• Journal of Microbiology and Biotechnology
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• v.26 no.12
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• pp.2116-2126
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• 2016

Bacterial biofilms are spatially structured communities that contain bacterial cells with a wide range of physiological states. The spatial distribution and speciation of copper in unsaturated Pseudomonas putida CZ1 biofilms that accumulated 147.0 mg copper per g dry weight were determined by transmission electron microscopy coupled with energy dispersive X-ray analysis, and micro-X-ray fluorescence microscopy coupled with micro-X-ray absorption near edge structure (micro-XANES) analysis. It was found that copper was mainly precipitated in a $75{\mu}m$ thick layer as copper phosphate in the middle of the biofilm, while there were two living cell layers in the air-biofilm and biofilm-medium interfaces, respectively, distinguished from the copper precipitation layer by two interfaces. The X-ray absorption fine structure analysis of biofilm revealed that species resembling $Cu_3(PO_4)_2$ predominated in biofilm, followed by Cu-Citrate- and Cu-Glutathione-like species. Further analysis by micro-XANES revealed that 94.4% of copper were $Cu_3(PO_4)_2$-like species in the layer next to the air interface, whereas the copper species of the layer next to the medium interface were composed by 75.4% $Cu_3(PO_4)_2$, 10.9% Cu-Citrate-like species, and 11.2% Cu-Glutathione-like species. Thereby, it was suggested that copper was initially acquired by cells in the biofilm-air interface as a citrate complex, and then transported out and bound by out membranes of cells, released from the copper-bound membranes, and finally precipitated with phosphate in the extracellular matrix of the biofilm. These results revealed a clear spatial pattern of copper precipitation in unsaturated biofilm, which was responsible for the high copper tolerance and accumulation of the biofilm.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.77-82
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• 2022

During etching process of PCB, the electroplated copper line and seed layer copper have different etching rates and it caused the over etching of copper line as well as undercut of lines. In this research, the effects of etchants composition on copper etching characteristics were investigated. The optimum concentration of hydrogen peroxide and sulfuric acid of etchants were obtained using polarization and OCV (open circuit voltage) analysis for both rolled copper and electroplated copper. The inhibiting effects of different inhibitors were investigated using OCV and ZRA (zero resistance ammeter) analysis. The galvanic current between electroplated copper and seed layer copper were measured using ZRA method. Inhibitors for least galvanic current could be chosen based on galvanic coupling in ZRA analysis.

• Journal of Nutrition and Health
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• v.32 no.6
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• pp.705-712
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• 1999

The purpose of this study was to assess the zinc and copper nutritional status of 102 college women by measuring zinc and copper intake, hematological parameters of zinc and copper, hair zinc and urinary excretion of zinc and copper. The mean zinc intake was 5.5mg(45.8% RDA) with food analysis and 4.5mg(37.8% RDA) with computation from food composition table. The copper intake with food analysis was 2.3mg and 1.2mg with computation. Mean serum zinc concentration was 77.02ug/dl and the proportion of subjects with zinc deficiency estimated by serum zinc(<70ug/dl)was 23.0%. Mean serum copper concentration was 121.80ug/dl and 4.1% of subjects showed serum copper less than 70ug/dl, The mean ceruloplasmin concentration was 22.63mg/dl and the proportion of subjects whose ceruloplasmin was lower than 18-40mg/dl was 6.6%. The mean hair zinc of subjects was 143.8ppm and the mean hair copper was 11.2ppm. The mean urinary excretion of zinc was 0.43mg/day and the proportion of subjects with marginal deficiency estimated by urinary zinc excretion( <0.3mg/day) was 23.3%. The mean urinary copper excretion was 0.044mg/day which was within the normal range(0.01-0.06mg/day). Assessing by zinc content in hair, urine and serum, 22.9-23.3% of college women had bordeline zinc deficiency or zinc deficiency. Whereas 4.1-6.6% of college women was assessed copper deficiency estimated by serum copper and ceruloplasmin.

• Laser Solutions
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• v.16 no.2
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• pp.7-11
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• 2013

Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

• Journal of Distribution Science
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• v.21 no.7
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• pp.41-50
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• 2023

Purpose: The purpose of the research is identified factors influencing the competitiveness of the copper industry in Kazakhstan. Research design, data and methodology: A few studies are dedicated to the analysis in developing countries, particularly Kazakhstan. The algorithm was chosen for research provision: statistical and comparative analysis, correlation, and regression analysis. The data of 1999-2021 obtained from the World Bank, Bureau of National Statistics, National Bank of Kazakhstan. Results: The obtained results demonstrate the trends in the development of the industry since 2000. The development of the copper industry is strongly influenced by the distribution and state of the business environment, economic situation, and trends in the global commodity markets. Conclusions: According to econometric modeling, there is a correlation between the profitability of the copper industry, GDP, copper prices, liquidity, and energy resource prices. Trends in global commodity and energy markets have a significant impact on the state of the industry. Further research should be conducted to include an analysis and forecast of internal factors that may affect the development of the industry, such as copper reserves, condition of fixed assets, government programs, etc. It is also important to examine the correlation with the trends in the development of the global green economy and the revival of the Chinese market.

