• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Korean Journal of Materials Research
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• v.32 no.2
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• pp.80-84
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• 2022

Copper nanoparticles (CuNPs) are considered of great importance due to their high catalytic and antimicrobial activities. This study focuses on the preparation and characterization of CuNPs, and on their antibacterial/antifungal activities. A copper salt (copper sulfate pentahydrate) as precursor, starch as stabilizing agent, and ascorbic acid as reducing agent were used to fabricate CuNPs. The resulting product was characterized via different techniques such as X-ray diffractrometry (XRD), Fourier Transform Infrared (FTIR) spectroscopy, and Scanning electron microscopy (SEM) to confirm its characteristic properties. Employing the Scherrer formula, the mean crystallite sizes of copper (Cu) and cuprous oxide (Cu₂O) nanocrystals were found to be 29.21 and 25.33 nm, respectively, as measured from the main X-ray diffraction peaks. The functional groups present in the resulting CuNPs were confirmed by FTIR. In addition, the engineered CuNPs showed antibacterial and antifungal activity against tested pathogenic bacterial and fungal strains.

• Journal of the Korean Chemical Society
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• v.30 no.5
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• pp.415-422
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• 1986

The metal-support interaction of copper oxide supported on ${\gamma}$-alumina and silica was studied by X-ray diffraction (XRD) and temperature-programmed reduction(TPR). It was found that XRD pattern of CuO can not be observed up to 5.0wt % copper content for CuO/${\gamma}-Al_2O_3$ while CuO/$SiO_2$ sample shows the CuO pattern even at 2.5wt% copper content. $H_2-$TPR of CuO/${\gamma}-Al_2O_3$ system shows four major peaks at 145${\circ}C$, 185${\circ}C$, 210${\circ}C$, and 250${\circ}C$. In the case of CuO/$SiO_2$, a large peak at 250${\circ}C$ was appeared accompanying a small peak at 425${\circ}C$. Comparing the TPR peaks with that of copper aluminate which was prepared from the calcination of CuO/${\gamma}-Al_2O_3$ at 1000${\circ}C$, the peaks at around 145${\circ}C$, 200${\circ}C$ (185${\circ}C$ and 210${\circ}C$), and 250${\circ}C$ were corresponded to $Cu^+$ ion in CuO interacting ${\gamma}-Al_2O_3$, $Cu^+$ ions in defect sites of ${\gamma}-Al_2O_3$ and $Cu^{2+}$ ion in the bulk CuO layer, respectively. From the results, it was concluded that there is considerable metal-support interaction in CuO on ${\gamma}-Al_2O_3$ and the interaction results in a stabilization of $Cu^+$ ion in the system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.593-596
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• 2003

A proposed way to prepare $YBa_2Cu_3O_y$ wires or tapes is that Ag is used as substrate and melting point of $YBa_2Cu_3O_y$ is decreased to lower than the melting point of silver ($961\;^{\circ}C$). Therefore after the deposition of $YBa_2Cu_3O_y$ film on Ag substrate, the heat treatment can be carried out below the Ag melting point. Silver (Ag) and Lead oxide(PbO) were selected to be additives for $YBa_2Cu_3O_y$. Different Ag and PbO contents were added in $YBa_2Cu_3O_y$, the melting points of which were measured by DTA. In order to guarantee that the superconductivity of $YBa_2Cu_3O_y$ was not reduced after Ag and PbO added into $YBa_2Cu_3O_y$, their superconductivities were measured. It is proved that as additives, both Ag and PbO can reduce the melting point of $YBa_2Cu_3O_y$. For Ag doped $YBa_2Cu_3O_y$, $T_c$ is about 93K and ${\Delta}Tc$ is $2{\sim}3K$. For PbO doped $YBa_2Cu_3O_y$, $T_c$ is $88K{\sim}92K$ and ${\Delta}T_c$ is $11{\sim}12K$. When 10 wt% of Ag and 10 wt% PbO were added in $YBa_2Cu_3O_y$, the melting point of the mixture of $YBa_2Cu_3O_y$ (80 wt%), Ag (10 wt%) and PbO (l0 wt%) is $943^{\circ}C$. The transition temperatures ($T_c$) of the sample is 91.8 K.

