• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.733-740
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• 2014

A resistive micro Pirani gauge using amorphous silicon (a-Si) thin membrane is proposed. The proposed Pirani gauge can be easily integrated with the other process-compatible membrane-type sensors, and can be applicable for in-situ vacuum monitoring inside the vacuum package without an additional process. The vacuum level is measured by the resistance changes of the membrane using the low noise correlated double sampling (CDS) capacitive trans-impedance amplifier (CTIA). The measured vacuum range of the Pirani gauge is 0.1 to 10 Torr. The sensitivity and non-linearity are measured to be 78 mV / Torr and 0.5% in the pressure range of 0.1 to 10 Torr. The output noise level is measured to be $268{\mu}V_{rms}$ in 0.5 Hz to 50 Hz, which is 41.2% smaller than conventional CTIA.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.8 no.2
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• pp.90-95
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• 2009

All-optical fiber-type gain flattening filer (GFF) for an EDFA (Erbium doped fiber amplifier) were fabricated by using a FBT (fiber biconical tapered) process and the performance of the GFF was tested and athermal package was proposed. Historically, the chief contributor to gain unevenness has been the EDFA. Due to the inherent gain response of the EDFA's operation, there is always a modest imbalance in the gain applied as a function of wavelength. FBT methods have been used to make fiber type couplers and WDM filter since 1980. Attractivity of this methods was simple, cost effective and thermal stability. Simulation program tool is made to design target GFF profile for this paper. Fiber coupler manufacturing machine is modified for the GFF process. The final GFF is obtained by cascading 4 unit filter that has 6 taper stage. Test result shows 1 dB of wavelength flatness in the C band. Polarization dependent loss is under 0.15dB. The center wavelength variation is below ${\pm}$0.35nm at the temperature range of $20^{\circ}C$ to $70^{\circ}C$.

• The Journal of Industrial Distribution & Business
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• v.15 no.3
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• pp.31-46
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• 2024

Purpose: Employees in the beauty industry, where emotional labor is essential, are exhausted due to stress from excessive working hours and low pay, and ultimately consider changing jobs. This study analyzed the structural relationship of turnover intention according to job stress of beauty industry employees. We tried to present implications by verifying the methods necessary for conflict management in the beauty industry from an empirical point of view. Research design, data and methodology: This study selected 518 workers in the beauty industry as a sample. Frequency analysis, validity and reliability analysis, factor analysis, correlation analysis, and regression analysis were performed using SPSS (Statistical Package for Social Science) WIN23.0. Results: The moderating effect of work experience, a moderating variable, was found to be significant in the effect of job stress of beauty industry employees following changes in the employment environment on the dependent variable, turnover intention. Conclusion: This study revealed that changes in the employment environment negatively affect the job stress of beauty workers. To reduce the job stress of employees in the beauty industry, a systematic response at the organizational level will be necessary. In addition, it is expected that it will help establish differentiated strategies such as compensation system, service training, and service management to reduce job stress.

• The Journal of the Korea Contents Association
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• v.19 no.7
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• pp.478-488
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• 2019

The purpose of this study was to investigate job satisfaction of dental hygienist. A questionnaire survey was conducted on 224 dental hygienist. The 224 data were analyzed by descriptive statistics, ANONA, Pearson's correlation analysis, and multiple regression analysis with SPSS(Statistical Package for Social Science) Ver.19.0. The average score of the communication skill was $3.32{\pm}0.49$, interpersonal relationship ability was $3.45{\pm}0.48$, job satisfaction was $3.19{\pm}0.44$. The average score of the communication skill according to the general characteristics was the married was higher than the singles, the higher the career. The average score of the interpersonal relationship ability according to the general characteristics was the higher he education, the higher the income and the business management. The average score of the job satisfaction according to the general characteristics was the higher the business management. A multiple regression analysis was conducted to examine the effects of communication skill and interpersonal relationship ability on job satisfaction, which had the lower career(t=-2.846, p=0.005), high communication skill (t=2.099, p=0.037), high interpersonal relationship ability(t=4.142, p=0.000). In order to improve the job satisfaction of the dental hygienist, provide proper compensation and the effort to improve the communication skill and interpersonal relationship ability.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.40 no.3
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• pp.59-65
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• 2017

