• Journal of information and communication convergence engineering
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• 제8권1호
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• pp.99-102
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• 2010

Large-scaled area and aligned copper oxide nanowires have been synthesized by a vapor-phase approach to the facial synthesis of copper oxide nanowires supported on the surface of a copper gasket. The effects of annealing temperature and time were investigated. Long and aligned nanowires can only formed within a narrow temperature range from 400 to $500^{\circ}C$ for 4 hrs. Annealing copper gasket in static air produces large-area, uniform, but not well vertically aligned nanowires along the copper gasket surface. The surface of copper gasket is converted into bicrystal CuO nanowires was observed after the copper gasket is annealed under static air condition.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.399-405
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• 2020

Hollow copper oxide/multi-walled carbon nanotubes (CuO/MWCNT) composites were fabricated via an optimized infiltration-reduction-oxidation method, which is more facile and easy to control. The crystalline structure and morphology were characterized by X-ray diffraction (XRD), and transmission electron microscopy (TEM). The as-prepared CuO/MWCNT composites deliver an initial capacity of 612.3 mAh·g^-1 and with 80% capacity retention (488.2 mAh·g^-1) after 100 cycles at a current rate of 0.2 A·g^-1. The enhanced electrochemical performance is ascribed to the better electrical conductivity of MWCNT, the hollow structure of CuO particles, and the flexible structure of the CuO/MWCNT composites.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.55-59
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• 2020

Copper Oxide (CuO) films were deposited on the n-type silicon wafer by rf magnetron sputtering for heterojunction solar cells. And then the samples were treated as a function of the annealing temperature (300-600℃) in a vacuum. Their electrical, optical and structural properties of the fabricated heterojunction solar cells were then investigated and the power conversion efficiencies (PCE) of the fabricated p-type copper oxide/n-type Si heterojunction cells were measured using solar simulator. After being treated at temperature of 500℃, the solar cells with CuO film have PCE of 0.43%, Current density of 5.37mA/㎠, Fill Factor of 39.82%.

• 마이크로전자및패키징학회지
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• 제20권1호
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• pp.27-31
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• 2013

Copper-oxide (CuO) thin films were prepared by reactive sputtering of Cu onto Si wafers and characterized using a statistical design of experiments approach. The most significant factor in controlling the electrical resistivity and deposition rate was determined to be the $O_2$ fraction. The deposited CuO thin films were characterized in terms of their physical and chemical properties, using X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), X-ray diffraction (XRD), and 4-point resistance measurements. The deposited copper thin films were characterized by XPS and XRD analyses to consist of $Cu^{2+}$. The CuO thin films of highest resistivity exhibited superior rectifying responses with regard to n-type Si wafers, with a current ratio of $3.8{\times}10^3$. These superior responses are believed to be associated with the formation of a charge-depletion region originating from the p-type CuO and n-type Si materials.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.52.1-52.1
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• 2009

Cupric oxide (CuO) is a p-type semiconductor with band gap of ~1.7 eV and reported to be suitable for catalysis, lithium-copper oxide electrochemical cells, and gas sensors applications. The nanoparticles, plates and nanowires of CuO were found sensing to NO2, H2S and CO. In this work, we report about the comparison about hydrogen sensing of nano thin film and nanowires structured CuO deposited on single-walled carbon nanotubes (SWNTs). The thin film and nanowires are synthesized by deposition of Cu on different substrate followed by oxidation process. Nano thin films of CuO are deposited on thermally oxidized silicon substrate, whereas nanowires are synthesized by using a porous thin film of SWNTs as substrate. The hydrogen sensing properties of synthesized materials are investigated. The results showed that nanowires cupric oxide deposited on SWNTs showed higher sensitivity to hydrogen than those of nano thin film CuO did.

• 한국대기환경학회지
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• 제23권1호
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• pp.64-73
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• 2007

The catalytic activity of transition metals (Cu, Co, Mn, Fe and Ni) supported on ${\gamma}-Al_2O_3$ for the oxidation of toluene was investigated in the microreactor of fixed-bed type. The catalytic activity of transition metals for the oxidation of toluene turned out to be increasing in the order of Ni$Cu/{\gamma}-Al_2O_3$ catalysts for the oxidation of toluene increased with the increasing loadings of copper, reached the maximum activity at 5% loadings of copper, and decreased with higher loadings of copper in the catalysts. The activity of $Cu/{\gamma}-Al_2O_3$ catalysts for the oxidation of toluene decreased with the increasing calcination temperatures. This might result from the decreasing surface area of catalysts due to the sintering of copper oxide as well as ${\gamma}-Al_2O_3$ supports. The 5wt% $Cu/{\gamma}-Al_2O_3$ catalysts calcined at $400^{\circ}C$ for 4 hrs in the air showed the highest activity for the oxidation of toluene. Mutual inhibition was observed for the binary mixture of toluene and xylene. The activity of the easy-to-oxidize toluene was greatly decreased while the difficult-to-oxidize xylene was slightly decreased in the binary mixture of toluene and xylene. It might suggest that the inhibition of toluene and xylene in the binary mixture resulted from the competitive adsorption for the adsorbed oxygen on the catalytic surface.