• Journal of Powder Materials
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• v.12 no.3
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• pp.192-200
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• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.

• Applied Chemistry for Engineering
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• v.25 no.3
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• pp.312-317
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• 2014

Catalytic combustion of benzene over CuO-$CeO_2$ mixed oxides prepared by co-precipitation method were investigated. The CuO-$CeO_2$ mixed oxides were also prepared using different precipitant and CuO precursor. They were characterized by XRD, BET, XPS and $H_2-TPR$. In the CuO-$CeO_2$ catalysts, characteristic copper oxide peaks were shown at $2{\Theta}=35.5^{\circ}$ and $38.5^{\circ}$ regardless of the precipitant. The Cu0.35 catalyst prepared using $NH_4OH$ as a precipitant revealed the highest activity on the combustion of benzene. In addition, the pretreatment with hydrogen enhanced the catalytic activity and the catalyst reduced at $400^{\circ}C$ showed the highest activity on the combustion of benzene.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.389-393
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• 2007

The most demanded bimetals in home appliances are manufactured by mainly cladding process and these are mainly consist of Cu alloy and Ni alloy. But it is very difficult to clad these alloys, because the brittle ${Cu_3}{O_4}$ oxide film formed easily on Cu alloy surface during cladding process. Clad rolling and heat treatment processes were applied for the development of bimetals by using the Ni alloy and the 3 types of Cu alloys. Optical microstructure was observed and micro-hardness, specific resistance, deflection were measured from the manufactured new bimetals specimens.

• Journal of Powder Materials
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• v.8 no.2
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• pp.117-123
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• 2001

Formation of pores in melt-processed $YBa_2Cu_3O_{7-x}$ (123) oxides and its effect on the microstructure were studied. Spherical pores with a size of a few tens of microns were formed due to the evolution of oxygen gas during melting of a 123 oxide. Some of pores were converted into liquid pockets by liquid filling, but others remained unfilled. The liquid pockets were converted into spherical 123 regions with a lower $Y_2BaCuO_5$ (211)density through the peritectic reaction during subsequent cooling, while the pores were entrapped into the periteictically grown 123 grains. The spherical 123 regions often consists of a residual melt due to the unbalanced peritectically reaction.

• Journal of the Korean Ceramic Society
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• v.32 no.10
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• pp.1093-1102
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• 1995

Water-soluble phosphate glasses containing Ag or Cu ion were prepared through melting process. Then the powdered glass samples were dissolved in D.I. water at room temperature with changing the dissolution time. In terms with the glass composition, dissolution characteristics, bactericidal effects and cytotoxicities were investigated. Dissolved amounts increased uniformly with dissolution time, and the dissolution rate was higher for ternary glass than for binary glass and with less metal oxide amount. And the dissolution rate of the glass with Ag ion was higher than that with Cu ion, and the bactericidal effect of the glass with Ag ion was also greater. Solution with more than 25 ppm of Ag was observed to have strong cytotoxicity to L929, and solutions of lower Ag concentration or with Cu seemed to have little cytotoxicity.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.728-734
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• 1996

To obtain the relation in the electrochemical reduction of $CO_2$ in aqueous $KHCO_3$ colution between an activity for the product and the nature of Cu electrode, the electrode surface was characterized by using two methods: X-ray photoelectron spectroscopy (XPS) and photoelectron emission (PE) measurement. Electrolyses were performed with Cu electrodes pretreated in several ways. The distribution of the products changed drastically with electrolysis time and the pretreatment method. The features in XPS spectra were closely connected with the product distribution. The oxide film at the electrode surface was gradually reduced to bare Cu metal with electrolysis time, resulting in a variation of the product distribution. PE was measured by verying the wavelength of incident light at several temperatures. The dependence of PE on the measurement temperature changed greatly before and after electrolysis.