• 한국재료학회지
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• 제32권12호
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• pp.522-527
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• 2022

Among efforts to improve techniques for the chemical vapor deposition of large-area and high-quality graphene films on transition metal substrates, being able to reliably transfer these atomistic membranes onto the desired substrate is a critical step for various practical uses, such as graphene-based electronic and photonic devices. However, the most used approach, the wet etching transfer process based on the complete etching of metal substrates, remains a great challenge. This is mainly due to the inevitable damage to the graphene, unintentional contamination of the graphene layer, and increased production cost and time. Here, we report the systematic study of an H₂ bubbling-assisted transfer technique for graphene films grown on Cu foils, which is nondestructive not only to the graphene film but also to the Cu substrate. Also, we demonstrate the origin of the graphene film tearing phenomenon induced by this H₂ bubbling-assisted transfer process. This study reveals that inherent features are produced by rolling Cu foil, which cause a saw-like corrugation in the poly(methyl methacrylate) (PMMA)/graphene stack when it is transferred onto the target substrate after the Cu foil is dissolved. During the PMMA removal stage, the graphene tearing mainly appears at the apexes of the corrugated PMMA/graphene stack, due to weak adhesion to the target substrate. To address this, we have developed a modified heat-press-assisted transfer technique that has much better control of both tearing and the formation of residues in the transferred graphene films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.300-300
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• 2010

Ceramic capacitor의 에너지내량을 향상시켜 제품의 신뢰성을 높이고자 RF Sputtering을 이용하여 외부전극을 형성하였다. 본 연구에서는 Target의 종류, 증착 시간 및 열처리 유/무에 따른 Ceramic capacitor의 전기적 특성 및 미세구조를 분석하여 최적조건을 확립하였으며, 최적 증착 조건으로 제작한 Ceramic capacitor의 에너지내량을 측정하였다. Target은 Ni target과 Cu target을 사용하였으며, Sputtering 시간은 10, 30, 60분으로 하였다. Sputtering 시간에 따른 Ceramic capacitor의 용량 특성과 손실은 큰 차이가 없었지만, Wire 연결시 Sputtering 시간에 따라 납땜성의 차이가 나타났으며, 증착 시간과 열처리 유/무에 따른 에너지내량의 변화를 확인하였다.

• 한국분말재료학회지
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• 제19권4호
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• pp.264-270
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• 2012

In this study, we mainly focus on the study of densification of gas-atomized Cu-50 wt.%In-13 wt.%Ga alloy powder without occurrence of crack during the forming process. Cu-50 wt.%In-13 wt.%Ga alloy powder was consolidated by sintering and rolling processes in order to obtain high density. The phase and microstructure of formed materials were examined by X-ray diffraction (XRD), scanning electron microscopy (SEM) and optical microscopy (OM), respectively. Warm rolling using copper can result in the improvement of density. The specimen obtained with 80% of rolling reduction ratio at $140^{\circ}C$ using cooper can have the highest density of $8.039g/cm^3$.

• 한국재료학회지
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• 제21권2호
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• pp.95-99
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• 2011

The microstructure and Cu diffusion barrier property of Ta-Si-N films for various Si and N compositions were studied. Ta-Si-N films of a wide range of compositions (Si: 0~30 at.%, N: 0~55 at.%) were deposited by DC magnetron reactive sputtering of Ta and Si targets. Deposition rates of Ta and Si films as a function of DC target current density for various $N_2/(Ar+N_2)$ flow rate ratios were investigated. The composition of Ta-Si-N films was examined by wavelength dispersive spectroscopy (WDS). The variation of the microstructure of Ta-Si-N films with Si and N composition was examined by X-ray diffraction (XRD). The degree of crystallinity of Ta-Si-N films decreased with increasing Si and N composition. The Cu diffusion barrier property of Ta-Si-N films with more than sixty compositions was investigated. The Cu(100 nm)/Ta-Si-N(30 nm)/Si structure was used to investigate the Cu diffusion barrier property of Ta-Si-N films. The microstructure of all Cu/Ta-Si-N/Si structures after heat treatment for 1 hour at various temperatures was examined by XRD. A contour map that shows the diffusion barrier failure temperature for Cu as a function of Si and N composition was completed. At Si compositions ranging from 0 to 15 at.%, the Cu diffusion barrier property was best when the composition ratio of Ta + Si and N was almost identical.

