한국정보디스플레이학회:학술대회논문집
- 2006.08a
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- Pages.1432-1435
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- 2006
Development of new heat dissipated material in metal core PCB for LED backlight source
- Ban, K.Y. (Information Display Research Center, Korea Electronics Technology Institute) ;
- Lee, D.Y. (Information Display Research Center, Korea Electronics Technology Institute) ;
- Lee, M.J. (Information Display Research Center, Korea Electronics Technology Institute) ;
- Han, C.J. (Information Display Research Center, Korea Electronics Technology Institute) ;
- Han, J.I. (Information Display Research Center, Korea Electronics Technology Institute)
- Published : 2006.08.22
Abstract
We report on carbon nano-fibers (CNFs) for applying to epoxy as a highly thermal conductive adhesive. In order to fabricate CNFs, electro-spinning process was performed with polyacrylonitrile (PAN) solutions. The sample was stabilized at the annealing temperature of
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