• Transactions of the Korean hydrogen and new energy society
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• v.22 no.6
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• pp.905-912
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• 2011

In this study, the novel concept catalytic reactor was designed for water-gas shift reaction (WGS) under high pressure. The novel concept catalytic reactor was composed of an autoclave, the catalyst, and liquid water. Cu-ZnO/$Al_2O_3$ as the low temperature shift catalyst was used for WGS reaction. WGS in the novel concept catalytic reactor was carried out at the ranges of 150~$250^{\circ}C$ and 30~50 atm. The liquid water was filled at the bottom of the autoclave catalytic reactor and the catalyst of pellet type was located at the gas-liquid water interface. It was concluded that WGS reaction occurred over the surface of catalysts partially wetted with liquid water. The conversion of CO for WGS was also controlled with changing content of Cu and ZnO used as the catalytic active components. Meanwhile, the catalyst of honey comb type coated with Cu-ZnO/$Al_2O_3$ was used in order to increase the contact area between wet-surface of catalyst and the reactants of gas phase. It was confirmed from these experiments that $H_2$/CO ratio of the simulated coal gas increased from 0.5 to 0.8 by WGS at gas-liquid water interface over the wet surface of honey comb type catalyst at $250^{\circ}C$ and 50 atm.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1056-1063
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• 2010

We present a new joining method for Pd-Cu membrane foils used as permeation tubes to collect $CO_2$. Since foils have poor mechanical strength, joining should be done at low temperatures to reduce residual stresses and without joining pressure. This contradicts the well known conditions for good contact between base materials that determines joint qualities. We selected Sn-Ag-Cu alloys that are highly reactive with Pd and Cu as a filler metal. As the filler melts at joining temperatures as low as $220{\sim}280^{\circ}C$, Pd and Cu are dissolved into the melt and react with the filler elements, which raises the melting temperature of the filler based on eutectic structures among the elements. Then, isothermal solidification progresses for the rest of the joining time. Intermetallic compounds (IMC) in the joints, one of the main factors for brittle joints, are inevitably formed. However, by optimizing both joining time and temperature, we balanced the wettability with IMC. Sealing test results confirmed that the joints are mechanically reliable during operation.

• Journal of the Korea Convergence Society
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• v.12 no.4
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• pp.201-206
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• 2021

Damage to the highly pathogenic avian influenza virus(H5N1) continues to increase, but there is a lack of antiviral research. In this study, we analyze antiviral properties on H5N1 by coating Cu/TiO2 photocatalyst on polyethylene films. The specimen was manufactured a photocatalyst master batch and coated both sides of the 3-layer polyethylene fabric at 280℃ from the extrusion coating machine. The results showed a 99.9% decrease in the Staphylococcus aureus and Escherichia coli. In particular, H5N1 type highly pathogenic avian influenza viruses, which is capable of human infection, has been found to decrease 99.9% within five minutes of contact with Cu/TiO2 films. Antibacterial effects of films coated with photocatalyst are known, but this study also confirmed the antiviral effects.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.1
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• pp.21-30
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• 2017

The surface temperature of disc brakes varies during braking, which can affect the friction and wear behavior of braking systems. In order to develop an efficient braking system, the friction and wear behaviors of brake materials need to be clearly understood. In this work, the friction and wear behavior of the C/C-SiC-Cu composite and the Al/SiC composite, which are used in disc braking systems, were investigated. Both the surface temperature and contact pressure were studied. A pin-on-reciprocating tribotester was used for this purpose, in order to control temperature and load. Results showed that the friction varied significantly with temperature and sliding distance. It was found that a transfer layer of compacted wear debris formed on the wear track of the two materials. These layers caused the surface roughness of the wear track to increase. The outcome of this work is expected to serve as a basis for the development of braking systems under various operating conditions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.6
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• pp.583-588
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• 2015

Asymptotic method has been often used to theoretically analyze the complete contact problem. The error of the asymptotic results increases as the distance from the contact edge increases. The singularity cannot be properly obtained from a finite element (FE) analysis owing to the finiteness of the element size. In the present work, the complete contact problem in bonded condition is analyzed using a combined experimental-numerical approach to assist and/or compare with the asymptotic results. Al and Cu alloys are used for the material combination of the punch and substrate. 120 and 135 degrees are used for the punch angle. The FE models are validated by comparison of displacement distributions obtained by the FE analysis and $moir{\acute{e}}$ experiment. Generalized stress intensity factors are evaluated using the validated FE models. Stress field in the vicinity of the sharp contact edges obtained from the FE and asymptotic analyses are compared. The discrepancies are also discussed.

