• Journal of Welding and Joining
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• 제32권3호
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• 한국세라믹학회지
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• 제56권4호
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• pp.394-398
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• 2019

In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.873-875
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• 1999

We have fabricated good quality superconducting $YBa_{2}Cu_{3}O_{7-\delta}$ thin films on Hastelloy(Ni-Cr-Mo alloys) metallic substrate with $CeO_2$ and $BaTiO_3$ buffer layers in-situ by pulsed laser deposition in a multi-target processing chamber. We have chosen $CeO_2$ as a buffer layer which has cubic structure of $5.41{\AA}$ lattice parameter and only 0.2% of lattice mismatch with YBCO. $CeO_2$ layer may be helpful for power transmission due to its conducting property. In order to enhance the crystallization of YBCO films on metallic substrates. we deposited $CeO_2$ and $BaTiO_3$ buffer layers at various temperatures. The YBCO superconducting tape fabricated with $BaTiO_3$ and $CeO_2$ buffer layers shows 85K of transition temperature and about $8.4{\times}10^4A/cm^2$ of critical current density at 77K.

• 한국주조공학회지
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• 제36권1호
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• pp.24-31
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• 2016

CD4MCU duplex stainless steel with gadolinium was fabricated as a neutron absorbing material by the air induction melting method. The gadolinium formed intermetallic compounds of Cu-Gd-Fe. There were no significant differences in hardness or ultimate tensile strength between experimental alloys. With the addition of gadolinium the yield strength of the cast alloy significantly increased, from $478.8{\pm}11.6$ to $514.2{\pm}29.9MPa$, whereas elongation of the cast alloy decreased with the addition of gadolinium, from $26.0{\pm}7.1$ to $7.0{\pm}2.5%$ due to the formation of gadolinium based intermetallic compounds.

• 한국주조공학회지
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• 제28권5호
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• pp.199-203
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• 2008

현재 사용되고 있는 진동감쇠능 Mg-Zr 합금인 K1A는 우수한 진동감쇠능을 갖으나 열악한 기계적 특성과 Zr이 고가이면서 고융점 원소로 합금화가 어렵다는 문제점 때문에 진동테이블, 미사일 유도시스템 및 레코딩 장비 등에 소량만 적용되고 있다. Mg-Ni 합금의 경우Ni가 Mg 용탕 내에 고용되지 않아 우수한 진동감쇠능을 갖으나 Fe, Cu등과 함께 Mg의 부식을 가속시키는 원소로 사용이 제한적일 뿐 아니라 Zr과 마찬가지로 Ni도 고융점 원소로 합금화가 어렵다는 것도 문제점으로 작용하고 있다. Mg-Si 합금의 경우 Si이 극소량만 고용되어 우수한 진동감쇠능을 보이며 Ni과 달리 부식에 영향을 받지 않는 원소이지만 Zr, Ni와 마찬가지로 고가이면서 고융점 원소로 합금화가 어렵다는 문제점이 있다. Mg 용탕에 첨가하게 되면 용탕의 표면에 MgO, CaO 피막을 형성하여 발화현상을 억제할 뿐 아리라 첨가량의 증가에 따라 발화온도를 상승시키는 Ca의 경우 Mg 내에 고용되어 진동감쇠능을 감소시킬 뿐 아니라 유동성 저하 및 열간균열을 야기하는 것으로 나타났다. 그러나 CaO의 경우 Mg내에 고용되지 않고, 가격이 저렴하며 Mg 고유 특성의 변화가 적다. 또한 Ca와 같이 Mg 용탕의 발화를 억제하여 보호가스인 $SF_6$를 사용하지 않아도 된다. 이런 다양한 장점을 갖는 CaO를 첨가한 Mg합금이 진동감쇠능을 유지하면서 기계적 특성이 향상된다면 주행 시 안전성 및 정음성이 요구되는 수송기기 분야와 외부충격으로부터 데이터 보호가 필수적인 휴대용 전자정보통신기기 분야에서 적용이 증가할 전망이며 이에 따라 이 분야에 대한 지속적인 연구와 투자가 이루어져야 할 것이다.

• 열처리공학회지
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• 제9권3호
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• pp.161-168
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• 1996

The purpose of this study is to investigate the effect of impurity level and fabrication processes on the strength, fracture toughness and fatigue resistance of 7075, 7050 and 7175 high strength aluminum forgings. It has been verified that plane strain fracture toughness and fatigue characteristics of a specially processed 7175S-T74 alloy is superior to a conventionally processed 7075-T6/T73, 7050-T74 and 7175-T74 alloys. These beneficial effects primarily arise from two view points, i.e., the effect of reducing the impurity level of iron and silicon has significantly diminished the size and volume fraction of second phase particles such as $Al_7Cu_2Fe$ and $Mg_2Si$. Futher reduction of the amount of nonequilibrium second phase particles has been observed by applying a special fabrication process.

• 대한기계학회논문집B
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• 제21권10호
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• pp.1303-1313
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• 1997

A micro-macroscopic analysis on the conduction-controlled directional casting of Al-Cu alloys is performed, in which emphases are placed on the microstructural features. In order to facilitate the solution procedure, an iterative micro-macroscopic coupling algorithm is developed. The predicted results show that the effect of finite back diffusion on the transient solidification process in comparison with the lever rule depends essentially on the initial concentration of an alloy. In the final casting, the eutectic fraction is distributed in an increasing-decreasing-increasing pattern, each mode of which is named the chill, interior and end zones. This nonuniformity per se suffices to justify the necessity of this work because it originates from the combined effects of finite back diffusion and cooling path-dependent nature of the eutectic formation. As the cooling rate is enhanced, not only the influence depths of boundaries narrow, but also the eutectic fractions in the chill and interior zones increase. In addition, it is revealed for the first time that the micro segregation band is formed in response to a sudden change in cooling rate during the directional casting. An increasing change creates an overshooting band in the eutectic fraction distribution, and vice versa.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.790-793
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• 2000

We have fabricated good quality superconducting YBa$_2$Cu$_3$$O_{7-x}$(YBCO) thin films on Hastelloy(Ni-Cr-Mo alloys) metallic substrates with CeO$_2$and BaTiO$_3$buffer layers in-situ by pulsed laser deposition in a multi-target processing chamber. YBCO film with CeO$_2$ single buffer layer shows T$_{c}$ of 71.64 K and the grain size less than 0.1 ${\mu}{\textrm}{m}$. When BaTiO$_3$is used as a single buffer layer, the grain size of YBCO is observed to be larger than that of YBCO/CeO$_2$by 200 times and the transition temperature of the film is enhanced to be about 84 K. CeO$_2$/BaTiO$_3$double buffer layer has been adopted to enhance the superconducting properties, which results in the enhancement of the critical temperature and the critical current density to be about 85 K and 8.4 $\times$ 10$^4$ A/cm$^2$ at 77 K, respectively mainly due to the enlargement of the grain size of YBCO film.ilm.

• 한국표면공학회지
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• 제53권1호
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• pp.29-35
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• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.1832-1834
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• 2005

In the electrical equipments, there are lots of phenomena such as loosening of connectin parts, So, heat generation and oxidation growth is considered to have a possibility to cause fire. In this Paper, we were carried out to study the oxidation growth and voltage waveform of connecting parts. In case of copper and copper connection, the growing of Cu2O elongated more than the other copper alloys. According to oxidation growth, the voltage waveform is distorted. And the contact voltage and the power dissipation increased rapidly.