• 대한기계학회논문집A
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• 제33권9호
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• pp.949-956
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• 2009

The C(t)-integral describes amplitude of stress and strain rate field near a tip of stationary crack under transient creep condition. Thus the C(t)-integral is a key parameter for the high-temperature crack assessment. Estimation formulae for C(t)-integral of the cracked component operating under mechanical load alone have been provided for decades. However, high temperature structures usually work under combined mechanical and thermal load. And no investigation has provided quantitative estimates for the C(t)-integral under combined mechanical and thermal load. In this study, 3-dimensional finite element analyses were conducted to calculate the C(t)-integral of elastic-creep material under combined mechanical and thermal load. As a result, redistribution time for the crack under combined mechanical and thermal load is re-defined through FE analyses to quantify the C(t)-integral. Estimates of C(t)-integral using this proposed redistribution time agree well with FE analyses results.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1065-1073
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• 2009

In this paper, the estimation method of C(t)-integral for combined mechanical and thermal loads is proposed for elastic-plastic-creep material via 3-dimensional FE analyses. Plasticity induced by initial loading makes relaxation rate different from those produced elastically. Moreover, the interactions between mechanical and thermal loads make the relaxation rate different from those produced under mechanical load alone. To quantify C(t)-integral for combined mechanical and thermal loads, the simplified formula are developed by modifying redistribution time in existing work done by Ainsworth et al..

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.351-356
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• 2000

The mechanical stress due to the wheel-rail contact and thermal stress due to the drag braking increase the incidence of wheel failure. So, firstly, stress analyses(mechanical, thermal and combined stress) of wheel plate are performed using 3-dimensional finite element method(FEM). Secondly, the optimum design of wheel plate is investigated in order to reduce weight of the wheel based on results of stress analysis. The optimum design is peformed using 2-dimensional axisymmetric F.E. model and its results are verified by 3-dimensional F. E. model.

• 한국자동차공학회논문집
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• 제9권3호
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• pp.221-229
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• 2001

The mechanical stress due to the wheel-rail contact and thermal stress due to the drag braking increase the incidence of wheel failure. So, firstly, stress analyses(mechanical, thermal and combined stress) of wheel plate are performed using 3-dimensional finite element method(FEM). Secondly, the optimum design of wheel plate ;s investigated in order to reduce weight of the wheel based on results of stress analysis. The optimum design is peformed using 2-dimensional axisymmetric F.E. model and its results are verified by 3-dimensional F. E. model.

• 대한기계학회논문집A
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• 제32권12호
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• pp.1123-1131
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• 2008

This paper provides V-factor estimation under combined mechanical and thermal load for circumferential cracks. Results are based on finite element analyses and effect of types and magnitudes of the thermal stress, crack geometry, the loading mode and plastic strain hardening on variations of the V-factor are investigated. The results of finite element analyses are compared with R6 values. As a result, it is shown that R6 gives generally conservative results. The conservatism is especially increased for the combination of large mechanical and thermal load. As a result, new estimation method which uses failure assessment line in R6 is proposed for V-factor and gives less conservative results.

• 한국철도학회논문집
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• 제5권3호
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• pp.167-173
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• 2002

The influence of thermal stress at tread breaking in Korean High Speed Train wheel was investigated using the coupled thermal-mechanical analysis technique. The mechanical load or wheel-rail contract load and braking load were considered during FEM analysis. During the stop braking, the effect of mechanical stress on the combined stress is relatively larger than that of thermal stress in the rim of wheel. However, the effect of thermal stress is relatively larger than that of mechanical stress in the plate of wheel. When 300% of the block force was applied, the maximum von Mises stress of 61.0 MPa was found at the outside plate around 400 mm far away from the wheel center.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.43-48
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• 2004

When structures are loaded by a combination of primary and secondary stresses, plasticity effects occur which cannot be evaluated by a simple linear addition of the effects resulting from the two independent stress systems. Thermal stress due to temperature gradient is classified as secondary stress. It is known that secondary stress is released as increase of plastic zone. In this paper, two and three dimensional elastic-plastic finite element analyses are performed for the cracked plates and pipes under combined thermal and mechanical loading. And V-factor is introduced to account for plasticity effect. The present results provide that V-factor is function of thermal factor and loading and is consistent regardless of geometry. We developed the prediction method of elastic-plastic fracture mechanics parameter under combined primary and secondary loading from the present results.

• 대한기계학회논문집A
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• 제35권6호
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• pp.609-617
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• 2011

최근 효율을 높이기 위한 플랜드의 환경이 고온, 고압으로 변화함에 따라 열하중과 기계하중을 동시에 반영한 균열 평가는 플랜트의 건전성을 위하여 반드시 필요하다. C(t)-적분은 고온 균열 평가에 있어서 천이 크리프 상태의 균열을 평가하는 중요한 요소이다. 열하중과 기계하중이 동시에 작용하는 환경에서의 C(t)-적분을 예측하는 것은 복잡하며 하중조건이 달라지는 경우에는 더욱더 복잡해진다. 본 논문에서는 열하중과 기계하중의 하중조건이 달라지는 여러 조건에 대한 C(t)-적분 평가식을 제시하였다.

• 대한기계학회논문집A
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• 제38권11호
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• pp.1207-1214
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• 2014

균열이 존재하는 구조물의 균열 선단에서 과도한 소성 상태에 도달하게 되면 파괴역학 매개변수에 의하여 예측되는 균열 선단의 응력장이 실제와는 매우 다르게 나타난다. 구조물의 크기와 형상 그리고 하중의 형태에 따라 균열 선단의 응력장이 유일하지 않다. 이는 균열 선단의 구속 효과가 단일 매개변수 파괴역학으로 표현 될 수 없기 때문이다. 따라서 전통적으로 사용되었던 K, J를 이용한 단일 매개변수 파괴역학을 보완하기 위하여 다양한 시도가 있었고, 대표적으로 Q-응력이 있다. 본 논문에서는 Q-응력을 이용하여 원주방향으로 완전히 발달한 표면 균열이 있을 경우의 균열 선단의 구속 효과를 확인하였다. 고려된 하중은 일차하중으로 축 방향 인장하중과 반경방향 열구배에 의한 이차하중의 복합하중이다. 이차하중이 일차하중보다 구속효과가 더 심하며 기계하중보다 열하중이 뒤에 가해지는 열충격조건에서 구속효과가 더 심하게 나타남을 확인하였다.

• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.