• Journal of the Korean Vacuum Society
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• v.14 no.1
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• pp.17-23
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• 2005

Glow discharge mass spectrometry(GDMS) was used to determine the impurity concentrations of the deposited Cu films and the 6N Cu target. Cu films were deposited on Si (100) substrates at zero substrate bias voltage and a substrate bias voltage of -50 V using a non-mass separated ion beam deposition method. Since do GDMS has a little difficulty to apply to thin films because of the accompanying non-conducting substrate, we have used an aluminum foil to cover the edge of the Cu film in order to make an electrical contact of the Cu film deposited on the non-conducting substrate. As a result, the Cu film deposited at the substrate bias voltage of -50 V showed lower impurity contents than the Cu film deposited without the substrate bias voltage although both the Cu films were contaminated during the deposition. It was found that the concentration change of each impurity in the Cu films by applying the negative substrate bias voltage is related to the difference in their ionization potentials. The purification effect by applying the negative substrate bias voltage might result from the following reasons: 1) Penning ionization and an ionization mechanism proposed in the present study, 2) difference in the kinetic energy of accelerated Cu+ ions toward the substrate with/without the negative substrate bias voltage.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.313-319
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• 2012

In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.219-220
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• 2002

In this paper, we propose non-soldered current lead was introduced which has low contact resistivity for fault current limiters of YBCO film. Carbon/Cu has good thermal conductivity, electrical conductivity and chemically stable, and so forth. Therefore it seems to be suitable material of current lead for current limiters of YBCO film. We have investigated electric field-current in field of 0-130 mT and quench characteristics of a YBCO film. Experimental results show that characteristics of transport is all right using Carbon/Cu-current lead.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.293-296
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• 2016

Using capacitance-voltage (C-V) and conductance-voltage (G/ω-V) measurements, the electrical properties of Cu/n-InP Schottky diodes were investigated. The values of C and G/ω were found to decrease with increasing frequency. The presence of interface states might cause excess capacitance, leading to frequency dispersion. The negative capacitance was observed under a forward bias voltage, which may be due to contact injection, interface states or minority-carrier injection. The barrier heights from C-V measurements were found to depend on the frequency. In particular, the barrier height at 200 kHz was found to be 0.65 eV, which was similar to the flat band barrier height of 0.66 eV.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.251-255
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• 2003

탄화규소 반도체에 대한 오옴성 금속 접촉 성질을 조사하기 위해 3종류의 금속 (Ni, Co, Cu)을 세척한 탄화규소 반도체 위에 직접 증착하여 전기적 성질을 조사 비교하였다. 이들 금속에 대한 오옴성 성질은 금속종류 뿐만 아니라 열처리조건에 대해서도 크게 좌우됨을 알 수 있었다. 열처리는 급속열처리 장치를 이용한 진공상태 및 환원 분위기에서 2-step 방법으로 시행하였다. 접합비 저항은 TLM 구조를 만들었으며 면저항$(R_s)$, 접촉저항$(R_c)$, 이동거리$(L_T)$, 패드간거리(d), 저항$(R_T)$ 값을 구하면 접합비저항$(\rho_c)$ 값을 구하여 알려진 계산식에 의해 추정하였다. 가장 양호한 결과는 Cu 금속에 의한 접촉 결과이었으며 접합비저항$(\rho_c)$은 $1.2\times10^{-6}{\Omega}cm^2$의 낮은 값을 얻을 수 있었다. 열처리는 진공보다 환원분위기에서 수행한 시편이 양호한 전기적 성질을 가짐을 알 수 있었다.