• Korean Journal of Materials Research
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• v.26 no.3
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• pp.130-135
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• 2016

To alloy high melting point elements such as boron, ruthenium, and iridium with copper, heat treatment was performed using metal oxides of $B_2O_3$, $RuO_2$, and $IrO_2$ at the temperature of $1200^{\circ}C$ in vacuum for 30 minutes. The microstructure analysis of the alloyed sample was confirmed using an optical microscope and FE-SEM. Hardness and trace element analyses were performed using Vickers hardness and WD-XRF, respectively. Diffusion profile analysis was performed using D-SIMS. From the microstructure analysis results, crystal grains were found to have formed with sizes of 2.97 mm. For the copper alloys formed using metal oxides of $B_2O_3$, $RuO_2$, and $IrO_2$ the sizes of the crystal grains were 1.24, 1.77, and 2.23 mm, respectively, while these sizes were smaller than pure copper. From the Vickers hardness results, the hardness of the Ir-copper alloy was found to have increased by a maximum of 2.2 times compared to pure copper. From the trace element analysis, the copper alloy was fabricated with the expected composition. From the diffusion profile analysis results, it can be seen that 0.059 wt%, 0.030 wt%, and 0.114 wt% of B, Ru, and Ir, respectively, were alloyed in the copper, and it led to change the hardness. Therefore, we verified that alloying of high melting point elements is possible at the low temperature of $1200^{\circ}C$.

• Journal of Nutrition and Health
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• v.32 no.3
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• pp.296-306
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• 1999

This study was carried out to prepare a copper database of Korean foods which can be used in calculating copper intake from dietary data, and to evaluate the copper nutritional status of Koran adults living in rural areas by dietary intake and serum copper concentrations. A copper database for 1,176 Korean foods was constructed (1) by analysing 112 Korean foods which are frequently consumed by Korean adults living in rural areas, (2) by adapting values form food composition databases from other countries-320 items from the University of Minnesota database, 201 items from the USAD database, and 25 items from U.K. database, and (3) by imputing values from similar foods for 518 food items. Copper intake of 2,034 Korean adults over the age of 30 living in Yeonchongun was Kyunggi province, Korea was estimated by 24-hour recall method. Mean daily copper intake of subjects was 0.98mg. Mean daily intake level of males was 1.11mg which was significantly higher than that of females, 0.88mg. There was a significant difference in the distribution of subjects by the level of copper intake and sex(p<0.05). Mean serum copper concentration was 14.8umol/1 and the percentage of subjects with low, adequate, and high levels of copper concentration were 23.9%, 69.4%, and 6.6%, respectively. The two food groups which contributed most to the dietary copper intake of subjects were cereals and grain products, and vegetables, supplying 46.2% and 12.7% of total copper intake, respectively. Individuallym, rice contributed most, suppling 31% of total copper intake, followed by soybean curd, starch vermicle, barley, etc. Plant foods contributed to 82.1% of the total copper intake. In summary, results of this study show that copper intake of Korean adults living in rural areas is low, and that dietary sources of copper are mainly plant foods. Serum levels of copper in the subjects were relatively normal. The copper database for Korean foods constructed in present study will be a valuable tool for the as-yet limited assessment of copper intake of Koreans. Such studies will contribute to the establishment of a dietary of a dietary allowance of copper and the relationship of copper nutriture and chronic diseases in Koreans.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.3
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• pp.547-553
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• 1990

With alumina ceramics to copper brazement of cylindrical shape, the thermal stress analysis was carried out by finite element method. Elastic and plastic behaviour was considered to copper, but only elastic behaviour was considered to alumina. Also material properties of alumina and copper were considered in not constant values but variable functions dependent on temperature. The result of analysis is shown that maximum tensile longitudinal stress is occurred at perimeter of alumina side interface and maximum compressive radial and tangential stresses are occurred at center of alumina side interface. Because of bending effect, tensile raidial and tangential stresses are occurred at near bottom of alumina, far from interface.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.82-88
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• 2002

Copper bus-bar is made by drawing process and used in many part of industry. Ohen design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper it is analyzed to determine shrink fit value by shrink fit analysis program which is used with APDL/UIDL language in a commercial FEM package, ANSYS. The shrink fit analysis has been developed that enables optimal desist of the dies taking into account the elastic deflections. Elastic deflection is generated in shrink fitting the die inserts and that caused by the stresses generated using DEFORM software for drawing process analysis. This data can be processed as load input data fir a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.

• Nuclear Engineering and Technology
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• v.55 no.8
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• pp.2742-2746
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• 2023

The corrosion behavior of copper immersed in dilute oxychloride solution (100 mM) was studied through surface investigation and in-situ monitoring of open-circuit potential. The copper corrosion was initiated with copper dissolution into a form of CuCl^-₂, resulting in mass decrease within the first 40 h of immersion. This was followed by a hydrolysis reaction initiated by the CuCl^-₂ at the copper surface, after which oxide products were formed and deposited on the surface, resulting in a mass increase. The formation of nucleation sites for copper oxide and its lateral extension during the corrosion process were examined using focused ion beam (FIB)-scanning electron microscopy (SEM). The presence of metastable compounds such as atacamite (CuCl₂·3Cu(OH)₂) on the corroded copper surface was revealed by X-ray photoelectron spectra (XPS) and transmission electron microscopy (TEM)-energy dispersive spectrometry (EDS) analysis.