Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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BCB Polymer Dielectrics for Electronic Packaging and Build-up Board Applications

  • Im, Jang-hi (The Dow Chemical Company, Advanced Electronic Materials) ;
  • Phil-Garrou (The Dow Chemical Company, Dow Chemical USA at MCNC) ;
  • Jeff-Yang (The Dow Chemical Company, Dow Chemical USA at MCNC) ;
  • Kaoru-Ohba (The Dow Chemical Company, Dow Chemical japan at Gotemba) ;
  • Masahiko-Kohno (The Dow Chemical Company, Dow Chemical japan at Gotemba) ;
  • Eugene-Chuang (The Dow Chemical Company, Dow Chemical Taiwan at Taipei) ;
  • Jung, Moon-Soo (The Dow Chemical Company, Dow Chemical Korea)
  • Published : 2000.04.01
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Abstract

Dielectric polymer films produced from benzocyclobutene (BCB) formulations (CYCLOTENE＊ family resins) are known to possess many desirable properties for microelectronic applications; for example, low dielectric constant and dissipation factor, low moisture absorption, rapid curing on hot plate without reaction by-products, minimum shrinkage in curing process, and no Cu migration issues. Recently, BCB-based products for thick film applications have been developed, which exhibited excellent dissipation factor and dielectric constant well into the GHz range, 0.002 and 2.50, respectively. Derived from these properties, the applications are developed in: bumping/wafer level packaging, Ga/As chip ILD, optical waveguide, flat panel display, and lately in BCB-coated Cu foil for build-up board. In this paper, we review the relevant properties of BCB, then the application areas in bumping/wafer level packaging and BCB-coated Cu foil for build-up board.

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