• 한국표면공학회지
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• 제42권3호
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• pp.103-108
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• 2009

The effect of Arsenic in copper-sulfate solutions during electrorefining of copper was investigated using scanning electron microscopy, X-ray diffraction and cyclic voltammetry analysis. Electrodeposition was carried out using Arsenic, Antimony and bismuth addition to sulfate electrolytes: 45 g/l $Cu^{2+}$ and 170 g/l $H_2SO_4$. Arsenic in sulfate electrolytes changed the morphology and structure of the copper deposits as compared with those obtained from impurity free solutions. When arsenic was present in the sulfate electrolytes, $Cu-3$As intermetallic phase was formed locally on the deposits.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2006년도 제30회 학술논문발표회 초록집
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• pp.207-207
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• 2006

• 전기화학회지
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• 제2권4호
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• pp.237-241
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• 1999

펄스전착법에 의한 구리박막의 특성과 via hole 충진 특성을 연구하였다. 특히 구리박막의 특성에 미치는 첨가제의 영향을 중점적으로 다루었다. 펄스 전류와 첨가제를 사용하여 전착한 구리박막은 83.4 MPa이하의 낮은 인장응력을 가졌으며 높은 Cu (111) 우선 배향성을 나타냈다. Superfilling에 의해 최고 $0.25{\mu}m, 6: 1$ 정도의 고 종횡비를 가지는 via hole에 결함 없이 성공적으로 충진할 수 있었으며 미세 구조를 관찰한 결과 쌍정에 의한 변형이 일어났음을 알 수 있었다. $500^{\circ}C$에서 1시간 동안 진공열처리를 했을 경우 두께의 $1\~2$배에 달하는 결정립을 가지는 bamboo구조를 나타냈으며 이때 전기비저항은 $1.8\~2.0{\mu}{\Omega}{\cdot}cm$을 나타냈다.

• Journal of Electrochemical Science and Technology
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• 제8권3호
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• pp.206-214
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• 2017

SnS films have been prepared by electrodeposition technique onto Cu and ITO substrates using acidic solutions containing tin chloride and sodium thiosulfate with sodium citrate as an additive. The effects of sodium citrate on the electrochemical behavior of electrolyte bath containing tin chloride and sodium thiosulfate were investigated by cyclic voltammetry and chronoamperometry techniques. Deposited films were characterized by XRD, FTIR, SEM, optical, photoelectrochemical, and electrical measurements. XRD data showed that deposited SnS with sodium citrate on both substrates were polycrystalline with orthorhombic structures and preferential orientations along (111) directions. However, SnS films with sodium citrate on Cu substrate exhibited a good crystalline structure if compared with that deposited on ITO substrates. FTIR results confirmed the presence of SnS films at peaks 1384 and $560cm^{-1}$. SEM images revealed that SnS with sodium citrate on Cu substrate are well covered with a smooth and uniform surface morphology than deposited on ITO substrate. The direct band gap of the films is about 1.3 eV. p-type semiconductor conduction of SnS was confirmed by photoelectrochemical and Hall Effect measurements. Electrical properties of SnS films showed a low electrical resistivity of $30{\Omega}cm$, carrier concentration of $2.6{\times}10^{15}cm^{-3}$ and mobility of $80cm^2V^{-1}s^{-1}$.

• Bulletin of the Korean Chemical Society
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• 제35권7호
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• pp.2019-2024
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• 2014

NiCu alloys have been suggested as potential candidates for catalysts in glucose oxidation. In this study, NiCu alloys with different compositions were prepared on a glassy carbon substrate by changing the electrodeposition potential to examine the effect of Ni/Cu ratios in alloys on catalytic activity toward glucose oxidation. Cyclic voltammetry and chronoamperometry showed that NiCu alloys had higher catalytic activity than pure Ni and Cu catalysts. Especially, Ni59Cu41 had superior catalytic activity, which was about twice that of Ni at a given oxidation potential. X-ray analyses showed that the oxidation state of Ni in NiCu alloys was increased with the content of Cu by lattice expansion. Ni components in alloys with higher oxidation state were more effective in the oxidation of glucose.

