• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2008년도 제39회 하계학술대회
• /
• pp.470-471
• /
• 2008

SVL is installed at underground transmission system to protect cables and insulation joint-box from overvoltages caused by lightning, switching, and line-to-ground fault. Domestic underground power system adopts cross bonding type to reduce the induced voltage at sheath, but single-point bonding is required depending the system installation configuration. SVL can be easily broken by overvoltages induced at joint-box because single-point bonding has uneffective system structure to extract fault current. ANSI/IEEE recommends Parallel Ground Continuity Conductor(PGCC) to prevent SVL breakdown. In this paper, EMTP simulation is performed to analyze effects on SVL under PGCC installation when single-line-to-ground fault occurs. The result shows that PGCC and short single-point bonding distance can reduce overvoltages at SVL.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2016년도 추계 학술논문 발표대회
• /
• pp.81-82
• /
• 2016

The present study aims to derive optimal interface treatment conditions for emulating a monolithic construction. The joints in this construction are formed through the bonding shear evaluation method during the placement of ultra-high-performance concrete (UHPC) and normal strength concrete (NSC). The evaluation items include push-off tests for homogeneous UHPC + UHPC and heterogeneous NSC + UHPC. The experimental samples comprised a monolithic placement as the baseline, two levels for the separated placement according to the compression strength of concrete, and five levels for the interface treatment. The increase in the number of grooves and their cross-sectional areas only slightly influenced the bonding shear performance. The optimal interface treatment method for the homogeneous UHPC + UHPC construction grooves was at least 30mm. The heterogeneous NSC + UHPC construction should utilize waterjet roughening to expose the aggregate for the increased roughness.

• 대한치과기공학회지
• /
• 제31권4호
• /
• pp.15-23
• /
• 2009

The aim of this study was to evaluate the bond strength of using a Au bonding agent applied on cp-Ti and nonprecious metal-gold-ceramic system. Metallic frameworks(diameter: 5mm, height: 20mm)(N=56, n=7per group) cast in Ni-Cr alloy, Co-Cr alloy and cp-Ti were obtained using acrylic templates and airborne particle abraded with $110{\mu}m$ aluminum oxide. Au bonding agent was applied on wash opaque firing as intermediate layer. SEM and SEM/EDS line profile were performed on the cutting the cross-section of the metal substrate-porcelain with intermediate Au coating. Groups were tested using shear bond strength(SBS) testing at 0.5mm/min. The mean SBS values for the ceramic-Au layer-metal combination were significantly higher than those ceramic-metal combination. While ceramic-Au layer-cp-Ti combinations failed to increase bond strength instead of using a titanium bonding porcelain. The appication of using Au intermediate layer significantly improve the bond strength combination with metal-ceramic system.

• 소성∙가공
• /
• 제18권4호
• /
• pp.342-346
• /
• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2005년도 추계학술대회 논문집
• /
• pp.393-397
• /
• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 대한치과기공학회지
• /
• 제33권1호
• /
• pp.47-54
• /
• 2011

Purpose: To investigate shear bonding strength between dental zirconia ceramics with different surface treatment and metal bracket. Methods: Zirconia ceramics(LAVA, 3M ESPE, USA) were divided to 4 groups according to their surface treatment; no surface treatment(G1), sand blasting(G2), silane coating(G3), and sand blasting+silane coating(G4). Specimens were bonded to metal bracket using resin bond($Transbond^{TM}XT$, 3M Unitek, USA). Shear bond strength was measured using universal test machine(3366 INSTRON. U.S.A) with cross head speed of 1 mm/min. Microstructural investigation for fracture surface was performed after shear test. Results: Shear bonding strengths of single surface treatment groups (G2 and G3) were higher than no treatment group(G1). Combined Treatment Group (G4) showed the highest shear bond strength of 9.15MPa. Microstructural observation shows that higher shear bonding strength was obtained when debonding was occurred at metal bracket/resin interface rather than zirconia ceramic/resin interface. Conclusion: Surface treatment of zirconia is necessary to obtain higher bonding strength. Combined treatment can be more effective when surface the surfaces are kept clean and homogeneous.

