• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.19-25
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• 2000

Dielectric polymer films produced from benzocyclobutene (BCB) formulations (CYCLOTENE＊ family resins) are known to possess many desirable properties for microelectronic applications; for example, low dielectric constant and dissipation factor, low moisture absorption, rapid curing on hot plate without reaction by-products, minimum shrinkage in curing process, and no Cu migration issues. Recently, BCB-based products for thick film applications have been developed, which exhibited excellent dissipation factor and dielectric constant well into the GHz range, 0.002 and 2.50, respectively. Derived from these properties, the applications are developed in: bumping/wafer level packaging, Ga/As chip ILD, optical waveguide, flat panel display, and lately in BCB-coated Cu foil for build-up board. In this paper, we review the relevant properties of BCB, then the application areas in bumping/wafer level packaging and BCB-coated Cu foil for build-up board.

• 한국자기학회지
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• 제2권3호
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• pp.228-232
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• 1992

고온초전도체 $Y_1Ba_2Cu_3O_{7-y}$의 grain을 높은 자기장에서 정렬시켜 여러가지 자기적 특성을 조사하였다. Grain이 정렬된 초전도체는 단결정과 같이 Cu-O layer에 수직, 수평 방향에 대해 자기이방성을 가진다. 2~77 K의 온도영역에서 측정한 lower critical field$(H_{c1})$은 온도가 증가하면서 선형적으로 감소하였는데, Cu-O layer에 대하여 외부 자기장이 수직인 경우가 더욱 급격히 감소하였다. 온도변화에 따른 자율화$(4{\pi}\;X)$의 측정으로부터 극저온의 자화율이 -1에 가까운 값을 가진다는 것을 알 수 있었다. 또한 이 자화 곡선을 London의 공식과 two-fluid model을 이용해 최소자승법으로 fitting하여 절대 영도에서 침투깊이$({\lambda}_0)$를 구하였다. 또한 2 K에서 외부 자기장에 따른 자화곡선을 측정하였으며, Bean의 critical state model을 이용한 임계전류밀도$(J_c)$의 계산으로부터 grain내부는 단결정 수준의 높은 $(J_c)$를 가지고 있음을 알 수 있었다.

• ETRI Journal
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• 제33권6호
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Progress in Superconductivity
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• 제11권1호
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• pp.25-29
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• 2009

Polycrystalline samples of $(R_{0.8}Ca_{0.2})Ba_2Cu_3O_{7-z}$ (R = Lu and Y) were synthesized by a solid-state reaction route, and the phase stabilities were examined by heating at temperatures between $800^{\circ}C$ and $900^{\circ}C$ in various atmospheres. A comparative analyses of the x-ray diffraction data of the $(Lu_{0.8}Ca_{0.2})Ba_2Cu_3O_{7-z}$ and $(Y_{0.8}Ca_{0.2})Ba_2Cu_3O_{7-z}$ compounds showed that the 123 phase of both compounds is stable under heating in air and $O_2$ of 1 atm. However, contrary to the $(Y_{0.8}Ca_{0.2})Ba_2Cu_3O_{7-z}$ compound, the $(Lu_{0.8}Ca_{0.2})Ba_2Cu_3O_z$ compound was found to become unstable when heated in the low oxygen partial pressure below about 8 % $O_2\;in\;N_2$, Considering the instability of parent $LuBa_2Cu_3O_z$ compound, this result suggests that the phase stability of Lu-based 123 compounds is sensitive to both the composition and the oxygen partial pressure.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Bulletin of the Korean Chemical Society
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• 제30권11호
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• pp.2559-2562
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• 2009

The lattice vibration and crystal structure of alkaline earth metal-substituted $RuSr_{1.9}A_{0.1}GdCu_{2}O_{8}$ (A = Ca, Sr, and Ba) have been investigated with micro-Raman spectroscopy. The present $RuSr_{1.9}A_{0.1}GdCu_{2}O_{8}$ materials show not only several weak Raman peaks corresponding to the vibrations of $O_{Cu}$ and $O_{Ru}$ but also strong characteristic phonon lines related to $O_{Sr}$ vibration mode. A comparison between the frequency of $O_{Sr}$ vibration and the bond distances of (Ru$O_{Sr}$) and (Cu‒$O_{Sr}$) in the present ruthenocuprates reveals that the vibration energy of $O_{Sr}$ is mainly dependent on the bond distance of (Ru‒$O_{Sr}$). The peak splitting of the $O_{Sr}$ phonon lines was observed for the unsubstituted $RuSr_{1.9}A_{0.1}GdCu_{2}O_{8}$, suggesting the existence of two different (Ru‒$O_{Sr}$) bond distances. Such a peak splitting caused by the appearance of low-energy shoulder reflects the presence of internal charge transfer pathway from the $RuO_2$ plane to the superconductive $CuO_2$ one. After the substitution of Sr with Ca or Ba, the low-energy shoulder peak of $O_{Sr}$ vibration becomes suppressed, underscoring the depression of internal charge transfer between the $RuO_2$ and $CuO_2$ planes. The weakened role of $RuO_2$ layer as charge reservoir in the $RuSr_{1.9}A_{0.1}GdCu_{2}O_{8}$8 (A = Ca, Ba) would be responsible for the depression of $T_c$ upon the Ca/Ba substitution.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2001년도 High Temperature Superconductivity Vol.XI
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• pp.22-22
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• 2001

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2008년도 High Temperature Superconductivity Vol.XVIII
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• pp.63-63
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• 2008

• 한국지반공학회논문집
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• 제32권8호
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• pp.15-25
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• 2016

화성 지역의 저소성 실트 지반에 대한 비배수 전단강도를 평가하기 위해 일련의 실내 및 현장 원위치 시험을 수행하였다. 저소성 지반에 대한 비배수 전단강도 산정을 위한 시험의 적용성을 분석하기 위해서 일축압축시험 및 간이 CU 시험을 실시하였으며, 저소성 실트 지반의 경우, 원지반에서 불교란 시료 채취가 적절하게 이루어진다 할지라고 시료 내부의 잔류유효응력이 매우 감소하게 되어, 일축압축강도가 현저하게 과소평가되는 결과가 얻어졌다. 따라서, 해성 점토 지반과 동일한 조건이 갖추어지도록 원위치 유효상재압으로 재압밀시킨 후, 전단시험에서 얻어진 간이 CU 강도, $s_{u(scu)}$의 75%를 설계 비배수 전단강도로 적용한다면, 원위치 전단강도를 적절하게 평가할 수 있는 것으로 분석되었다.

• Journal of Welding and Joining
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• 제15권4호
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• pp.136-142
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• 1997

In this study, the amorphous foil filler, thickness of 20 - $20~30\mu\textrm{m}$ was made to develop Cu-7.5wt%Mn-7.5wt%Si insert alloy(melting point temperature : solidus line 1003K, liquidus line 1070K). Liquid phase diffusion bonding of 304 stainless steels (STS304), is carried out successfully by using developed Cu-7.5Mn-7.5Si insert alloy. Bonding conditions are taken from bonding pressure of 5MPa, bonding temperatures from 1073K to 1423K varied within 50K and brazing holding times of 0, 30, 60 and 240 minutes. As the results, the tensile strength in the liquid phase diffusion bonding is a little bit lower than that in the solid phase diffusion bonding. The authors find out that the liquid phase diffusion bonding needs lower bonding pressure than the others. Therefore, the liquid phase diffusion bonding had an excellent brazability in which the bonding process showed the typical mechanism of diffusion bonding. In corresponding, the new developed insert alloy of low melting pointed Cu-7.5Mn-7.5Si makes possible brazing between the STS304.