• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.49.2-49.2
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• 2010

Copper oxide films have been deposited on silicon substrates by direct current magnetron sputtering of Cu in O2 / Ar gas mixtures. The target oxidation occurring as a result of either adsorption or ion-plating of reactive gases to the target has a direct effect on the discharge current and the resulting composition of the deposited films. The kinetic model which relates the target oxidation to the discharge current was proposed, showing the one-to-one relationship between discharge current characteristics and film stoichiometry of the deposited films.

• 대한환경공학회지
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• 제28권3호
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• pp.249-256
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• 2006

함침법과 침적침전법으로 Cu-Mn 산화물 촉매를 제조하여 톨루엔 촉매 분해 반응을 조사하였다. 구리와 망간이 혼합됨으로 촉매활성을 증진 시킬 수 있음을 확인할 수 있었다. 또한 같은 화학적 조성으로 제조된 함침법보다 침적침전법에 의해 제조된 Cu-Mn 산화물 촉매에서 톨루엔 분해 반응 활성이 더 높았다. 침적침전법에 의해 제조된 촉매는 10일간의 장기 분석과 수분 첨가에 의한 톨루엔 분해 효율에 변화가 없었다. 촉매 특성 분석 결과에 기초하여 보면, 침적침전법은 촉매의 표면에 균일한 분산과 작은 크기의 입자를 제공하며 환원 능력을 증진시키는 것으로 판단된다. 따라서 침적침전법은 촉매의 성능을 향상 시키고 촉매의 안정성을 중진 시키는 것으로 생각 된다. 또한 Cu-Mn 산화물 촉매에서 톨루엔 분해 반응은 산화환원 반응에 의존하며 $Cu_{1.5}Mn_{1.5}O_4$ 스피넬 구조가 주요한 촉매 활성점으로 작용하는 것으로 추측된다.

• 한국표면공학회지
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• 제32권6호
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• 한국세라믹학회지
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• 제56권4호
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• pp.387-393
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• 2019

A N₂H₄-Cu(I)-HNO₃ solution was used to dissolve magnetite powders and a simulated oxide film on Inconel 600. The addition of Cu(I) ions to N₂H₄-HNO₃ increased the dissolution rate of magnetite, and the reaction rate was found to depend on the solution pH, temperature, and [N₂H₄]. The dissolution of magnetite in the N₂H₄-Cu(I)-HNO₃ solution followed the contracting core law. This suggests that the complexes of [Cu⁺(N₂H₄)] formed in the solution increased the dissolution rate. The dissolution reaction is explained by the complex formation, adsorption of the complexes onto the surface ferric ions of magnetite, and the effective electron transfer from the complexes to ferric ions. The oxide film formed on Inconel 600 is satisfactorily dissolved through the successive iteration of oxidation and reductive dissolution steps.

• 대한금속재료학회지
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• 제48권8호
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• pp.749-756
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• 2010

Low carbon steels were oxidized isothermally at 1050 and $1180^{\circ}C$ for 4 hr in air in order to determine the effect of alloying elements Si, S, Cu, Sn, and Ni on oxidation. For oxidation resistance of low carbon steels, the beneficial elements were Si, Cu, and Ni, whereas the harmful elements were S and Sn. The most active alloying element, Si, was scattered inside the oxide scale, at the scale-alloy interface, and as an internal oxide precipitate. The relatively noble elements such as Cu and Ni tended to weakly segregate at the scale-alloy interface. Sulfur and Sn were weakly, uniformly distributed inside the oxide scale. Excessively thick, non-adherent scales containing interconnected pores formed at $1180^{\circ}C$.

• 한국분말재료학회지
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• 제30권4호
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• pp.332-338
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• 2023

Thermite welding is an exceptional process that does not require additional energy supplies, resulting in welded joints that exhibit mechanical properties and conductivity equivalent to those of the parent materials. The global adoption of thermite welding is growing across various industries. However, in Korea, limited research is being conducted on the core technology of thermite welding. Currently, domestic production of thermite powder in Korea involves recycling copper oxide (CuO). Unfortunately, controlling the particle size of waste CuO poses challenges, leading to the unwanted formation of pores and cracks during thermite welding. In this study, we investigate the influence of powder particle size on thermite welding in the production of Cu-thermite powder using waste CuO. We conduct the ball milling process for 0.5-24 h using recycled CuO. The evolution of the powder shape and size is analyzed using particle size analysis and scanning electron microscopy (SEM). Furthermore, we examine the thermal reaction characteristics through differential scanning calorimetry. Additionally, the microstructures of the welded samples are observed using optical microscopy and SEM to evaluate the impact of powder particle size on weldability. Lastly, hardness measurements are performed to assess the strengths of the welded materials.

