• 마이크로전자및패키징학회지
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• 제16권3호
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• pp.25-29
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• 2009

COB(chip-on-board) 플립칩 패키지에 있어서 NCP(non-conductive paste)의 적용성을 확보하기 위해 자체 포뮬레이션한 NCP와 상용 NCP에 대하여 보드레벨 플립칩 패키지를 제작하고 고온고습 및 열충격 신뢰성을 평가하였다. 실험결과 보다 작은 입도의 용융 실리카를 첨가한 NCP 시제품들이 고온고습 신뢰성에 유리한 것을 알 수 있었다. 또한, NCP 접속부에 있어서 열응력에 의한 피로보다 흡습에 의한 에폭시의 팽창이 접속부 파손에 보다큰 영향을 미치는 것으로 나타났으며, NCP의 접착강도가 높을수록 NCP 플립칩 패키지의 열충격 신뢰성이 향상되는 것을 알 수 있었다.

• 한국재료학회지
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• 제13권1호
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• 문화기술의 융합
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• 제8권5호
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• pp.749-754
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• 2022

다양한 의료 응용 분야에서 웨어러블 및 피부 부착형 전자 패치에 피부 표면의 높은 접착력과 내수성이 요구된다. 본 연구에서는 탄소 기반 전도성 고분자 복합 소재에 개구리 발바닥의 육각 채널와 문어 빨판의 흡착 구조 패턴을 모사한 신축성 있는 전자 패치를 보고한다. 개구리의 발바닥을 모사한 육각 채널 구조는 수분을 배수하며, 균열억제 효과를 통해 점착력을 향상 시키며, 문어 빨판을 모사한 흡착 구조는 젖은 표면에서 높은 점착력을 나타낸다. 또한 고점착 전자패치는 실리콘(max. 4.06 N/cm²), 피부 복제 표면(max. 1.84 N/cm²) 등 다양한 표면에 건조 및 젖은 조건에서 우수한 접착력을 가지고 있다. 고분자 매트릭스와 탄소 입자를 기반으로한 고분자 복합소재를 통해 제작된 고점착 전자 패치는 건조 및 습한 환경에서 심전도(ECG)을 안정적으로 감지할 수 있다. 이 연구에서 보여진 특성을 기반으로 제안된 전자 패치는 다양한 생체 신호의 진단을 위한 웨어러블 및 피부 부착 센서 디바이스를 구현하는 잠재적 응용 가능성을 제시한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 센서 박막재료
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• pp.15-17
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• 2001

A new possibility of our atmospheric cold plasma torch has been examined on the surface treatment of an air-exposed vulcanized rubber compound. The plasma treatment effect was evaluated by the bondability with another rubber compound using a polyurethane adhesive.

• Journal of Electrochemical Science and Technology
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• 제3권3호
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• pp.143-148
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• 2012

The unique effects of highly conductive conducting polymer/SWNT (single walled carbon nanotube) composite nanoparticles in electric double layer capacitors are studied for the enhancement of the adhesive properties, specific capacitance and power characteristics of the electrode. Because the conducting polymer/SWNT composite material, which is believed to act as a polymer binder, an active material for charge storage and a conducting agent, is well distributed on the activated carbon, greatly enhanced adhesion properties, cell capacitance and power characteristics were obtained.

• 한국정밀공학회지
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• 제18권7호
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• pp.161-166
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• 2001

The prototype of a tactile sensor with $4\times 4$ taxels using PVDF was fabricated. The electrode patterns of the thin Cu tape are attached to the 28${\mu}{\textrm}{m}$ thickness PVDF using conductive adhesive and covering the sensor using polyester film for insulation. The structure of the sensor is flexible and the fabrication procedure is easy relatively. Also the output characteristics of the sensor was nearly linear with 8% deviation. The signals of a contact pressure to the tactile sensor are sensed and processed through A/D converter, DSP system and personal computer. The reasonable performance for the detection of contact shape and force distribution was verified through the experiment.

• 한국인쇄학회:학술대회논문집
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• 한국인쇄학회 2007년도 추계 학술논문 발표회
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1432-1435
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• 2006

We report on carbon nano-fibers (CNFs) for applying to epoxy as a highly thermal conductive adhesive. In order to fabricate CNFs, electro-spinning process was performed with polyacrylonitrile (PAN) solutions. The sample was stabilized at the annealing temperature of $360^{\circ}C$, and carbonized from 900 to $1100^{\circ}C$. It is shown that the synthesized CNFs have a good thermal conductivity of several hundred W/m K. LED backlight units (BLUs) fabricated with MPCB using CNF-mixed epoxy give a better heat dissipation and higher performance than normal LED BLUs. On the basis of SEM, XRD, and FTIR, the characteristics of CNFs are described.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1450-1451
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• 2008

To investigate the reliability of the conductive lines patterned by ink-jet printing, we evaluated the reliability of the ink-jet printed silver (Ag) patterns according to the guide lines built up as assessments methods in the production of conventional rigid printed circuit boards. The assessment methods include the uniformity of line width and space, adhesive strength, dielectric withstand, solder float, thermal shock test and pressure cooker test (PCT). To prepare assesment vehicles, different regular test patterns were created by Ag ink-jet printing on the same polyimide substrate for each of assessment methods.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.593-594
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• 2006

A novel thermal transfer method was developed to form the phosphor screen for VPT(Video Phone Tube). This method have advantages of simple process, clean environment, saving raw material and running-cost comparison of electrodeposition, spin coating of conventional methods. But now applying phosphor screen for thermal transfer method has been formed three layers (phosphor layer, ITO layer and thermal adhesive layer) on the PET film as substrate. This is complex process, run to waste of raw-material and require of high cost. Also ITO paste at present has been imported from Japan. To improve these problems, we have manufactured phosphor screen formed by two layers (phosphor layer and ITO layer). We have developed ITO paste that had both conductive and excellent thermal transfer abilities, made it of domestic raw-material.