• 한국재료학회지
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• 제11권6호
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• pp.527-532
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• 2001

O$_2$plasma와 H(hfac)을 이용한 Cu 박막의 건식 식각을 조사하였다. 휘발성이 큰 Cu(hfac)$_2$와 $H_2O$를 탈착시키기 위하여 $O_2$ Plasma를 이용한 Cu 박막의 산화와 생성된 Cu 산화막을 H(hfac)과의 반응으로 제거하는 공정으로 식각을 수행하였다. Cu 박막의 식각율은 50-700 /min의 범위를 보였으며, 기판온도, H(hfac)/O$_2$ 유량비, plasma power에 따라 변하였다. Cu 박막의 식각율은 기판온도 215$^{\circ}C$보다 높은 온도구간에서 RF power가 증가함에 따라 증가하였고, 산화 공정과 H (hfac)과의 반응이 균형을 이루는 최적의 H (hfac)/O$_2$ 유량비는 1:1임을 확인하였다. Ti mask를 사용한 Cu Patterning은 유량비 1 : 1, 기판온도 25$0^{\circ}C$에서 실시하였고, 30$^{\circ}$외 taper slope를 갖는 등방성 etching profile을 얻을 수 있었다. Taper angle을 갖는 Cu 건식 patterning은 고해상도의 대면적 thin film transistor liquid-crystal(TFT-LCDs)를 위래 필요한 것으로써 기판온도, RF power, 유량비를 조절한 one-step 공정으로부터 성공적으로 얻을 수 있었다.

• Journal of Electrochemical Science and Technology
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• 제12권2호
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• pp.246-256
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• 2021

Mo,Cu-doped CeO₂ (CMCuO) nanopowders were synthesized by the nitrate-fuel combustion method aiming to improve the electrical and electrochemical properties of its Mo-doped CeO₂ (CMO) parent by the addition of copper. An electrical conductivity of ca. 1.22·10^-2 S cm^-1 was measured in air at 800℃ for CMCuO, which is nearly 10 times higher than that reported for CMO. This increase was associated with the inclusion of copper into the crystal lattice of ceria and the presence of Cu and Cu₂O as secondary phases in the CMCuO structure, which also could explain the increase in the charge transfer activities of the CMCuO based anode for the hydrogen and carbon monoxide electro-oxidation processes compared to the CMO based anode. A maximum power density of ca. 120 mW cm^-2 was measured using a CMCuO based anode in a solid oxide fuel cell (SOFC) with YSZ electrolyte and LSM-YSZ cathode operating at 800℃ with humidified syngas as fuel, which is comparable to the power output reported for other SOFCs with anodes containing copper. An increase in the area specific resistance of the SOFC was observed after ca. 10 hours of operation under cycling open circuit voltage and polarization conditions, which was attributed to the anode delamination caused by the reduction of the Cu₂O secondary phase contained in its microstructure. Therefore, the addition of a more electroactive phase for hydrogen oxidation is suggested to confer long-term stability to the CMCuO based anode.

• 한국재료학회지
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• 제23권1호
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• pp.1-6
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• 2013

A simple thermal oxidation of Cu thin films deposited on planar substrates established a growth of vertically aligned copper oxide (CuO) nanorods. DC sputter-deposited Cu thin films with various thicknesses were oxidized in environments of various oxygen partial pressures to control the kinetics of oxidation. This is a method to synthesize vertically aligned CuO nanorods in a relatively shorter time and at a lower cost than those of other methods such as the popular hydrothermal synthesis. Also, this is a method that does not require a catalyst to synthesize CuO nanorods. The grown CuO nanorods had diameters of ~100 nm and lengths of $1{\sim}25{\mu}m$. We examined the morphology of the synthesized CuO nanorods as a function of the thickness of the Cu films, the gas environment, the oxidation time, the oxidation temperature, the oxygen gas flow rate, etc. The parameters all influence the kinetics of the oxidation, and consequently, the volume expansion in the films. Patterned growth was also carried out to confirm the hypothesis of the CuO nanorod protrusion and growth mechanism. It was found that the compressive stress built up in the Cu film while oxygen molecules incorporated into the film drove CuO nanorods out of the film.

• 한국재료학회지
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• 제27권4호
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• pp.221-228
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• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.