• International Journal of Human Ecology
• /
• 제6권1호
• /
• pp.29-39
• /
• 2005

The purpose of this study was to examine the differences of family leisure motivation and family leisure constraints between German families and Korean families, and analyze the relationship among family leisure motivation, family leisure constraints, and family strengths. The sample in this study consisted of 102 Korean two-parent families with teenagers and 147 German two-parent families with teenagers. The results were as follows: 1) family bonding motivation and rest motivation did not differ significantly between German families and Koran families while educational motivation and obligatory motivation differ significantly between the two. 2) While Korean families were more constrained to intrapersonal constraints, German families were more constrained to interpersonal constraints. 3) Educational motivation, family bonding motivation, rest motivation, interpersonal constraints, and structural constraints were found to be significantly correlated with German family strength while educational motivation, family bonding motivation, rest motivation, and interpersonal constraints were found to be significantly correlated with Korean family strength.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 추계학술대회
• /
• pp.1039-1044
• /
• 2003

Adhesive-bonded joints are widely used in the industry. Recently aircraft applications of adhesive bonding joints have been increased extensively in automobile and air industry. Because adhesives which are available for structural applications have been developed a lot and understanding of adhesive bonding has been improved so much. In this study, as the fundamental research of design of adhesive bonding joints, this study considers specimen shape are affect strength and durability of Al/Polymer lap joints. In this research, cross head speed difference were concerned to evaluate their effects on the adhesive strength. Cross head speed makes a change 0.05mm/min, 0.5mm/min, 5mm/min. The result is load-displacement diagram showed brittleness fracture tendency. Fracture tendency that is shown enough on stress distribution of trigonal single lap joint and trigonal edged single lap joint occur the inside of adhesive.

• 접착 및 계면
• /
• 제7권4호
• /
• pp.28-31
• /
• 2006

Due to the miniaturization of MEMS and microelectronics the joining techniques also have to be adjusted. The dosing technology with viscous adhesives does not permit reproducible adhesive volumes, which are clearly under a nano-liter. A nano-liter means however a diameter of bonding area within the range of several 100 micrometers. Additional, viscous adhesives need a certain time, until they are cross linked or cured. The problem especially in the MEMS is the initial strength, since it gives the time, which is needed for joining an individual adhesive joint. The time up to the initial strength is with viscous, also with fast curing systems, within the range of seconds until minutes. Until the reach of the initial strength, the micro part must be fixed/held. Without sufficient adjustment/clamping it can come to a shift of the micro parts. Also existing micro adhesive bonding processes are not batch able, i.e. the individual adhesive joints of a micro system must be processed successively. In the context of the WCARP III 2006 now an innovative method is to be presented, how it is possible to solve the existing problems with micro bonding. i.e. a method is presented, which is batch able, possess a minimum joining geometry with some micrometers and is so fast that no problems with the initial strength arise. It is a method, which could revolutionize the sticking technology in the micro system engineering.

• 한국전기전자재료학회논문지
• /
• 제21권4호
• /
• pp.354-361
• /
• 2008

The dielectric characteristics of low-k interlayer dielectric materials was fabricated by plasma enhanced chemical vapor deposition (PECVD). BTMSM precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. Manufactured samples are analyzed components by measuring FT/IR absorption lines. Decomposition each Microscopic structures through two-dimensional correlation analysis about mechanisms for the formation of SiOCH in $SiOCH_3$, Si-O-Si and Si-$CH_3$ bonding group and analyzed correlation between the micro-structure of each group. It is a tendency that seems to be growing of Si-O-Ci(C) bonding group and narrowing of Si-O-$CH_3$ bonding group relative to the increasing flow-rate BTMSM. The order of changing sensitivity about changes of flow-rate in Si-O-Si(C) bonding group is cross link mode$(1050cm^{-1})$ $\rightarrow$ open link mode$(1100cm^{-1})\rightarrow$ cage link mode $(1140cm^{-1})$.