• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1529-1534
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• 2012

In this study, tensile tests for 12-${\mu}m$-thick copper thin foils were performed by using the DIC method. The DIC method provided precise stress-strain curves for thin film materials, and a commercial inkjet printer can be simply and effectively used for printing speckle patterns on the specimen of Cu thin films whose surface contrast is too low to apply the DIC method. The mechanical properties of Cu thin foils obtained in this study are as follows: elastic modulus E = 89.2 GPa, 0.2% offset yield stress $S_{0.2%}$= 232.8 MPa, tensile strength $S_u$= 319.2 MPa, elongation at fracture ${\varepsilon}_f$=16.8 %, and Poisson's ratio ${\nu}$= 0.34.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.313-313
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• 2008

Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.914-917
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• 2005

The paper proposes a new sonic resonance test for a dynamic elastic constant measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI)and Euler-Bernoulli equation. Previous measurement technique of dynamic elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The TA-ESPI dynamic elastic constant measurement technique is able to give high accurate elastic modulus of materials through a simple experiment and analysis.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.951-956
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• 2010

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.747-754
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• 2008

Recently, the requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. Therefore, it is important to examine the surface state of substrate depending on the processing parameter during the anodic oxidation. This study investigated the effect of the various electrolyte concentrations on anodizing of titanium anode prior to copper electrodeposition. Different surface morphology of anodized titanium was obtained at different electrolytic concentration 0.5 M to 3.0 M. In addition, the effect that the surfaces and the electrical characteristics on the electrodeposited copper layer was observed. In this study, surface anodized in the group containing 0.5M $H_2SO_4$ shows more uniform copper crystals with low surface roughness. the surface roughness and sheet resistance for 0.5M $H_2SO_4$ group were $1.353{\mu}m$ and $0.104m{\Omega}/sq$, respectively.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.37-41
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• 2009

We observe the proton signals produced by laser interaction with thin-foil targets of polyimide and of copper. We change the thickness of the polyimide target to $7.5{\mu}m$, $12.5{\mu}m$, and $50{\mu}m$. High-energy protons with the maximum energy of ${\sim}2.3\;MeV$ from $7.5{\mu}m$ thick polyimide are observed. This proton beam with the maximum energy of multi-MeV has various applications such as a proton shadowgraphy.

• Journal of the Korean Ceramic Society
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• v.51 no.6
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• pp.549-553
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• 2014

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.90-97
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• 2001

An electronic speckle pattern interferometry (ESPI) system for measuring tensile properties under micro-tensile testing has been developed. The system consists of an optical system and an image processing system. In the optical system, optical components for measurement of in-plane deformation are arranged on the path of He-Ne laser. In the image processing system, the window-based program for acquiring speckle pattern interferometric image was developed and deformation in a small specimen is continuously evaluated during the test. Using this system, tensile strain of copper foil was measured during tensile testing. Tensile specimen had the thickness and width of 22 and 500 ${\mu}{\textrm}{m}$, respectively. Tensile properties, including the elastic modulus, yielding strength and tensile strength, of the copper were evaluated and also plastic exponent and coefficient in the Ramberg-Osgood relationship were evaluated from the stress-strain curve.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.