• Journal of Environmental Science International
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• v.21 no.9
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• pp.1031-1041
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• 2012

This study was carried out to investigate the characteristics of disinfection by-products (DBPs-trihalomethanes (THMs), haloacetic acids (HAAs) and haloacetonitriles (HANs) formation in chlorination of principal raw waters used for drinking water on Jeju Island, Korea. The domestic water supply of other area and humic acid solution (HA) were used as a reference point. The effects of chlorine contact time, solution temperature and pH on DBPs formation potential (DBPFP) were investigated for raw waters. In addition, the effect of $Br^-$ was studied for HA. The DBPFP (THMFP, HAAFP and HANFP) were increased with increasing chlorine contact time. Comparing the individual DBPFPs for raw waters, they decreased in the order of HAAFP > THMFP ${\geq}$ HANFP. As the solution temperature was increased, the THMFP, HAAFP and HANFP increased. With increasing the solution pH, the THMFP was increased, but HAAFP and HANFP were decreased. With the addition of 0.3 mg/L $Br^-$ for HA, the DBPFP was increased and the major chemical species changed: from trichloromethane to dibromochloromethane and tribromomethane for THMs; from dichloroacetic acid and trichloroacetic acid to tribromoacetic acid for HAAs; and from dichloroacetonitrile to dibromoacetonitrile for HANs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.1
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• pp.79-87
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• 1996

SMC(Sheet Molding Compound) is made of unsaturated polyester resin and other additives reinforced with randomly distributed chopped fiberglass strands. Because of its higher stiffness per unit mass, SMC was used as a substitute for steel for automotive steel outer panels. Thus, understanding of flow characteristics during fabrication of SMC is of importance since the formation of weld line depends on material flow. In the present study, SMC compression molding simulations in the flat and T-shape molds were accomplished. During simulations, the preferential the preferential flow occurred at the low mold closing speed while plug flow was observed for the higher mold closing speed. When the preferential flow was observed, the weld line was seen at the final stage. For simulations, rigid-viscoplastic finite element method was applied. Self-contact algorithm was also applied in order to predict the formation of the weld line. Simulation results were compared to the experimental results available in the literature.

• Journal of Korean Society of Water and Wastewater
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• v.27 no.6
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• pp.751-759
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• 2013

This study is carried out to get the basic design parameters for phospate removal facilites from wastewater by Tobermolite. The phosphate removal by the apatite formation on the surface was affected by several important factors, temperature, ions present in wastewater stream, contact time, recirculation rate, and etc. In case of the temperature, with the increase of temperature, the apatite formation was accelerated. When temperature increased from $15^{\circ}C$ to $35^{\circ}C$, removal efficiency of phosphate increased from 83 % to 93 %. An increase of calcium and fluoride ion content increase the apatite formation, however, bicarbonate and magnesium ion inhibited the crystallization of apatite. As expected, when the recirculation rate was increased from 1 Q to 3 Q, at EBCT (Empty Bed Contact Time) 60min enhanced removal efficiency was observed. The more the recirculation rate increased, the more the removal efficiency increased. According to the results of column experiment using an actual wastewater with low and high phosphate concentration (5 mg/L and 50 mg/L-P), the removal efficiency was 77 % at EBCT of 45 min, and 80 % at 60 min. It was suggested that optimum EBCT was 45 min.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.104-104
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• 1999

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.579-580
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• 2013

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.25-30
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• 1997

In this study, the forming behavior of Tailor welded HS and IF steel s-rail stamping is analyzed by experiments and simulations. According to the results, uniform strain distribution in the formed part is most important to prevent springback and wrinkle formation. For that purpose, it is most effective to distribute uniformly the contact pressure of blank and bland holder.

• International Journal of Railway
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• v.2 no.2
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• pp.43-49
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• 2009

Wear and rolling contact fatigue (RCF) defects are most important causes of rail damage, and often interaction competitive at present railway track. Head check is one of rolling contact fatigue (RCF) defects, and generally occurs in mild circular curves and transition curves that are set at both ends of sharp circular curves. Wear tends to limit the crack growth of head checks by removing the material from the RCF surface. In order to clarify the conditions of the occurrence and growth of head checks, the authors measured the interacting forces between wheels and rails and the angle of attack of wheelset, and carried out contact analyses using the actual profile data of wheels and rails. The effects of the lateral force, the contact geometry, and the wear rate at rail gauge comer on the formation of head checks were also analyzed by using the worn profiles of actual wheels and rails and the data obtained by a track inspection car. Some specific range of wear rate at the gauge comer was identified as having close relation with occurrence of head checks.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.2-91.2
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• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.

• Journal of the Korean Vacuum Society
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• v.10 no.2
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• pp.219-224
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• 2001

Pd/Ge/Ti/Pt ohmic contact to n-type InCaAs was investigated. Minimum specific contact resistivity of $3.7\times10^{-6}\; \Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $400^{\circ}C$ for 10 seconds. This was related to the formation of Pd-Ge compounds and the in-diffusion of Ge atoms to InGaAs surface. However, the specific contact resistivity increased slightly to $low-10^5\; \Omega\textrm{cm}^2$ in the case of longer annealing time. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained after annealing at high temperature. Therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.5
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• pp.449-454
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• 2002

The use of a thin film of indium between the ITO and the $n^+-lnP$ contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. $ITO/n^+-lnP$ ohmic contact was successfully achieved by the deposition of indium and annealing. The specific contact resistance of about $6.6{\times}10^{-4}\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to $ITO/n^+-lnP$ contact without the deposition of indium between ITO and $n^+-lnP$, it exhibited Schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with those of InP/InGaAs HBTs with the opaque emitter contacts.