• 한국건설순환자원학회논문집
• /
• 제8권4호
• /
• pp.498-505
• /
• 2020

골재는 콘크리트 체적의 약 70~85%를 차지하며, 콘크리트의 건조수축을 저감시켜주는 필수요소이다. 하지만 고층건축물 건설시 천연골재의 높은 하중으로 인해 문제점으로 작용한다. 고층 건물 건설시 하중이 커지게 되면 크리프가 발생하고 지반이 침식될 우려가 있으므로 기초를 크게 설계하고 암반층까지 깊게 내린 지정이나 파일등을 설치해야 하므로 공사비 및 재료비가 늘어 경제적 문제점이 있다. 콘크리트의 하중을 줄이기 위해 골재의 경량화를 진행하고 있다. 하지만 인공경량골재는 천연 골재에 비해 높은 흡수율과 낮은 부착강도로 인해 골재와 페이스트 사이의 계면에 영향을 주고 콘크리트 전체 강도에 영향을 미친다. 따라서 본 연구에서는 천연골재와 경량골재 종류별 계면을 파악하기 위해 비파괴 실험인 EIS측정 장비를 활용하여 전기저항을 측정하는 방식을 채택하였고, 경량골재 겉면을 고로슬래그 코팅을 통해 계면상태의 변화를 실험하였다. 실험결과, 골재 종류별 및 코팅유무에 따른 압축강도의 차이를 보였고, 경량골재 종류별 임피던스 값과 위상각의 차이를 보였다.

• 콘크리트학회논문집
• /
• 제21권3호
• /
• pp.265-273
• /
• 2009

환경문제에 대한 높은 관심으로 친환경 콘크리트의 개발을 위해 많은 연구가 수행되어지고 있으며, 특히 콘크리트 배합시 시멘트 사용량을 줄이기 위한 노력이 계속되고 있다. 시멘트 사용량을 줄이기 위한 방법으로는 포졸란 반응재료들이 혼화재로 사용되고 있다. 우리나라 전역에 널리 매장되어 있는 황토는 친환경 재료로서, 포졸란 반응을 하는 활성황토는 콘크리트의 혼화재로 활용성이 증가하고 있다. 본 연구는 황토와 재생 PET 섬유가 콘크리트의 건조수축에 미치는 영향을 조사하기 위하여 수행되었다. 따라서 본 연구에서는 황토와 재생 PET 섬유를 혼입한 콘크리트 거동 특성을 분석하기 위하여 건조수축 시험을 통해 황토와 재생 PET 섬유를 혼입한 콘크리트의 재료특성을 평가하였다. 실험결과, 외부구속균열 및 자유수축변형 실험을 통하여 혼화재로서 황토가 콘크리트의 건조수축을 줄이는 효과가 있음을 확인하였으며, 재생 PET 섬유는 건조수축에 의한 외부구속균열을 제어하는 효과가 있는 것으로 분석되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국구조물진단유지관리공학회 논문집
• /
• 제20권6호
• /
• pp.91-97
• /
• 2016

초고강도 콘크리트를 이용한 부재의 내화 성능을 검토하기 위해서는 실제부재 단위의 시험에 의한 평가가 요구되고 있다. 그러나 실제부재 실험을 하기 위해서는 재하 능력이 큰 시험 장비가 필요하기 때문에, 재료 모델을 이용한 해석적 연구를 통해 내화 성능을 평가하고 있다. 본 연구에서는 80, 130 및 180 MPa의 초고강도 콘크리트를 대상으로 고온 가열시의 변형 특성을 실험적으로 평가하고 초고강도 콘크리트에 대한 기존 변형 모델의 적용을 검토했다. 그 후, 최소 제곱법에 의해 실험 값과 기존의 변형 모델을 적용한 계산 값의 누적 오차가 가장 작은 상수 값을 도출하고 초고강도 콘크리트에 적용 할 수 있는 변형 모델을 제시했다.

• 소성∙가공
• /
• 제14권4호
• /
• pp.384-391
• /
• 2005

The nickel-based alloy Nimonic 80A possesses the excellent strength, and the resistance against corrosion, creep and oxidation at high temperature. Its products are used in aerospace engineering, marine engineering and power generation, etc. Control of forging parameters such as strain, strain rate, temperature and holding time is important because change of the microstructure in hot working affects the mechanical properties. Change of the microstructure evolves by recovery, recrystallization and grain growth phenomena. The dynamic recrystallization evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range of $0.05\~5s^{-1}$ using hot compression tests. The metadynamic recrystallization and grain growth evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range $0.05,\;5s^{-1}$, holding time range of 5, 10, 100, 600 sec using hot compression tests. Modeling equations are proposed to represent the flow curve, recrystallized grain size, recrystallized fraction and grain growth phenomena by various tests. Parameters in modeling equations are expressed as a function of the Zener-Hollomon parameter. The modeling equation for grain growth is expressed as a function of the initial grain size and holding time. The modeling equations developed were combined with thermo-viscoplastic finite element modeling to predict the microstructure change evolution during hot forging process. The grain size predicted from FE simulation results is compared with results obtained in field product.