• 한국분말재료학회지
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• 제21권5호
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• pp.349-354
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• 2014

This study is a basic research for repair material production which manufactured a Cu repair coating layer on the base material of a Cu plate using kinetic spray process. Furthermore, the manufactured material underwent an annealing heat treatment, and the changes of microstructure and macroscopic properties in the Cu repair coating layer and base material were examined. The powder feedstocks were sphere-shaped pure Cu powders with an average size of $27.7{\mu}m$. The produced repair coating material featured $600{\mu}m$ thickness and 0.8% porosity, and it had an identical ${\alpha}$-Cu single phase as the early powder. The produced Cu repair coating material and base material displayed extremely high adhesion characteristics that produced a boundary difficult to identify. Composition analysis confirmed that the impurities in the base material and repair coating material had no significant differences. Microstructure observation after a $500^{\circ}C/1hr$. heat treatment (vacuum condition) identified recovery, recrystallization and grain growth in the repair coating material and featured a more homogeneous microstructure. The hardness difference (${\Delta}H_v$) between the repair coating material and base material significantly reduced from 87 to 34 after undergoing heat treatment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 춘계학술대회 논문집
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• pp.26-30
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• 1995

We describe the preparation and characterization of epitaxial thin films made with high temperature superconductor, $YBa_2Cu_3O_{7-\delta}$. The influence of processing parameters for YBCO thin films on MgO substrates in-situ grown by the pulsed laser deposition, including parameters of a laser beam energy, oxygen pressure, substrate temperature, target-substrate dis-tance is discussed. The characteristics of YBCO thin films were analyzed by using XRD, R-T measurement, AFM, crosssectional TEM, and RBS. For examples of microwave device applications, The fabrication and characterization of the microstrip lowpass filter and bandpass filter are also presented.

• 대한방사선기술학회지:방사선기술과학
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• 제10권1호
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• pp.37-41
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• 1987

Authors could recognize surrounding areas induding target area by the observable film density with spot radiography using Cu mask and also, radiographic images maintained high quality. Spot radiography has been utilized for a long time for the purpose of observing detail image by the control of scattered radiation. But it has been difficult to know body part in general spot radiography. Therefore it is thought that attempt to use Cu mask in spot radiography is very advantageous in a clinical examinations.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 1999년도 제1회 학술대회논문집(KIASC 1st conference 99)
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• pp.26-29
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• 1999

Superconducting $YBa_{2}$$Cu_{3}$ $O_{7-x}$(YBCO) thin films were deposited on MgO(100) substrates using a hollow cathode discharge sputtering system. Influence of the sputtering conditions such as substrate temperature and discharge sputtering gas pressure on electrical and structural properties were investigated. It was found that YBCO thin films with zero resistance temperature higher than 85 K were obtained to the pressure 200 mToorr(Ar/O2=0.9), substrate temperature of $760^{\circ}C$, and target-substrate distance of 10 mm during film deposition. Homogeneous large area YBCO films with 2 inch diameter were also sucessfully fabricated by this method.

• 한국세라믹학회지
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• 제27권2호
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• pp.249-255
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• 1990

High Tc Supperconducting thin films were fabricated by rf magnetron sputtering method. We have successfully controlled the compositions of films by adding sintered CuO pellets on YBa2Cu3O7-x single target. High Tc thin films with large grian size and good crystal habit were obtained by rapid thermal annealing process. The films deposited on SrTiO3(100) single crystal substrate indicated the existence of c-axis prefered orientation confirmed by XRD and SEM analysis. The Tc, zero's of sharp resistive transition for rapid annealed films deposited on polycrystalline YSZ substrate and on SrTiO3(100) single crystal substrate were 79K and 88K, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1992년도 추계학술대회 논문집
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• pp.81-83
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• 1992

The superconducting thin films deposited on $SiO_x$ substrate by R.F magnetron sputter using $YBa_2Cu_3O_x$ single target have been made and annealed at $940^{\circ}C$ for 30 min. The thickness of films were 1000-2000${\AA}$ with a rate of 20-25${\AA}/min$ and superconducting properties of thin films depended on the compositions of pre-annealed the thin films. It has been analyzed by SEM photo-analysis and X-ray diffraction patterns of these samples obtained under the various conditions of this sputtering methods. and recognized the supperconducting thin films by electric properties.