Phase transformation by Cu diffusion of electrolessly deposited Ni-P diffusion barrier for Cu interconnect (Cu 미세 배선을 위한 무전해 Ni-P 확산 방지막의 Cu 확산에 따른 상변태 거동)
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- Proceedings of the Korean Institute of Surface Engineering Conference
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- 2005.11a
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- pp.132-133
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- 2005