• 한국분말재료학회지
• /
• 제24권3호
• /
• pp.235-241
• /
• 2017

Titanium alloys have high specific strength, excellent corrosion and wear resistance, as well as high heat-resistant strength compared to conventional steel materials. As intermetallic compounds based on Ti, TiAl alloys are becoming increasingly popular in the aerospace field because these alloys have low density and high creep properties. In spite of those advantages, the low ductility at room temperature and difficult machining performance of TiAl and $Ti_3Al$ materials has limited their potential applications. Titanium powder can be used in such cases for weight and cost reduction. Herein, pre-forms of Ti-Al-xMn powder alloys are fabricated by compression forming. In this process, Ti powder is added to Al and Mn powders and compressed, and the resulting mixture is subjected to various sintering temperature and holding times. The density of the powder-sintered specimens is measured and evaluated by correlation with phase formation, Mn addition, Kirkendall void, etc. Strong Al-Mn reactions can restrain Kirkendall void formation in Ti-Al-xMn powder alloys and result in increased density of the powder alloys. The effect of Al-Mn reactions and microstructural changes as well as Mn addition on the high-temperature compression properties are also analyzed for the Ti-Al-xMn powder alloys.

• 한국분말재료학회지
• /
• 제9권6호
• /
• pp.441-448
• /
• 2002

Dispersions of non-soluble ceramic particles in a metallic matrix can enhance the strength and heat resistance of materials. With the advent of mechanical alloying it became possible to put the theoretical concept into practice by incorporating very fine particles in a flirty uniform distribution into often oxidation- and corrosion- resistant metal matrices. e.g. superalloys. The present paper will give an overview about the mechanical alloying technique as a dry, high energy ball milling process for producing composite metal powders with a fine controlled microstructure. The common way is milling of a mixture of metallic and nonmetallic powders (e.g. oxides. carbides, nitrides, borides) in a high energy ball mill. The heavy mechanical deformation during milling causes also fracture of the ceramic particles to be distributed homogeneously by further milling. The mechanisms of the process are described. To obtain a homogeneous distribution of nano-sized dispersoids in a more ductile matrix (e.g. aluminium-or copper based alloys) a reaction milling is suitable. Dispersoid can be formed in a solid state reaction by introducing materials that react with the matrix either during milling or during a subsequent heat treatment. The pre-conditions for obtaining high quality materials, which require a homogeneous distribution of small dis-persoids, are: milling behaviour of the ductile phase (Al, Cu) will be improved by the additives (e.g. graphite), homogeneous introduction of the additives into the granules is possible and the additive reacts with the matrix or an alloying element to form hard particles that are inert with respect to the matrix also at elevated temperatures. The mechanism of the in-situ formation of dispersoids is described using copper-based alloys as an example. A comparison between the in-situ formation of dispersoids (TiC) in the copper matrix and the milling of Cu-TiC mixtures is given with respect to the microstructure and properties, obtained.

• 공업화학
• /
• 제7권1호
• /
• pp.194-202
• /
• 1996

기존의 ethylene-vinyl acetate 핫멜트 접착제는 시간에 따른 크리프 특성과 내열성 등의 한계로 사용에 제한이 있으므로 물성의 향상을 위해 폴리아미드계 수지를 이용한 새로운 핫멜트 접착제 개발에 관하여 연구하였다. 폴리아미드 단일중합체의 경우 융점과 용융점도가 매우 높기 때문에 대신 나일론6, 나일론66, 나일론12로 이루어진 삼원공중합체 혹은 블렌딩 수지를 사용하므로써 분자쇄의 규칙성 파괴로 인해 용융점도와 용융점을 강하시킬 수 있었다. 이로써 선택된 수지가 핫멜트 접착제의 베이스 수지로 적절함을 알 수 있었다. 또한 베이스 수지에 테르펜 수지, butyl benzyl phthalate, 파라핀왁스 등을 첨가하여 접착제를 구성함에 따라 유변학적 거동도 쉽게 조절될 수 있었다. 용융점도와 접착제 자체의 인장물성 결과에 따르면 사용된 CM831과 843형 폴리아미드 수지를 약 75/25~50/50의 무게비로 블렌딩함이 최적의 접착력을 나타내리라 평가되었다. 또한 steel간의 접착력 평가 결과 steel 표면의 거칠음 정도가 접착력에 직접 영향을 미치는 결과를 얻었다.

• 한국전기전자재료학회논문지
• /
• 제30권12호
• /
• pp.762-767
• /
• 2017

Mullite ($3Al_2O_3{\cdot}2SiO_2$) has emerged as a promising candidate for high-temperature structural materials due to its erosion resistance, chemical and thermal stabilities, relatively low thermal expansion coefficient, excellent thermal shock and creep resistances, and low dielectric constant. However, since the pure mullite sintering temperature is as high as $1,600{\sim}1,700^{\circ}C$, there is an increasing need for a sintering additive capable of improving the strength characteristics while lowering the sintering temperature. Herein we have tried to obtain the optimal sintering additive composition by adding MgO, $Cr_2O_3$, and $Y_2O_3$ to mullite, followed by sintering at $1,325{\sim}1,550^{\circ}C$ for 2 h. With additives of 2 wt% of MgO, 2 wt% of $Cr_2O_3$, 4 wt% of $Y_2O_3$, A density of $3.23g/cm^3$ was obtained for the sintered body at $1,350^{\circ}C$ upon using 2 wt% MgO, 2 wt% $Cr_2O_3$, and 4 wt% $Y_2O_3$ as additives. The three-point flexural strength of that was 275 MPa and the coefficient of thermal expansion (CTE) was $4.15ppm/^{\circ}C$.