• Journal of the Microelectronics and Packaging Society
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• 제26권4호
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• pp.1-6
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• 2019

Recently, as electric vehicles and hybrid vehicles are widely used, the use of rechargeable batteries is increasing. Electric and hybrid cars are made up of hundreds to thousands of electric cells depending on the car model. And the assembly process of the cells and modules requires a variety of bonding process. Meanwhile, in order to connect several cells in series, Cu used as a cathode and Al of an anode must be bonded. In this paper, the characteristics of Al and Cu metals, laser types, characteristics and principles of welding lasers for welding of Cu and Al electrodes are introduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.492-493
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• 2007

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine(CuPc) based field-effect transistor with different metal electrode. So we need the effect of the substituent group attached to the phthalocyanine on the surface potential was investigated by Kelvin probe method with varying temperature of the substrate. We were obtained the positive shift of the surface potential for CuPc thin film. We observed the electron displacement at the interface between Au electrode and CuPc layer and we were confirmed by the surface potential measurement.

• Bulletin of the Korean Chemical Society
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• 제31권1호
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• pp.140-145
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• 2010

The simultaneous detection of Cd (II), Pb (II), Cu (II), and Hg (II) ions in aqueous medium using a BDD electrode with DPASV is described. XPS was used to characterize the chemical states of trace metal ions deposited on the BDD electrode surface. Experimental parameters that affect response, such as pH, deposition time, deposition potential, and pulse amplitude were carefully optimized. The detection limits for Cd (II), Pb (II), Cu (II), and Hg (II) ions were 3.5 ppb, 2.0 ppb, 0.1 ppb and 0.7 ppb, respectively. The application of the BDD electrode on the electrochemical pretreatment for the simultaneous metal detection in the dye waste water was also investigated.

• The Transactions of the Korean Institute of Electrical Engineers C
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• 제53권9호
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• pp.488-493
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• 2004

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.

• Journal of the Korean Chemical Society
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• 제37권8호
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• pp.723-729
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• 1993

Cu(II) ion-responsive chemically modifed electrodes (CMEs) were constructed by incorporating 1-(2-pyridylazo)-2-naphthol (PAN) into a conventional carbon-paste mixture of graphite powder and Nujol oil. Cu(II) ion was chemically deposited on the surface of the PAN-chemically modified electrode in the absence of an applied potential by immersion of the electrode in a buffer solution (pH 3.2) containing Cu(II) ion, and then reduced at a constant potential in 0.1 M KNO$_3$. And a well-defined voltammetric peak could be obtained by scanning the potential to the positive direction. The electrode surface could be regenerated with exposure to acid solution and reused for the determination of Cu(II) ion. In 5 deposition / measurement / regeneration cycles, the response could be reproduced with 6.1${\%}$ relative standard deviation. In case of using the differential pulse voltammetry, the calibration curve for Cu(II) was linear over the range of 2.0 ${times}$ 10$^{-7}$ ∼ 1.0 ${times}$ 10$^{-6}$ M. And the detection limit was 6.0 ${times}$ 10$^{-8}$ M. Studies of the effect of diverse ions showed that Co, Ni, Zn, Pb, Mg and Ag ions added 10 times more than Cu(II) ion did not influence on the determination of Cu(II) ion, except EDTA and oxalate ions.

• Journal of the Microelectronics and Packaging Society
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• 제23권4호
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Proceedings of the KIEE Conference
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1572-1575
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• 1996

A new type $Cu_{x}N/Cu/Cu_{x}N$ thin film electrode material with high adhesion to glass was developed by the dc reactive planar magnetron sputtering system for the PDP(Plasma Display Panel). The adhesive force of the $Cu_{x}N$ thin film was in the range of $20{\sim}40(N)$ under the conditions of the $N_2$ partial pressure of 15%, discharge current of 70mA, discharge voltage of 450V and substrate bias voltage of -100V. The adhesive force was depended on the $N_2$ partial pressure, discharge current and substrate bias voltage.

• Journal of the Korean Electrochemical Society
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• 제3권2호
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• pp.121-126
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• 2000

The effect of electroless Ni and Cu plating on $LaNi_5$, $AB_5$ type hydrogen storage alloy was investigated by the various electrochemical techniques such as constant current charge-discharge test, cyclic voltammeoy, and a.c. impedance spectroscopy. Scanning electron microscopy and X-ray diffraction test were conducted for phenomenological logical analyses. Cyclic Voltammetry results show that activation characteristics, cycle life and reaction ,rate were improved through electroless Ni and Cu plating. Compared with bare $LaNi_5$ the charge transfer resistance of electrode was greatly reduced as charge-discharge cycle increases. Therefore, electroless Ni and Cu plating on $LaNi_5$ alloy tends to accelerate the early activation, increasing the cyclic lift of electrode.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.383-386
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• 2007

In this study, the analysis was carried out for Electrical Discharge Machining (EDM) characteristics of the Cu electrodes by LIGA process. The shape of electrodes has 324 pins for the cavity of BGA(Ball Grid Array) type test socket mold. BGA test sockets are used in the inspection process of the semi-conductor I.C chip manufacturing. In the work, the machining performance for EDM of the electrodes was analyzed on dimensional accuracy and wear rate. The dimensional accuracy was measured for dimension of the pins, pitch size between the pins and the roundness of corner edge using optical measuring machine.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.417-420
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• 1996

We have investigated air/200ppm NO$_2$ gas-detector characteristics of using CuTBP (Copper-tetra-tert-butylphthalocyanine) chemiresistor devices. The CuTBP films were made by Langmuir-Blodgett (LB) techniques. Sensitivity, response time, recovery time, and repoducibility of the devices were measured by current-voltage characteristics. To increase sensitivity, interdigital electrode was used. It was found that a conductance G increases monotonically as the number of interdigital electrode increases, and a Sensitivity, Reproducibility is stable. As far as a current is concerned, the current when N=25 is greater than that when N=1 by 70 or so. It indicates that the number of interdigital electrodes affects the current, sensitivity and stability We have also investigated applicability of the CuTBP chemiresistor device for a gas detector.