• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• Journal of Electrochemical Science and Technology
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• v.12 no.1
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• pp.58-66
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• 2021

Spiral-wound woven wire meshes packed bed rotating cylinder electrode was used for the simultaneous removal of cadmium (Cd) and copper (Cu) from a binary solution. The effects of weight percent of each metal on the removal and current efficiencies were studied at an operating current of 345A, while the effect of current on the removal efficiency of both metals was investigated at three levels of current (240, 345.and 400 mA). The experiments were carried out at constant rotation speed 800 rpm, pH = 3, and a total concentration of metals (500 ppm). The results showed that the removal efficiency of copper increased from 89% to 99.4% as its weight percent increased from 20% to100%. In a similar fashion, the removal efficiency of cadmium increased from 81% to 97% as its weight percent increased from 20% to100%. The results confirmed that the removal efficiency of any metals declined in the presence of the other. Increasing of current resulted in increasing the removal efficiency of both metals at different weight percents. The results confirmed that current efficiencies for removing of copper and cadmium simultaneously decline with increasing of electrolysis time and weight percent of cadmium or with decreasing the weight percent of copper. Current efficiency was higher at the initial stage of electrolysis for all weight percents of metals. The results showed that the decay of copper concentration was exponential at all weight percents of copper, confirming that the electrodeposition of copper is under mass transfer control in the presence of cadmium. While the decay of cadmium concentration was linear at lower weight percent of cadmium then changed to an exponential behavior at high weight percent of cadmium in the presence of copper.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.35.1-35.1
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• 2011

New photovoltaic (PV) materials and manufacturing approaches are needed for meeting the demand for lower-cost solar cells. The prototypal thin-film photovoltaic absorbers (CdTe and $Cu(In,Ga)Se_2$) can achieve solar conversion efficiencies of up to 20% and are now commercially available, but the presence of toxic (Cd,Se) and expensive elemental components (In, Te) is a real issue as the demand for photovoltaics rapidly increases. To overcome these limitations, there has been substantial interest in developing viable alternative materials, such as $Cu_2ZnSnS_4$ (CZTS) is an emerging solar absorber that is structurally similar to CIGS, but contains only earth abundant, non-toxic elements and has a near optimal direct band gap energy of 1.4~1.6 ev and a large absorption coefficient of ${\sim}10^4\;cm^{-1}$. The CZTS absorber layers are grown and investigated by various fabrication methods, such as thermal evaporation, e-beam evaporation with a post sulfurization, sputtering, non-vacuum sol-gel, pulsed laser, spray-pyrolysis method and electrodeposition technique. In the present work, we report an alternative method for large area deposition of CZTS thin films that is potentially high throughput and inexpensive when used to produce monolithically integrated solar panel modules. Specifically, we have developed an aqueous chemical approach based on chemical bath deposition (CBD) with a subsequent sulfurization heat treatment. Samples produced by our method were analyzed by scanning electron microscopy, X-ray diffraction, transmission electron microscopy, absorbance and photoluminescence. The results show that this inexpensive and relatively benign process produces thin films of CZTS exhibiting uniform composition, kesterite crystal structure, and good optical properties. A preliminary solar cell device was fabricated to demonstrate rectifying and photovoltaic behavior.

• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.7-16
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• 2015

Effects of chemical composition ($Cu^{2+}$, $K_4P_2O_7$ and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing $Cu^{2+}$ concentrations from 0.02 to 0.3M. Decrease of current efficiency was observed in the range of 1.5~1.8M $K_4P_2O_7$ concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3M and 2.1~2.4M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M $Cu^{2+}$ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120MPa was observed at 0.25M $Cu^{2+}$ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as $K_4P_2O_7$ concentration varied from 0.9 to 2.4M and but The change of additive concentration did not affected on residual stress. $Cu^{2+}$ and $K_4P_2O_7$ concentrations significantly affect on surface morphology of electrodeposited Cu thin films, but additive concentration slightly affected. From XRD analysis, the microstructures of electrodeposited Cu thin film was affected from the changes of $Cu^{2+}$ and $K_4P_2O_7$ concentrations, but not from that of additive concentration. Strong preferred orientation of (111) peak was observed with increasing $Cu^{2+}$ and $K_4P_2O_7$ concentrations.

