• Journal of Ocean Engineering and Technology
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• v.15 no.2
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• pp.88-93
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• 2001

In this paper, joints of Cu-1Cr-0.1Zr alloy to STS316L were performed by friction welding method. Particularly, Cu-1Cr-0.1Zr alloy is attractive candidate as nuclear power plant material and exibit the best combination of high strength and good electrical and thermal conductivity of any copper alloy examined. The stainless steel is a structural material while copper alloy acts as a heat sink material for the surface heat flux in the first wall. So, in this paper, not only the development of optimizing of friction welding with more reliability and more applicability but also the development of in-process real-time weld quality (such as strength and toughness) evaluation technique by acoustic emission for friction welding of such nuclear reactor component of Cu-1Cr-0.1Zr alloy to STS316L steel sere performed.

• Transactions on Electrical and Electronic Materials
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• v.16 no.3
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.322-327
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• 2004

Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.49-53
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• 2005

The objective of this research was to establish the size limitation of micro metal forming and analyze the formability of foil. Flat-rolled ultra thin metallic copper foil($3{\mu}m$ in thickness) was used as a forming material and foil was annealed to improve the formability at the temperature of $385^{\circ}C$. Forming die was fabricated by using etching technique of DRIE(deep reactive ion etching) and HNA isotropic etching. For the forming die and coupe. foil were vacuum packed and the forming was conducted as applying hydrostatic pressure of 250MPa to the vacuum packed unit. We successfully obtained the micro channels of $12\~14{\mu}m$ width and $9{\mu}m$ depth from micro forming process we designed. We also investigated the thickness strain distribution of foil from experiment and FE simulation result. Micro channels had a good formability of smooth surface and size accuracy. We expect that micro metal forming technology will be applied to production of micro parts.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.8 no.4
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• pp.213-220
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• 1979

A number of methods has been developed for calculation of heat transfer in the vertical round tube under conditions of forced convection with uniform heat flux at wall. I would like to express hereby one of applications of this study in the design of heat exchanger instruments for water flow at $15.8^{\circ}C(p_r=8)$ used frequently in our daily life. Also all the results are investigated for forced convective heat transfer in the case of heated water-flow at uniform wall heat flux in the vortical round copper tube, where the ratio of length to diameter will be 44. They are well in agreement with Gratz and Kraussold equation respectively in laminar and transition flow range. In turbulent flow in the range from Re=10,000 to 65,000, the experimental formula Is show as follows ; Nu=0.023 $R_e^{0.814}\;P_r^{0.4}$. And this is agreed with Dittus - Boelter equation when Reynolds number exponent increases from 0.80 to 0.814.

• Korea Trade Review
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• v.47 no.4
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• pp.177-195
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• 2022

This study analyzed the volatility spillover effect between international non-ferrous metal futures markets using the BEKK-GARCH model. Statistical data are futures price data of copper (CU), aluminum (AL), nickel (NI), tin (SN) from Shanghai Futures Exchange (SHFE) and London Metal Exchange (LME) from April 1, 2015 to December 31, 2021. Combining the research results, first, in the case of copper, aluminum, and nickel, it was found that there was a two-way volatility spillover effect between the Shanghai and London markets, and the international influence of the London market was greater. Second, in the case of the tin, it was found that the Shanghai market has a volatility spillover effect on the London market from stage I, and it is strengthened in stage II. Third, in the case of nickel, it was found that there was a two-way volatility spillover effect in the first stage, but in the second stage, the London market had a unidirectional volatility spillover effect with respect to the Shanghai market. This study confirmed that China's influence in the international non-ferrous metal futures market is gradually increasing. In addition, it suggested that international investors can engage in arbitrage and hedging using China's non-ferrous metal futures market.

