• Journal of the Korean Chemical Society
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• v.51 no.2
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• pp.171-177
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• 2007

Polymer-based electrically conductive pastes have been used to make the conductive paths between voltage sources and devices. The pastes used for these applications consist of two main components: a polymer binder and a conductive filler. Having both low viscosity and good metal-encapsulating properties, cellulose acetate butyrate (CAB) was regarded to be a good candidate as a binder for the conductive paste. We have prepared a formulation for a novel conductive paste based on CAB. Preliminary studies showed that this conductive paste revealed stable conductivity, together with uniform coating and flexibility.

• Composites Research
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• v.19 no.2
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• pp.7-12
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• 2006

Graphite particle/carbon fiber hybrid conductive polymer composites were fabricated by the compression molding technique. Graphite particles were mixed with an epoxy resin to impart the electrical conductivity in the composite materials. In this study, graphite reinforced conductive polymer composites with high filler loadings were manufactured to accomplish high electrical conductivity above 100S/cm. Graphite particles were the main filler to increase the electrical conductivity of composites by direct contact between graphite particles. While high filler loadings are needed to attain good electrical conductivity, the composites becomes brittle. So carbon fiber was added to compensate weakened mechanical property. With increasing the carbon fiber loading ratio, the electrical conductivity gradually decreased because non-conducting regions were generated in the carbon fiber cluster among carbon fibers, while the flexural strength increased. In the case of carbon fiber 20wt.% of the total system, the electrical conductivity decreased 27%, whereas the flexural strength increased 12%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Carbon letters
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• v.14 no.2
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• pp.105-109
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• 2013

Effects of the amount of nickel powder (Ni) in Ni-carbon fiber (CF) hybrid filler systems on the conductivity(or resistivity) and thermal coefficient of resistance (TCR) of filled high density polyethylene were studied. Increases of the resistivity and TCR with increasing Ni concentration at a given hybrid filler content were observed. Using the fiber contact model, we showed that the main role of Ni in the hybrid filler system is to decrease the interfiber contact resistance when Ni concentration is less than the threshold point. The formation of structural defects leading to reduced reinforcing effect resulted in both a reduction of strength and an increase of the coefficient of thermal expansion in the composite film; these changes are responsible for the increases of both resistivity and TCR with increasing Ni concentration in the hybrid filler system.

• Elastomers and Composites
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• v.50 no.3
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• pp.205-209
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• 2015

Magnesium oxide (MgO) reinforced polyamide-66 (PA66) composites were prepared through melt-compounding method in order to determine the possibility of using MgO particle as conductive filler in the polymer-based composite. The effects of MgO filler content on the thermal conductivity and mechanical properties for the PA66/MgO composites were investigated. The results showed that the addition of MgO filler to the PA66 matrix led to a large increase in thermal conductivity of the PA66/MgO composites. Tensile strengths of the PA66/MgO composites were slightly decreased as MgO filler loading increased. However, flexural strength and flexural modulus were improved with increasing filler loading. Notched Izod impact strengths were dramatically lowered by the addition of MgO filler.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.11-15
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• 2017

As the heat dissipation problem is increased in 3D multi flip chip packages, an improvement of thermal conductivity in bonding interfaces is required. In this study, the effect of alumina filler addition was investigated in non-conductive paste(NCP). The fine alumina filler having average particles size of 400 nm for the fine pitch interconnection was used. As the alumina filler content was increased from 0 to 60 wt%, the thermal conductivity of the cured product was increased up to 0.654 W/mK at 60 wt%. It was higher value than 0.501 W/mK which was reported for the same amount of silica. It was also found out that the addition of fine sized alumina filler resulted in the smaller decrease in thermal conductivity than the larger sized particles. The viscosity of NCP with alumina addition was increased sharply at the level of 40 wt%. It was due to the increase of the interaction between the filler particles according to the finer particle size. In order to achieve the appropriate viscosity and excellent thermal conductivity with fine alumina fillers, the highly efficient dispersion process was considered to be important.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.3
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• pp.203-214
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• 2022

Thermoelectric (TE) heating and cooling devices, which are able to directly convert thermal energy into electrical energy and vice versa, are effective and have exhibited a potential for energy harvesting. With the increasing consumer demands for various wearable electronics, organic-based TE composite materials offer a promise for the TE devices applications. Conductive polymers are widely used as flexible TE materials replacing inorganic materials due to their flexibility, low thermal conductivity, mechanical flexibility, ease of processing, and low cost. In this review, we briefly introduce the latest research trends in the flexible TE technology and provide a comprehensive summary of specific conductive polymer-based TE material fabrication technologies. We also summarize the manufacture for high-efficiency TE composites through the complexation of a conductive polymer matrix/inorganic TE filler. We believe that this review will inspire further research to improve the TE performance of conductive polymers.

• Journal of Powder Materials
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• v.21 no.2
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• pp.124-130
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• 2014

The automotive industry is moving from the internal combustion engine to electric drive motors. Electric motors uses a high voltage system requiring the development of resources and components to shield the system. Therefore, in this study, we analyze electromagnetic interference (EMI) shielding effectiveness (SE) characteristics of an auto crash pad according to the ratio of electrically conductive materials and propylene. In order to combine good mechanical characteristics and electromagnetic shielding of the automotive crash pad, metal-coated glass fiber (MGF) manufacturing methods are introduced and compared with powder-type methods. Through this study, among MGF methods, we suggest that the chopping method is the most effective shielding method.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.7-14
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• 2008

Carbon nanotubes are considered as the most ideal nano filler in the field of composites with their excellent electrical, mechanical, and thermal properties. Therefore carbon nanotubes composites are increasingly utilized in conductive materials, structural material with high strength and low weight and multifunctional material. This review article describes recent research trend of carbon nanotubes synthesis, modification, various properties of the carbon nanotubes composites and their application. Furthermore the future development direction for the commercialization of carbon nanotubes composites is proposed.