The purpose of this study is to investigate the factors and effects of job stress of construction workers on construction accidents and turnover intention in order to improve the field work environment of construction industry which shows higher industrial accidents than other industries. To this end, research models and hypotheses were established based on previous research, and the questionnaire was distributed to 10 construction companies in Daejeon, Sejong, and Chungcheong provinces. The 301 data collected were performed statistical analysis such as basic statistical analysis, factor analysis, reliability analysis, correlation analysis, regression analysis, and logistic regression analysis using the statistical package (IBM SPSS 22). The results of this study are summarized as follows. First, job stress has a significant effect on accident occurrence. Among the sub-factors of job stress, there was positive (+) influence on work culture and relationship conflict between peers, and organizational system had negative influence. Job demands, compensation incompetence, and job instability were not statistically significant. Therefore, it is necessary to concentrate on the factors of work culture, organizational system, and relationship conflict in the construction site. Second, job stress has positive effect on turnover intention. Job stress, inadequacy of compensation, and work culture were positively related to turnover intention. Third, job demands have a slightly greater impact than compensatory inadequacies. The factors that make the job turnover more important are the excessive job burdens such as respect, internal motivation, responsibility rather than expectation non-conformity, time pressure, increase of work load. Therefore, in order to reduce the turnover intention of the construction worker, it is necessary to pay attention to improvement of the job requirement. Fourth, the worker's job stress could overcome by exercise and fatigue elimination, work environment management, and self-opening for others. It is necessary to establish a work environment management system for counseling and intimacy formation to open up the exercise and fatigue relief program of the workers at the construction site and to open themselves between the workers and the supervisors.

• Industry Promotion Research
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• v.2 no.2
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• pp.31-44
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• 2017

This study is to investigate the relationship between the communication type recognized by members of organization and the learning transfer climate in the organization, and when it comes to the type of communications within organization set as independent variable, four variables such as communication with supervisor, media quality communication, and organizational outlook communication were proposed and regarding learning transfer climate which is a dependent variable, four sub-parameters such as supervisor support, colleague support, transfer opportunity and organizational compensation recognition were selected. 116 copies of the statistical data excluding statistically insignificant surveys were used for 150 participants who participated in the 2015 core competency curriculum for SMEs and 3 months have passed, in order to achieve this study's objective. Meanwhile, the research hypothesis was verified with the collected data through frequency analysis, factor analysis, reliability verification, technical statistical analysis, and simple and multiple regression analysis by using the statistical package program of SPSS 20.0. Results of this study have shown that firstly, communication with supervisor, media quality communication, and organizational outlook communication all showed a positive (+) significant influence on the superior support in the influence relationship between communication type in organization and supervisor support which is learning transfer climate. Secondly, communication type in organization doesn't appear to affect colleague support of learning transfer climate. Thirdly, communication with supervisor, media quality communication, and organizational outlook except for communication with colleagues have shown a positive (+) influence on transfer opportunity in the influence relationship between communication type in organization and transfer opportunity of learning transfer climate. Lastly, communication with supervisor and communication on organizational outlook showed positive(+) influence in the influence relationship between communication type in organization and organizational compensation recognition of learning transfer climate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.22-28
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• 1998

Signal transmission and crosstalk of coupled bondwires buried in plastic packages are analyzed using the Method of Moments and the Fourier Transform algorithm. It is also shown that the quasi-static crosstalk model of SPICE is inappropriate for designing the high-speed plastic packages. Plastic packaging material, increasing the self and mutual capacitances, is found to be helpful for the signal transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, it is found that the radiation-enhanced coupling effect is significant for most of typical bondwire geometries and plastic package materials. These calculation results can be effectively used for designing plastic packages of high-speed digital IC's and monolithic RFIC's.

• Journal of Korean society of Dental Hygiene
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• v.19 no.2
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• pp.287-295
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• 2019

Objectives: The purpose of this study was to investigate the factors affecting subjective oral symptoms according to the gender of youth from multi-cultural families in Korea using data from the 14th (2018) Korean Youth Health Behavior Survey. Methods: The independent variables used in this study consisted of gender and sweet drink intake. The dependent variable was experience of subjective oral symptoms. Compensation variables consisted of general characteristics of school type, academic performance, economic status, drinking status, smoking status, and number of tooth brushings day before. The subjects of the study were 835 children of multi-cultural families whose parents were foreigners. All statistical analyses were performed by complex samples cross-tabulation analysis and complex samples logistic regression analysis. Statistical analysis was performed using the PASW statistical package 21.0 (Statistical Packages for Social Science Inc., Chicago, IL, USA). A significance level of 0.05 was used for statistical significance. Results: The composite sample logistic regression analysis showed that there was a statistically significant difference between gender and intake of sweet drinks in experience of subjective oral symptoms. Conclusions: These results suggest that factors influence subjective oral symptoms in Korean multi-cultural adolescents. Therefore, I hope that they will be used as basic data for the introduction and development of a customized oral health education program for improving oral health of multi-cultural adolescents.