• Journal of the Korean Magnetics Society
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• v.25 no.4
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• pp.129-137
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• 2015

The Cu(radius ra = $95{\mu}m$)/$Ni_{80}Fe_{20}$(outer radius $r_b$ = $120{\mu}m$) core/shell composite wire is fabricated by electrodeposition. The two diagonal components of impedance tensor for the Cu/$Ni_{80}Fe_{20}$ core/shell composite wire in cylindrical coordinates, $Z_{zz}$ and $Z_{{\theta}{\theta}}$, are measured as a function of frequency in 10 kHz~10 MHz and external static magnetic field in 0 Oe~200 Oe. The equations expressing the diagonal $Z_{zz}$ and $Z_{{\theta}{\theta}}$ in terms of diagonal components of complex permeability tensor, ${\mu}^*_{zz}$ and ${\mu}^*_{{\theta}{\theta}}$, are derived from Maxwell's equations. The real and imaginary parts of ${\mu}^*_{zz}$(f) and ${\mu}^*_{{\theta}{\theta}}$(f) spectra are extracted from the measured $Z_{zz}$(f) and $Z_{{\theta}{\theta}}$(f) spectra, respectively. It is presened that the extraction of ${\mu}^*_{zz}$(f) and ${\mu}^*_{{\theta}{\theta}}$(f) spectra from the diagonal impedance spectra can be a versatile tool to investigate dymanic magnetization process in the core/shell composite wire.

• Journal of the Korean Magnetics Society
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• v.25 no.1
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• pp.10-15
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• 2015

The model for the magneto-impedance of composite wires composed of highly conductive nonmagnetic metal core and soft magnetic shell was derived based on the Maxwell's equations. The Cu($100{\mu}m$ diameter)/$Ni_{80}Fe_{20}$($15{\mu}m$ thickness) core/shell composite wire was fabricated by electrodeposition. The impedance spectra for the $Cu/Ni_{80}Fe_{20}$ core/shell composite wire were measured in the frequency range of 10 kHz~10 MHz under longitudinal dc magnetic field in 0 Oe~200 Oe. The spectra of complex permeability in circumferential direction were extracted from the impedance spectra by using the derived model. The extracted spectra of complex permeability showed relaxation-type dispersion which is well curve-fitted with Debye equation with single relaxation frequency. By analyzing the magnetic field dependence of the complex permeability spectra, it has been verified that the composite wire has magnetic anisotropy in longitudinal direction and the origin of the single relaxation process is the magnetization rotation in circumferential direction.

• Transactions of the Korean hydrogen and new energy society
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• v.17 no.4
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• pp.448-453
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• 2006

Porous Co-P catalysts electroplated on Cu in chloride based solution with an addition of $NaH_2PO_2$ and glycine were developed for hydrogen generation from alkaline $NaBH_4$ solution. The microstructures of the Co-P catalysts and their hydrogen generation properties were analyzed as a function of cathodic current density and plating time during the electrodeposition. Amorphous Co-P electrodeposits with porous structure was formed on Cu at cathodic current density of $0.05\;A/cm^2$, and showed very high hydrogen generation rate in alkaline $NaBH_4$ solution due to an increase in the surface area of the catalyst as well as the catalytic activity. The Co-P catalyst, which was obtained at cathodic current density of $0.05\;A/cm^2$ for 5 min, exhibited the best hydrogen generation rate of 2290 ml/min.g-catalyst in 1 wt. % NaOH+10 wt. % $NaBH_4$ solution at $30^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.99.1-99.1
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• 2012

The thin-film photovoltaic absorbers (CdTe and $Cu(In,Ga)Se_2$) can achieve solar conversion efficiencies of up to 20% and are now commercially available, but the presence of toxic (Cd,Se) and expensive elemental components (In, Te) is a real issue as the demand for photovoltaics rapidly increases. To overcome these limitations, there has been substantial interest in developing viable alternative materials, such as $Cu_2ZnSnS_4$ (CZTS) is an emerging solar absorber that is structurally similar to CIGS, but contains only earth abundant, non-toxic elements and has a near optimal direct band gap energy of 1.4 - 1.6 eV and a large absorption coefficient of ~104 $cm^{-1}$. The CZTS absorber layers are grown and investigated by various fabrication methods, such as thermal evaporation, e-beam evaporation with a post sulfurization, sputtering, non-vacuum sol-gel, pulsed laser, spray-pyrolysis method and electrodeposition technique. In the present work, we report an alternative aqueous chemical approach based on chemical bath deposition (CBD) method for large area deposition of CZTS thin films. Samples produced by our method were analyzed by scanning electron microscopy, X-ray diffraction, transmission electron microscopy, absorbance and photoluminescence. The results show that this inexpensive and relatively benign process produces thin films of CZTS exhibiting uniform composition, kesterite crystal structure, and some factors like triethanolamine, ammonia, temperature which strongly affect on the morphology of CZTS film.