• Steel and Composite Structures
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• v.43 no.5
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• pp.661-672
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• 2022

The solution of contact problems is extremely important as we encounter many situations involving such problems in our daily lives. One of the most important parameters effective in solving contact problems is the materials of the parts in contact. While it is relatively easy to solve the contact mechanics of the systems created with traditional materials with a homogeneous microstructure and mechanical distribution, it may be more difficult to solve the contact problem of new generation materials that do not show a homogeneous distribution. As a result of this situation, it is seen that studies on contact problems of materials that do not exhibit such a homogeneous internal structure and mechanical properties are extremely limited in the literature. In this context, in this study, analytical and numerical analyzes of a contact problem created using functionally graded materials were carried out and the results were evaluated mutually. It has been decided that the contact areas and contact pressures acquired from numerical method are reasonably appropriate with the results obtained from the analytical method.

• Structural Engineering and Mechanics
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• v.53 no.5
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• pp.1051-1066
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• 2015

The study aims on the effect of material dependency in elastic- plastic contact models by contact analysis of sphere and flat contact model and wheel rail contact model by considering the material properties without friction. The various materials are selected for the analysis based on Young's modulus and yield strength ratio (E/Y). The simulation software 'ANSYS' is employed for this study. The sphere and flat contact model is considered as a flattening model, the stress and strain for different materials are estimated. The simulation of wheel-rail contact model is also performed and the results are compared with the flattening model. The comparative study has also been extended for finding out the mean contact pressure for different materials the E/Y values between 150 and 660. The results show that the elastic-plastic contact analysis for materials up to E/Y=296.6 is depend on the nature of material properties and also for this material the mean contact pressure to yield strength reaches 2.65.

• Journal of Electrical Engineering and Technology
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• v.12 no.6
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• pp.2348-2352
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• 2017

The electrical contact characteristics including temperature rise, contact resistance and arc erosion rate of the $Ag-SnO_2$ materials with increased $SnO_2$ content were investigated during the repeated make-and-break operations. The thickness of arcing melting layer reduces by half and the arc erosion rate decreases more than 70% under 10000 times operations at AC 10 A with the $SnO_2$ content increasing from 15 wt.% to 45 wt.%, on one hand, temperature rise and contact resistance increase obviously but could be reduced to the same order of conventional $Ag-SnO_2$ materials by increasing the contact force. The microstructure evolution and the effect of $SnO_2$ on the arc erosion, contact resistance were analyzed.

• Structural Engineering and Mechanics
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• v.3 no.3
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• pp.289-297
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• 1995

A finite element algorithm for consideration of contact constraints is presented. It is characterized by introducing the geometric constraints, resulting from contact conditions, directly into the algebraic system of equations for the incremental displacements of an incremental iterative solution procedure. The usefulness of the proposed algorithm for efficient solutions of contact problems involving large displacements and large strains is demonstrated in the numerical investigation.

• Journal of Powder Materials
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• v.14 no.5
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• pp.327-332
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• 2007

In a view point of environment, the advanced electric contact material without environmental load element such as cadmium has to be developed. Extensive studies have been carried out on $Ag-SnO_2$ electric contact material as a substitute of Ag-CdO contact materials. In the present study, powder metallurgy including compaction and sintering is introduced to solve the incomplete oxidation problems in manufacturing process of $Ag-SnO_2$ electrical contact material. The $Ag-SnO_2$ contact material, fabricated in this study, was actually set in an electric switchgear of which working voltage is 462V and current is between 25 and 40A, for the purpose of testing its performance. As a result, it exceeded the existing Ag-CdO contact materials in terminal-temperature ascent and main contact resistance.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.31 no.6B
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• pp.541-550
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• 2011

This study sets the goal to improve effectively water quality of stream by complementing the weak points of the gravel contact oxidation process to use the inverted siphon curved channel system in free overfall of serial contact materials. The size of the current system can be diminished by expanding contact time, and the materials' replacement can be made easier when their gap are closed through the filtering boxes of contact materials. This system also has been developed into a construction method in which mixed and serial contact materials can be employed by using just the conventional single contact materials. It was verified the improvement ability of water quality of this system, during the simulation test at Tandong stream in Daejeon. The results of the verification of water quality improvement through several experiments in field were measured as follows : it showed to reduce about the averaged 55~83% higher than 60~75%, the internal planned goal of water quality improvement facilities.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.1
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• pp.61-70
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• 2003

The purpose of this study was to investigate the contact angles and wettability of conventional dental stones and improved dental stones and newly developed dental stones on several impression materials. Materials included in this study were several dental stones and newly developed dental stone ; 2 type III stones (Snow Rock, New Diastone), 6 type IV stones(Crystal Rock, Vel Mix, Fuji Rock, Tuff Rock, Resin Rock and newly developed dental stone) and 1 type V stone (Die Keen). Contact angles on the impression materials were measured with contact angle measuring device. Ten specimens for each material, total 180 specimens were made on void entrapment model. The two impression materials (Handae, GC) were used to produce 9 groups of die stone casts form void entrapment model. Voids in the stone casts were counted under a stereoscopic microscope. The grad for the reproduction ability of each materials on the void entrapment model was calculated from the casts by one examiner. From the experiment, the following results were obtained : 1. The newly developed stones showed smallest contact angle. Type III dental stone had larger contact angles than type IV and V stones. Contact angle was much affected by the impression materials. 2. Resin containing die materials such as Tuff Rock and Resin Rock had smallest void number than any other groups. 3. In comparing reproduction parameters, Tuff Rock and Resin Rock presented superior results, while Vel Mix showed lowest reproduction ability.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.21-28
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• 2000

Refractory metals, W and Ti, and their nitrides, $W_2N$ and TiN, were investigated for using as an ohmic contact material with SiC single crystalline thin films. The possibility of nitride materials for using as a stable ohmic contact material of SiC at high temperatures was examined by considering the thermal stability depending on the heat treatment temperature, their electrical properties and protective behavior from the interdiffusion. W contact with SiC thin films, deposited by using new organosilicon precursor, bis-trimethylsilylmethane, showed the lowest resistivity, $2.17{\times}10^{-5}$Ω$\textrm{cm}^2$. On the other hand, Ti-based contact materials showed higher contact resistivity than W-based ones. The oxidation of contact materials was restricted by applying Pt thin films on those electrodes. Nitride electrodes had rather stable electrical properties and better protective behavior from interdiffusion than metal electrodes.

• Korean Journal of Materials Research
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• v.12 no.12
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• pp.918-923
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• 2002

In this work, CdTe films were deposited on CdS/ITO/glass substrate by a close spaced sublimation (CSS) method. A $Cu_2$Te layer was deposited on the CdTe film by evaporating $Cu_2$Te powder. Then the samples were annealed for p+ ohmic contact. TEM and XRD analysis showed that $CdTe/Cu_2$Te interface exhibited different forms with various annealing temperature. A good p+ ohmic contact was achieved when the annealing temperature was between $180^{\circ}C$ to $200^{\circ}C$. Best cell efficiency of 12.34% was obtained when post annealing temperature was $200^{\circ}C$ for 5 min. Thermal stress test of the CdS/CdTe cells with carbon back contact showed that the $Cu_2$Te contact was stable at $50^{\circ}C$ in $N_2$ and was slowly degraded at $100^{\circ}C$ in $N_2$. In comparison to the conventional carbon contact, the $Cu_2$Te contact showed a better thermal stability.