• Journal of the Korean Wood Science and Technology
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• v.33 no.6 s.134
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• pp.95-100
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• 2005

The using amount of preservative-treated wood equipments has been increased. Specially, chromate copper arsenate (CCA) has been widely used to exterior wood. We are faced to the disposal problem after service period of CCA treated wood due to its toxic heavy metals. For the disposal of end-used treated wood, land-filling and incinerating methods are mainly applied. The essential problem of incinerating is an arsenic release into atmosphere. Low pyrolysis is suggested as the methods of protecting arsenic release during incineration. The heavy metals were recovered after combustion of the treated wood at the low temperature which arsenic can not released. The recovery amounts of effectiveness compounds was determined in various solvents (citric acid, nitric acid, sulfuric acid, acetic acid, phosphoric acid) and different temperature (300, 400, $500^{\circ}C$). The higher temperature was applied, the more copper was recovered. The chromium was difficult to be recovered on the carbonized CCA treated wood at 0.5% acid concentration. The recovery mass of arsenic decreased on the higher combustion treated wood. The recovery of chromium was difficult due to the chemical change of the chromium arsenate during pyrolysis.

• Journal of the Korean Society of Industry Convergence
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• v.5 no.3
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• pp.165-171
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• 2002

The thermosyphon has been used as a heat transmission device in the heat recovery of low level energy and cooling for heat generating equipments. Many studies on the working fluids and wicks have been reported to improve the heat transfer efficiency of the thermosyphon. A low temperature heat pipe with acetone is chosen in the present study to compare the heat transfer characteristics due to pouring amount of working fluid, magnitude of power supplied and tilt angles. The thermosyphon made ⵁ$15.88{\times}0.8t{\times}600mm$ of copper, evaporation section 200mm, insulation section 25mm, condensation 375mm. Heat transfer rate of the thermosyphon increase as magnitude of power supplied increase and observe dry out phenomenon at 5~10% of pouring amount of working fluid. So thermosyphon at the 150kJ/s judged to need 12% or more. Heat transfer rate of the thermosyphon have nothing to do with tilt angles. Dry out phenomenon of the thermo syphon makes it possible that a low temperature thermosyphon may be used to control temperature and heat transfer of a system when the critical quantity of a working fluid is supplied in the thermosyphon.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Journal of Radiopharmaceuticals and Molecular Probes
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• v.1 no.1
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• pp.23-30
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• 2015

Radioisotopes emitting low-range highly ionizing radiation such as ${\beta}$-particles are of increasing significance in internal radiotherapy. Among the ${\beta}$-particle emitting radioisotopes, $^{67}Cu$ is an attractive radioisotope for various nuclear medicine applications due to its medium energy ${\beta}$-particle, gamma emissions, and 61.83-hour half-life, which can also be used with $^{64}Cu$ for PET imaging. The production and application of the ${\beta}$-emitting radioisotope $^{67}Cu$ for therapeutic radiopharmaceutical are outlined, and different production routes are discussed. A survey of copper chelators used for antibody labeling is provided. It has been produced via proton, alpha, neutron, and gamma irradiations followed by solvent extraction, ion exchange, electrodeposition. Clinical studies using $^{67}Cu$-labelled antibodies in lymphoma, colon carcinoma and bladder cancer patients are reviewed. Widespread use of this isotope for clinical studies and preliminary treatments has been limited by unreliable supplies, cost, and difficulty in obtaining therapeutic quantities.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.6
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• pp.443-453
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• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.11
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• pp.1051-1059
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• 2004

Two phase thermosyphone loop for electronics cooling are designed and manufactured to test its performance under the partial load and low environment temperature conditions. The thermosyphone device has six evaporators connected parallel for the purpose of cooling six power amplifier units (PAU) independently. The heater modules for simulating PAUs are adhered with thermal pad to the evaporator plates to reduce the contact resistance. There are unbalanced distributions of liquid refrigerant in the differently heated evaporators due to the vapor pressure difference. To reduce the vapor pressure differences caused by partial heating, two evaporators are connected each other using the copper tube. The pressure regulation tube successfully reduces these unbalances and it is good candidates for a field distributed systems. Under the low environment temperature operating condition, such as $-30^{\circ}C$, there may be unexpected subcooling in condenser. It leads the very low saturation pressure, and under this condition there exists explosive boiling in evaporator. The abrupt pressure rise due to the explosive boiling inhibits the supplement of liquid refrigerant to the evaporator for continuous cooling. Finally the cooling cycle will be broken. For the normal circulation of refrigerant there may be an optimum cooling air flow rate in condenser to adjust the given heat load.

• Bulletin of the Korean Chemical Society
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• v.31 no.5
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• pp.1339-1342
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• 2010

$^{31}P$ NMR and ESI-MS studies of $Cu^{2+}$ binding to Fenitrothion (FN) were performed by experimentally and theoretically. The calculated $^{31}P$ NMR chemical shifts for FN-$Cu^{2+}$ complexes are in good agreement with experimental chemical shifts in order, and the results present an important information for organophosphorus pesticide metal complexes. ESI-MS and low energy CID MS/MS experiments of FN-$Cu^{2+}$ complexes combined with accurate mass measurements give insight into the metal localization and allow unambiguous identification of fragments and hydrolysis products.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.12
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• pp.1010-1017
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• 2011

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.439-442
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• 2004

Timing delays due to VLSI circuit interconnects strongly depend on neighbor line switching patterns as well as input transition time. Considering both the input transition and input switching pattern, a new analytical timing delay model is developed by using the decoupling technique of transfer multi-coupled lines into an effective single line. The analytical timing delay model can determine the timing delay of multi-coupled lines accurately as well as rapidly. It is verified by using DSM-Technology ($0.1{\mu}m$ /low-k copper-based process) that the model has excellent agreement with the results of SPICE simulation.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1994-1996
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• 2002

This paper reports a novel high-speed fluid injection system employing a simple magnetic micoractuator. This magnetic microacutator consists of current carrying copper beams and permanent magnet under the beams. There were many efforts to magnetic microactuator realization using conducting coils [1-2]. Even though many of magnetic microactuators were successfully fabricated and tested, it is true that most them suffer complex fabrication processes and thus higher production costs than electrostatic counterparts. In this research, efforts were concentrated on the microactuator realization that has simple structure, low production cost, and mass production possibility.