• 제목/요약/키워드: Cu electrode

검색결과 495건 처리시간 0.024초

고온수전해용 전극물질 개발 (Development of prepareation technology of materials for high temperature electrolysis)

  • 서민혜;홍현선;강경훈;김종민;이성규;윤용승
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 한국신재생에너지학회 2007년도 춘계학술대회
    • /
    • pp.61-64
    • /
    • 2007
  • Ni/YSZ ($Y_{2}O_{3}-stabilized$ $ZrO_{2}$), Cu/YSZ and CuO/YSZ composite powder for a cathode material in high temperature electrolysis (HTE) was synthesized by a mechanical alloying method with Ni (or Cu, CuO, Co) and YSZ powder. Microstructure of the composite for HTE reaction has been analyzed with various techniques of XRD, SEM to investigate effects of fabrication conditions. And conductivity of electrode was measured, Cu/YSZ cermet showed the higher electrical conductivity value than Ni/YSZ.

  • PDF

Influence an Oxide Layer Thickness on Resistivity of Cu Conductive Film and Ink-jet Printing of Cu Nanoparticle Ink

  • Jeong, Sun-Ho;Woo, Kyoo-Hee;Kim, Dong-Jo;Lim, Soon-Kwon;Kim, Jang-Sub;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
    • /
    • pp.724-726
    • /
    • 2007
  • We have developed the synthesis method to reduce the surface oxide layer in Cu nanoparticle, which is based on controlling the molecular weight of capping polymer. In addition, we demonstrated how the variation of oxide layer thickness influences the resistivity of conductive Cu film.

  • PDF

무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동 (Cu Diffusion Behavior of Ni-B Diffusion Barrier Fabricated by Electroless Deposition)

  • 최재웅;황길호;한원규;이완희;강성군
    • 한국재료학회지
    • /
    • 제15권9호
    • /
    • pp.577-584
    • /
    • 2005
  • Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

Structural and Magnetic Studies on Electrochemically Lithiated $PrBa_2Cu_3O_y$

  • Choy, Jin-Ho;Chun, Sung-Ho;Kang, Seong-Gu
    • Bulletin of the Korean Chemical Society
    • /
    • 제11권6호
    • /
    • pp.564-567
    • /
    • 1990
  • A lithiated compound $Li_{0.1}Pr^{3+}Ba_2Cu_3O_y$ has been successfully prepared by electrochemical method, which is achieved with a two electrode cell of the type: Metal(Li)/($Li^+\;,\;ClO_4^-$) + propylene carbonate/$PrBa_2Cu_3O_y$. All Pr ions in the lithiated compound are stabilized with a trivalent state as the other rare earths (Ⅲ) substituted in the 90K superconductor lattice ($Y_{1-x}Ln_x^-Ba_2Cu_3O_{7-{\delta}}$). Powder X-ray diffraction analysis shows that both compounds, $PrBa_2Cu_3O_y$ and $Li_{0.1}PrBa_2Cu_3O_y$ are isostructural with the 90 K superconductor, ($YBa_2Cu_3O_{7-{\delta}}$), nevertheless both of them are non-metallic and also non-superconducting down to 10 K. Magnetic susceptibility ${\chi}$ vs. temperature data indicate that Curie contribution from the magnetic ions (Pr and Cu) is weakened on the one hand, but on the other hand temperature-independent part of susceptibility ${\chi}_o$ increases depending upon the rate of lithium intercalation in $PrBa_2Cu_3O_y$ lattice.

열처리 온도에 따른 SnO2/Cu(Ni)/SnO2 다층구조 투명전극의 전기·광학적 특성 (A Study on the Electrical and Optical Properties of SnO2/Cu(Ni)/SnO2 Multi-Layer Structures Transparent Electrode According to Annealing Temperature)

  • 정지원;공헌;이현용
    • 한국전기전자재료학회논문지
    • /
    • 제32권2호
    • /
    • pp.134-140
    • /
    • 2019
  • Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

전기동력학적 정화기술 적용을 위한 최적의 전해질 선택 및 전극간의 거리 평가 (Evaluation of Electrolyte and Electrode Spacing for Application of Electrokinetic Remediation)

  • 박근용;김우승;김도형;양중석;백기태
    • 한국지하수토양환경학회지:지하수토양환경
    • /
    • 제18권1호
    • /
    • pp.6-15
    • /
    • 2013
  • The influence of processing fluids and electrode spacing on the electrokinetic process was evaluated to remediate As-, Cu-, Pb-contaminated soil. Single and mixture of sodium citrate, EDTA and NaOH was used to investigate the metal extraction. EDTA for washing reagent showed the highest removal efficiency. Based on the extraction result, the electrode spacing (20, 40, 60 cm) on the electrokinetic process was investigated to remove the multi-metals from soil. The highest removal was observed at the experiment with 60 cm of electrode spacing, however, the correlation between electrode spacing and removal of metals was not clear. The electrode spacing influenced the amount of accumulated electro-osmotic flow. BCR sequential extraction showed that electrokinetic process removed the fractionation of metals bound to Fe-Mn oxyhydroxide.