• Progress in Superconductivity
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• 제4권2호
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• pp.157-161
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• 2003

We have performed the electrochemical method to fabricate high temperature superconducting (TlPbBi) -(SrBa)-Ca-Cu-O films. The precursors of the superconducting sample were codeposited at a periodic pulsed-potential cycle (1 second at -4V and 1 second at -1V) on a silver substrate. The variation of structure, microstructure and element were analysed by ICP and SEM techniques. The specimens were consisted predominantly of the Tl-1212 phase and have a transition temperature of 80～87 K in low magnetic field. It was showed that each grain has the stoichiometric ratio of $T1_{0.7}$Pb_$Bi_{0.3}$ $_Sr{0.1}$ $Ba_{2.4}$ $Ca_{0.2}$ $Cu_{1.2}$ $2.5/O_{x}$ by EDX analysis.sis.

• 전기화학회지
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• 제13권2호
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• pp.89-95
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• 2010

Cu(In, Ga)$Se_2$ (CIGS) 박막은 다원화합물이기 때문에 제조공정이 매우 까다롭다. 진공장치를 사용하는 제조 방법으로 동시증착법, 스퍼터링법 +셀렌화가 있고, 비진공 제조 방법으로 전기화학적인 전착법이 있다. 각 방법에 있어서도 출발 물질의 종류에 따라 다양한 제조 방법이 동원 될 수 있다. 진공증착에 의한 방법은 고품질의 박막을 얻는데 사용 되고 있으나 고가의 진공장비가 사용되므로 대면적화에 따른 제조비용 측면에서 문제가 있다. 이에 비하여, 전착법은 간단하면서도 저가로 대면적화를 이룰 수 있다는 장점 때문에, 많은 관심이 기울여지고 있다. 본 연구에서는 Mo/Glass전극위에 Ga/(In + Ga) = 0.3의 성분비를 만족시키는 CIGS 박막을 전기화학적으로 제조하기 위하여, $Cu^{2+}$, $In^{3+}$, $Ga^{3+}$, $Se^{4+}$ 4성분을 모두 포함하는 전해질 수용액 내에서, 4성분의 이온들이 동시에 환원되는 전위를 조절하여 CIGS 박막을 전착 하였다. SEM을 이용하여 얻어진 CIGS 박막의 전착된 시료의 표면을 관찰하였고, EDS로 그 조성을 분석하였다. 또한, XRD를 이용하여 전착시료의 열처리 전후의 결정성변화를 조사하였다.

• 열처리공학회지
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• 제30권2호
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• pp.61-66
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• 2017

$SnO_2$ was electrodeposited on nodule-type Cu foil at varing current density and electrodeposition time. Unlike the previous research results, when the anodic current is applied, the $SnO_2$ layer was not electrodeposited and the substrate is corroded. When the cathodic current was applied, the $SnO_2$ layer could be successfully deposited. At this time, the surface microstructure of the powdery type was observed, which showed similar crystallinity to amorphous and had a very large surface area. Crystallinity increased after low-temperature heat treatment at $250^{\circ}C$ or lower. As a result of evaluating the charge/discharge performances as an anode material for lithium ion battery, it was confirmed that the capacity of the heat treated $SnO_2$ was increased more than 2 times, but it still showed a limit point showing initial low coulombic efficiency and low cyclability. However, it was confirmed that the battery performances may be enhanced through optimizing the electrodeposition process and introducing post heat treatment.

• 한국재료학회지
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• 제16권11호
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• pp.710-714
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• 2006

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

• 전기화학회지
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• 제5권3호
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• pp.125-130
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• 2002

다공성 그물구조 금속을 반도체 칩 방열재료로써 활용하기 위한 실험을 실시하였다. 이를 위해 다공성 그물구조 구리와 반도체 칩 사이의 열팽창 차이를 최소화하기 위한 시도로써 다공성 구리에 대한 Fe/Ni 합금전착을 수행하였다. Fe/Ni 합금전착 실험으로 표준 Hull Cell을 구성하고 전류밀도 분포에 따른 Fe/Ni 합금층 내의 조성변화를 관찰하였으며, 실험결과 합금전착시 이상공석현상으로 인하여 전해액의 교반정도에 따라 합금층 조성이 크게 영향을 받는 것으로 나타났다. 본 실험에서는 paddle type 교반기를 사용하여 전해질의 확산을 제어하는 방법으로 원하는 조성의 Fe/Ni 합금층을 얻을 수 있었으며, 얻어진 Fe/Ni 후막을 대상으로 TMA 열분석을 실시한 결과 구리에 비해 훨씬 낮은 열팽창율을 보이는 것으로 나타났다. 또한, 본 실험에서 Fe/Ni 합금전착을 통하여 제작한 다공성 그물구조 금속을 대상으로 방열성능을 측정한 결과 구리 평판 대비 최대 2배 이상의 방열성능을 보여 반도체 칩 방열재료로의 활용 가능성을 높여 주었다.