• 한국분말재료학회지
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• 제10권6호
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• pp.422-429
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• 2003

The reduction mechanism of the composite powders mixed with $WO_3$ and CuO has been studied by using thermogravimetry (TG), X-ray diffraction, and microstructure analyses. The composite powders were made by simple Turbula mixing, spray drying, and ball-milling in a stainless steel jar with the ball to powder ratio of 32 to 1 at 80 rpm for 1 h without process controlling agents. It is observed that all the oxide composite powders are converted to W-coated Cu composite powder after reducing treatment under hydrogen atmosphere. For the formation mechanism of W-coated Cu composite powder, the sequential reduction steps are proposed as follows: CuO contained in the ball-milled composite powder is initially reduced to Cu at the temperature range from 20$0^{\circ}C$ to 30$0^{\circ}C$. Then, $WO_3$ powder is reduced to W $O_2$ via W $O_{2.9}$ and W $O_{2.72}$ at higher temperature region. Finally, the gaseous phase of $WO_3(OH)_2$ formed by reaction of $WO_2$ with water vapour migrates to previously reduced Cu and deposits on it as W reduced by hydrogen. The proposed mechanism has been proved through the model experiment which was performed by using Cu plate and $WO_3$ powder.

• 한국세라믹학회지
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• 제38권11호
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• pp.1000-1007
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• 2001

진공관형 태양열 집열기에서는 열관(heat pipe)과 붕규산염 유리관의 안정된 접합이 이를 장시간 사용하는데 매우 중요하다. 구리와 유리는 그 물리.화학적 성질에 큰 차이가 있어 접합하기가 어려움으로 구리관 표면에 유리와 화학적 결합이 용이한 산화막을 생성시켜 접합하도록 구리의 산화상태, 접합계면 및 접합강도를 XRD, SEM, EDS 및 인정시험기로 측정하였다. 순수 구리는 $600^{\circ}C$ 이하로 열처리하였을 때 Cu$_2$O 산화막을 생성하였으나 그 이상의 온도에서는 CuO 산화막을 형성하였으며 후자의 산화막은 구리와의 접합력이 매우 불량하였다. 그러나 붕사로 표면 처리를 하였을 경우에는 80$0^{\circ}C$에서도 Cu$_2$O 산화막 만이 발견되었다. Cu$_2$O 산화막을 생성시킨 구리관과 붕규산염 유리관을 Housekeeper법으로 접합하였을 경우 354.4N의 접합강도를 얻을 수 있었으며 열충격 저항성도 매우 뛰어났다.

• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.37-41
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• 2017

$Cu_2O$는 초저가 태양전지의 흡수층으로 적용될 수 있는 물질 중 하나로 direct band gap($E_g={\sim}2.1eV$)을 갖고 있으며 최대 650 nm 파장의 빛을 흡수 할 수 있는 높은 흡수율을 가지고 있다. 또한 무독성, 풍부한 매장량으로 낮은 비용 등의 여러 장점을 가지며 간단하고 저렴한 방법으로 대량으로 제작이 가능하다. 본 연구에서 Au가 증착된 $SiO_2/Si$ 기판 위에 전착법을 통해 $Cu_2O$ 박막을 제작하였다. 우리는 용액의 pH와 작업전극에 인가되는 전위, 용액의 온도와 같은 공정조건을 바꾸어주었고 최종적으로 XRD와 SEM 사진 분석을 통해 박막의 특성을 확인하였다.

• 대한환경공학회지
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• 제31권12호
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• pp.1069-1074
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• 2009

본 연구에서는 CuO와 ZnO의 입자 크기가 옥수수의 성장과 토양 미생물 군집에 미치는 독성을 microcosm 실험을 통하여 살펴보았다. 나노 입자는 micro 입자에 비해 옥수수의 biomass를 약 30% 감소시켜 나노 입자가 옥수수의 성장을 저해하는 것으로 나타났다. 토양 미생물 활성 지표인 Dehydrogenase activity는 CuO 나노 입자에서는 낮게 나타났으나 ZnO 나노 입자에서는 높게 나타났다. Biolog test 결과, CuO 나노 입자와 ZnO micro 입자에서 토양 미생물 다양성이 감소하는 것으로 나타났다. 그러므로, metal oxide의 나노 입자가 micro 입자보다 항상 토양 미생물의 활성 및 다양성에 더 유해한 영향을 나타내는 것은 아니라고 판단된다.