• Korean Journal of Crystallography
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• v.16 no.2
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• pp.89-101
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• 2005

Among many material processing related issues for successful scaling down of devices for the next 10 years or so, the advanced gate stack and interconnect technology are two most critical research areas, which need technical innovation. The introduction of new metallic films and appropriate processing technologies are required more than ever. Especially, as the device downscaling continues well into sub 50 nm regime, the paradigm for metal nano film deposition technique research has been shifted to high conformality, low growth temperature, high quality with uniformity at large area wafers. Regarding these, ALD has sparked a lot of interests for a number of reasons. The process is intrinsically atomic in nature, resulting in the controlled deposition of films in sub-monolayer units with excellent conformality. In this paper, the overview on the current issues and the future trends in device processing technologies related to metal nano films as well as the R&D trends in these applications will be discussed. The focus will be on the applications for metal gate, capacitor electrode for DRAM, and diffusion barriers/seed layers for Cu interconnect technology.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.93.2-93.2
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• 2010

Recently, printing and coating technologies application fields have been expanded to the energy field such as solar cell. One of the main reasons, why many researchers have been interested in printing technology as a manufacturing method, is the reduction of manufacturing cost. In this paper, We fabricated CIGS solar cell thin film layer by doctor blade methods using synthesis of CIS precursor nanoparticles ink on molybdenum (Mo) coated soda-lime glass substrate. Synthesis CIS precursor nanoparticles ink fabrication was mixed Cu, In, Se powder and Ethylenediamine, using microwave and centrifuging. Using multi coating process as we could easily fabrication a fine flatness CIS thin-film layer ($0.7{\sim}1.35{\mu}m$), and reduce a manufacture cost and process steps. Also if we use printing and coating method and solution process in each layer of CIGS solar cell (electrode, buffer), it is possible to fabricate all printed thin-film solar cell.

• Journal of Industrial Technology
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• v.21 no.B
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• pp.31-35
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• 2001

The phase forming ability and formation enthalpies(${\Delta}H$) of Si-M(M = Ti, Cu, Ni, Zr) compound alloys were predicted by Miedema's model. The silicon compound alloys were synthesized by mechanical alloying and then characterized for the phase formation by X -ray diffraction. The electrochemical properties as the anode materials for lithium ion batteries were investigated using a galvanostatic method. It appears that the electrochemical characteristics of Si-M alloys can be predicted from the thermodynamic criteria for the phase formation using the Miedema's model.

• Journal of Welding and Joining
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• v.18 no.1
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• pp.52-58
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• 2000

Spot welding, namely a kind of electric resisting welding has been used widely in field of automobile and aircraft industries because of easiness to apply. Specimens used in this study was a mild steel of 1.2mm thickness and the electrode was a Cu-Cr alloy of 6mm diameter. The surface sheared of specimens after testing of tensile shear was observed by SEM(scanning electron microscope) after ultrasonic cleaning for 10min., and microstructures and grain size of all specimens were measured with using of O.M.(Optical microscope). By the means of measurement and observations of tensile shear load, fatigue strength and share surface, the weldability of spot welding was evaluated. When tensile shearing testing, fracture starting point in all specimens was took place at the bond between HAZ(Heat affected zone) and nugget. With increasing in number of layers, fatigue strength was decreased. With increasing in electric current, grain size in the HAZ became more fine.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.19-22
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• 2004

A 30-inch WQXGA+ TFT-LCD Monitor has been developed based on in-plane switching mode with multi-domain. This product adopts Cu electrode which, in spite of low resistivity, was not applied to TFT LCD products because of productivity and reliability problems etc. This low resistivity material makes it possible to clear the problem caused by line delay in such high resolution TFT-LCDs. As a results of successful adoption of innovative materials and technologies, our world's largest TFT-LCD Monitor has best performance for high information display.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.7
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• pp.161-166
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• 2001

The prototype of a tactile sensor with $4\times 4$ taxels using PVDF was fabricated. The electrode patterns of the thin Cu tape are attached to the 28${\mu}{\textrm}{m}$ thickness PVDF using conductive adhesive and covering the sensor using polyester film for insulation. The structure of the sensor is flexible and the fabrication procedure is easy relatively. Also the output characteristics of the sensor was nearly linear with 8% deviation. The signals of a contact pressure to the tactile sensor are sensed and processed through A/D converter, DSP system and personal computer. The reasonable performance for the detection of contact shape and force distribution was verified through the experiment.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.565-565
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• 2013

Free burning arcs where the work piece acts as an anode are frequently used for a number of applications. Our investigation is exclusively concerned with a simplified unified model of arcs and anode under steady state conditions at atmospheric pressure. The model is used to make predictions of arc and anode temperatures and arc voltage for a 200 A arc in argon. The computed temperatures along the axis between the cathode tip and the anode surface compare well the measured data. This knowledge of free burning arcfeatures can play a role in developing the atmospheric plasma systems, however, further investigation should include the modelling of Cu evaporation from anode and non-LTE situation near electrodes for more realistic calculations.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.838-840
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• 1998

$BiNbO_4$ ceramics with 0.06wt% CuO, 0.1wt% $V_{2}O_{5}$ sintered at $900^{\circ}C$. The strip line chip filter has been design and fabricated by screen printing with silver electrode after tape casting. The characteristics of the fabricated filters were compared with the simulated results. In the strip line chip filter, insertion loss value of band pass width was 3.65[dB] and return loss was 8.9[dB] and center frequency was similar that simulation results.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.7-14
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• 2015

Recently, advances in nano-material researches have opened the door for various transparent conductive materials, which include carbon nanotube, graphene, Ag and Cu nanowire, and printable metal grids. Among them, Ag nanowires are particularly interesting to synthesize because bulk Ag exhibits the highest electrical conductivity among all metals. Here we reviewed recently-published research works introducing various devices from organic light emitting diode to tactile sensing devices, all of which are employing AgNW for a conducting material. They proposed methods to enhance the stretchability and reversibility of the transparent electrodes, and apply them to make various flexible and stretchable electronics. It is expected that Ag nanowires are applicable to a wide range of high-performance, low-cost, stretchable electronic devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.747-751
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• 2006

The hydrogenated amorphous silicon thin film transistor (a-Si:H TFT) with copper as source and drain electrode has been fabricated to obtain its transfer characteristics and stressed with positive and negative bias to investigate the instability variation comparing to conventional MoW-Al based TFT device. The results show that there is no copper diffusion into active layer of a-Si:H TFT, even during the thermal process. In addition, a 15-inch XGA a Si:H TFT LCD display utilizing Cu as gate electrodes has been developed.