• Nuclear Engineering and Technology
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• v.56 no.6
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• pp.2367-2374
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• 2024

In this paper, based on the need for high-strength connections between all-tungsten-oriented plasma materials and thermal sinking materials of copper and its alloys in nuclear fusion devices, a study on the effect of tungsten surface laser micro structuring on the interfacial bonding properties of W/Cu joints was carried out. In the experiment, the connectors were prepared by vacuum fusion infiltration technology, and the effects of microgroove structure on the mechanical and thermal conductivity of W/Cu connectors were investigated under different parameters (including microgroove pitch, microgroove depth, and microgroove taper). The maximum shear strength is 126.0 MPa when the pitch is 0.15 mm and the depth is 34 ㎛. In addition, the negative taper structure, i.e., the width of the entrance of the microstructure is smaller than the width of the interior of the microstructure, is also investigated. The shear tests show that there is an approximately linear relationship between the shear strength of W/Cu and taper. Compared with the positive taper, the shear strength of the samples with the same morphological density and depth of the tungsten surface is significantly higher.

• BMB Reports
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• v.40 no.5
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• pp.697-707
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• 2007

Cytochrome $cbb_3$ oxidase is a member of the heme-copper oxidase superfamily that catalyses the reduction of molecular oxygen to the water and conserves the liberated energy in the form of a proton gradient. Comparison of the amino acid sequences of subunit I from different classes of heme-copper oxidases showed that transmembrane helix VIII and the loop between transmembrane helices IX and X contain five highly conserved polar residues; Ser333, Ser340, Thr350, Asn390 and Thr394. To determine the relationship between these conserved amino acids and the activity and assembly of the $cbb_3$ oxidase in Rhodobacter capsulatus, each of these five conserved amino acids was substituted for alanine by site-directed mutagenesis. The effects of these mutations on catalytic activity were determined using a NADI plate assay and by measurements of the rate of oxygen consumption. The consequence of these mutations for the structural integrity of the $cbb_3$ oxidase was determined by SDS-PAGE analysis of chromatophore membranes followed by TMBZ staining. The results indicate that the Asn390Ala mutation led to a complete loss of enzyme activity and that the Ser333Ala mutation decreased the activity significantly. The remaining mutants cause a partial loss of catalytic activity. All of the mutant enzymes, except Asn390Ala, were apparently correctly assembled and stable in the membrane of the R. capsulatus.

• Asian-Australasian Journal of Animal Sciences
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• v.19 no.9
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• pp.1322-1327
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• 2006

An experiment was conducted to investigate the effects of supplemental copper (Cu) chelates (methionine, chitosan and yeast) on the performance, nutrient digestibility, serum IgG level, gizzard erosion, Cu content in the liver and excreta and the level of total cholesterol in breast muscle and serum of broiler chickens. Two hundred and forty hatched broiler chickens (Ross$^{(R)}$ 208) were assigned to 4 treatments: control, 100 ppm Cu in methionine chelate (Met-Cu), 100 ppm Cu in chitosan chelate (Chitosan-Cu) and 100 ppm Cu in yeast chelate (Yeast-Cu). Each treatment had six replicates of 10 (5 males+5 females) birds each. Weight gain and feed intake tended to be higher in Cu chelate treatments than the control; weight gain was significantly higher in the Met-Cu chelate treatment and feed intake was significantly higher in the Yeast-Cu chelate treatment than the control (p<0.05). Feed/gain was significantly different between treatments in which Met-Cu was lowest followed by the control, Chitosan-Cu and Yeast-Cu. DM availability was increased by Cu chelates among which chitosan-Cu showed the highest DM availability. Cu chelates supplementation tended to increase gizzard erosion index, and Cu content in the liver was highest in the Met-Cu treatment. Supplementation of Cu chelates tended to decrease total cholesterol level in breast muscle and serum but tended to increase the level of HDL in serum. It was concluded that dietary supplementation of 100 ppm Cu in chelates increased weight gain, feed intake and DM availability. Met-Cu was more effective than Chitosan-Cu or Yeast-Cu in improving productivity of broiler chickens.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.6
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• pp.443-453
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• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.