{\circ}C$ of PE and PP. Practically over 95% of copper metal and synthetic fuel, which has the 8027 kcal/kg as a calorific value, were recovered from the waste wire samples.

A Study on the Improvement on the Target Structure in a Magnetron Sputtering Apparatus (마그네트론 스퍼터링 장치의 타겟구조 개선에 관한 연구)

  • Bae, Chang-Hwan;Lee, Ju-Hee;Han, Chang-Suk
    • Journal of the Korean Society for Heat Treatment
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    • v.23 no.1
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    • pp.23-28
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    • 2010
  • The cylindrical magnetron sputtering has not been widely used, although this system is useful for only certain types of applications such as fiber coatings. This paper presents electrode configurations which improved the complicacy of the target assembly by using the positive voltage power supply. It is a modified type which has a target constructed with a large cylindrical part, a conical part and a small cylindrical part. When positive voltage was applied to an anode, a stable glow discharge was established and a high deposition rate was obtained. The substrate bias current was monitored to estimate the effect of ion bombardment. As a result, it was found that the substrate current was large. With cylindrical and conical cathode magnetron sputter deposition on the surface of the substrate to prevent re-sputtering, ion impact because it can increase the effectiveness with excellent ductility and adhesion of Ti film deposition can be obtained. We board at the front end of the ground resistance of $5\;k{\Omega}$ attached to the substrate potential can be controlled easily, and Ti film deposition with excellent adhesion can be obtained. Microstructure and morphology of Ti films deposited on pure Cu wires were investigated by scanning electron microscopy in relation to preparation conditions. High level ion bombardment was found to be effective in obtaining a good adhesion for Cu wire coatings.

A Study on the Improvement of Spot Welding Quality of Wire Cu Alloy by Taguchi Method for Dynamic Characteristics (동특성 다구찌 기법을 통한 Cu합금 와이어의 스폿용접 품질향상 연구)

  • Suk, Ho-sam;Kim, Yeun-sung;Yoo, Choon-burn
    • Journal of Korean Society for Quality Management
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    • v.45 no.4
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    • pp.1003-1020
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    • 2017
  • Purpose: The purpose of this study is to find the optimum working conditions for spot welding of wire Cu alloys to achieve high-level quality. The parts subject to spot welding are brush card assemblies, which are the main module of the electric movement method of the car seat. Methods: In this study, the signal-to-noise ratio(SN ratio) and the loss function [L(y)] are used as Taguchi method for dynamic characteristics. Results: The results of the study are as follows. First, the analysis of variance using SN ratio showed 6 significant factors(p = 0.1% or less) among 7 factors except press force. Second, the optimal design of the dynamic characteristics is the tip exchange cycle: 50,000 ea., the welding time is 110 ms, the pressing force is 11 kgf/cm2, the rise time is 40 ms, and the tip dressing is 3,000 ea., Tip angle is 12o and electric current is 1,800 A. Conclusion: The validity of the spot welding process of the manufacturer's brush card assembly was verified and proved to be consistent with the study results. The results of this study are expected to standardize the welding conditions and guarantee the quality level required by the customers.

DFabrication of $GdAlO_3$ Buffer Layers by Sol-Gel Processing (졸-겔법에 의한 $GdAlO_3$ 버퍼층의 제조)

  • Bang, Jae-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.5
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    • pp.801-804
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    • 2006
  • [ $GdAlO_3(GAO)$ ] buffer layer for $YBa_2Cu_3O_{7-{\delta}}(YBCO)$ coated superconductor wire was fabricated by sol-gel processing. Precursor solution was prepared by dissolving 1:1 stoichiometric quantaties of gadolinium nitrate hexahydrate and aluminum nitrate nonahydrate in methanol. The solution was spin-coated on $SrTiO_3(STO)$(100) single crystal substrates and heated at $1000^{\circ}C$ for 2h in wet $N_2-5%\; H_2$, atmosphere. A SEM(scanning electron microscopy) observation of the surface morphology of the GAO layer has shown that it has a faceted morphology indicating epitaxy. It was shown from x-ray diffraction(XRB) that GAO buffer layer was highly c-axis oriented epitaxial thin film with both good out-of-plane($FWHM=0.29^{\circ}$ for the (002) reflection) and in-plane ($FWHM=1.10^{\circ}$ for the {112} reflection) alignment.

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