유연 전자 소자용 금속 전극의 고온/고습 조건에서 기계적 피로 수명 연구 (Mechanical Fatigue Lifetime of Metal Electrode for Flexible Electronics under High Temperature and High Humidity Condition)

  • 권용욱;김병준
    • 마이크로전자및패키징학회지
    • /
    • 제27권2호
    • /
    • pp.45-51
    • /
    • 2020
  • 미래의 유연 전자 기기는 고온, 고습 환경 조건에서 사용될 수 있으며 반복적으로 굽히고 펴기를 반복하기 때문에 장기 신뢰성 확보를 위해서는 환경 조건과 반복 기계적 변형의 효과를 동시에 고려해야 한다. 본 연구에서는 전자기기에서 가장 일반적으로 사용되는 Al, Ag, Cu 전극을 유연 기판상에 진공 증착한 뒤 환경적인 요건을 상온/일반습도와 85℃/85% 습도 두 가지로 조건에서, 기계적 변형이 없는 평평한 상태와 반복적으로 굽힘 변형을 가해주는 조건의 총 4가지 환경 및 피로 복합 실험을 실시하였다. Al, Ag, Cu 전극 모두 기계적 변형이 없는 평평한 경우에 일반 환경 조건 및 고온/고습 조건 모두 10시간 동안 전기 저항 변화가 발생하지 않았다. 일반 환경 조건에서 굽힘 피로 실험을 진행한 경우, Al, Ag, Cu 전극 모두 금속의 피로 파괴 현상에 의해 10만 싸이클 이후 전기 저항이 약 400%~600% 증가하였다. 고온/고습에서 피로 실험의 경우, Al, Ag 전극은 일반 조건 피로 실험과 결과가 유사하였으나, Cu의 경우 고온/고습 피로실험의 경우 10만 싸이클 이후 전기 저항이 90000% 이상 증가하였다. 이는 부식과 기계적 피로가 동시에 발생할 경우 금속 전극에 매우 심각한 신뢰성 문제를 유발한다는 것을 의미하며, 환경 조건과 기계적 변형을 동시에 고려한 전극 소재 디자인이 필요하다는 것을 의미한다.

Determination of Copper in Black, Red Pepper and the Waste Water Samples by a Highly Selective Sensitive Cu(II) Microelectrode Based on a New Hexadentates Schiff's Base

  • Norouzi, Parviz;Ganjali, Mohammad Reza;Faridbod, Farnoush;Salavati-Niasari, Masoud
    • Bulletin of the Korean Chemical Society
    • /
    • 제27권9호
    • /
    • pp.1439-1444
    • /
    • 2006
  • A $Cu^{2+}$ ion-selective membrane microelectrode has been fabricated from poly vinyl chloride (PVC) matrix membrane containing a new symmetrical hexadentate Schiff,s base 2-{1-(E)-2-((Z)-2-{(E)-2-[(Z)-1-(2-hydroxyphenyl)ethylidene]hydrazono}-1-methylpropylidene)hydrazono]ethyl}phenol (HDNOS) as a neutral carrier, Potassium tetrakis(4-chlorophenyl) borate (KTpClPB) as an anionic excluder and o-nitrophenyloctyl ether (NPOE) as a plasticizing solvent mediator. The microelectrode displays linear potential response in the concentration range of $1.0\;{\times}\;10^{-5}-1.0\;{\times}\;10^{-11}$ M of $Cu^{2+}$. The microelectrode exhibits a nice Nernstian slope of 25.9 ${\pm}$ 0.3 mV $decade^{-1}$ in the pH range of 3.1-8.1. The sensor has a relatively short response time in whole concentration ranges ($\sim$5 s). The detection limit of proposed sensor is $5.0\;{\times}\;10^{-12}$ M (320 pg/L), and it can be used over a period of eight weeks. The practical utility of the sensor has been demonstrated by using it as an indicator electrode in the potentiometric titration of $Cu^{2+}$ with EDTA. The proposed membrane electrode was used for the direct determining of $Cu^{2+}$ content in black and red pepper, and in waste water samples.

Na2S 하부층을 이용한 Cu(In,Ga)Se2 광흡수층의 저온증착 및 Cu(In,Ga)Se2 박막태양전지에의 응용 (Low-temperature Deposition of Cu(In,Ga)Se2 Absorber using Na2S Underlayer)

  • 신해나라;신영민;김지혜;윤재호;박병국;안병태
    • Current Photovoltaic Research
    • /
    • 제2권1호
    • /
    • pp.28-35
    • /
    • 2014
  • High-efficiency in $Cu(In,Ga)Se_2$ (CIGS) solar cells were usually achieved on soda-lime glass substrates due to Na incorporation that reduces deep-level defects. However, this supply of sodium from sodalime glass to CIGS through Mo back electrode could be limited at low deposition temperature. Na content could be more precisely controlled by supplying Na from known amount of an outside source. For the purpose, an $Na_2S$ layer was deposited on Mo electrode prior to CIGS film deposition and supplied to CIGS during CIGS film. With the $Na_2S$ underlayer a more uniform component distribution was possible at $350^{\circ}C$ and efficiency was improved compared to the cell without $Na_2S$ layer. With more precise control of bulk and surface component profile, CIGS film can be deposited at low temperature and could be useful for flexible CIGS solar cells.

SnAgCu계 무연솔더의 전기화학적 반응에 따른 타펠 특성 (Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder)

  • 홍원식;김광배
    • 한국재료학회지
    • /
    • 제15권8호
    • /
    • pp.536-542
    • /
    • 2005
  • Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in $150^{\circ}C,\;180^{\circ}C$ for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in $180^{\circ}C,\;220^{\circ}C$ for 10 minutes. Experimental polarization curves were measured in distilled ionized water and $3.5 wt\%$, 1 mole NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders