• 제목/요약/키워드: Coining

검색결과 25건 처리시간 0.029초

코인된 솔더 범프를 형성시킨 PCB 기판을 이용한 플립 칩 접속 (Flip Chip Assembly on PCB Substrates with Coined Solder Bumps)

  • 나재웅;백경욱
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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    • pp.21-26
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    • 2002
  • Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

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정밀 전자부품 성형을 위한 소성가공 공정설계 (Process Design in Precision Press Forming of Electronic Components)

  • 변상규;최한호;강범수
    • 소성∙가공
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    • 제4권1호
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    • pp.79-91
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    • 1995
  • Precision forming of electronic components has appeared to be competitive according to manufacturing cost and dimensional tolerances. Now domestic electronic companies have been involving in utilization of the finite element method in process design of precision forming. A forming process to produce an electronic component, aperture, has been inbestigated to find out forming defects during multi-operations. The applications of the commercial FEM software MARC show a possibility of defect in precision coining process among the whole multi-process. Thus the coining process of three-dimensional deformation is analyzed using DAMF-3D which has been developed in this lab with the rigid-plastic algorithm. The result f simulations by DAMF-3D provides clear description of the defect involved in the coining process.

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강-소성 유한요소법의 3차원 역추적 기법을 적용한 코이닝 공정설계 (Process Design in Coining by Three-Dimensional Backward Tracing Scheme of Rigid-Plastic Finite Element Method)

  • 최한호;변상규;강범수
    • 소성∙가공
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    • 제6권5호
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    • pp.408-415
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    • 1997
  • The backward tracing scheme of the finite element analysis, which is counted to be unique and useful for process design in metal forming, has been developed and applied successfully in industry to several metal forming processes. Here the backward tracing scheme is implemented for process design of three-dimensional plastic deformation in metal forming, and it is applied to a precision coining process. The contact problem between the die and workpiece has been treated carefully during backward tracing simulation in three-dimensional deformation. The results confirm that the application of the developed program implemented with backward tracing scheme of the rigid plastic finite element leads to a reasonable initial piercing hole configuration. It is concluded that three-dimensional extension of the scheme appears to be successful for industrial applications.

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정밀전자부품 성형을 위한 소성가공 공정해석 (Analysis of a Process Sequence in Precision Press Forming of Electronic Components)

  • 변상규;허병우;강범수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1995년도 추계학술대회논문집
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    • pp.119-127
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    • 1995
  • A process sequence in precison press forming of electronic components is investigated by the finite element method. Aperture, a key component of electronic gun, is formed through a wequence of about 15 operations, among which the beading & bending, the first coining, and the second coining operations are expected to be most critical in view of industrial experts' opinions. Thus, the analysis performed by a commercial code MARC focuses on the three operations, and comparisons are made between the results of the analysis and the measurement of experimental forming of the component, and it appears a sound agreement.

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소성가공 공정설계용 3차원 유한요소 프로그램의 개발 및 정밀코이닝 공정설계 (Development of a Three-Dimensional Finite Element Program for Metal Forming and its Application to Precision Coining)

  • 최한호;이진희;강범수
    • 대한기계학회논문집
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    • 제19권7호
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    • pp.1642-1650
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    • 1995
  • Process design is one of the most important fields in metal forming, where the finite element method has appeared a useful method for industrial applications. In this study, a program using the rigid plastic finite element has been developed for process design in three-dimensional plastic deformation. The surface integration for calculation of the friction between die and workpiece has been implemented with care in numerical treatment. The developed program is applied to a precision coining process of electronic components. It is confirmed that the program developed here is suitable for process design in metal forming with three-dimensional plastic deformation.

정밀 전자총 부품 Aperture 성형공정 해석 및 설계 시스템 구축 (Analysis of a Process Sequence in Precision Press Forming of Aperture and Construction of Design System)

  • 변상규;허병우;강범수
    • 한국정밀공학회지
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    • 제14권5호
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    • pp.76-84
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    • 1997
  • A process sequence in precision press forming of electrnic components is investigated by the finite element method. Aperture, a key component of electronic gun, is formed through a sequence of about 15 operation, among which the beading & bending, the first piercing, the first coining, and the second coining operations are expected to be most critical in view of industrial experts opinions. Thus, the analysis per- formed by a commercial code MARC focuses on the three operations, and comparisons are made between the results of the analysis and the measurements of experimental forming of the component.

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정밀 코닝 공정 설계에서의 3차원 유한요소법 활용 (Process Design in Precision Coining by Three-Dimensional Finite Element Method)

  • 최한호;강범수;변천덕
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1994년도 추계학술대회 논문집
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    • pp.173-181
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    • 1994
  • Process design is one of the most important fields in metal forming, where the finite element method has appeared a useful method for industrial applications. In this study, a program using the rigid plastic finite element has been developed for preform design in three-dimensional plastic deformation. The surface integration for calculation of the friction between die and workpiece has been implemented with care in numerical treatment. The developed program is applied to a precision coining process for designing an optimal punch.

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치수 정밀도 향상을 위한 비대칭 정밀제품의 단조공정 설계 (Forging Process Design for Dimensional Accuracy of an Irregular Shape Product)

  • 이선홍;최창혁;김성태;김용조
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.1097-1100
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    • 2004
  • A rear axle spider in an irregular shape, which is used as a part in the braking system of a vehicle like a big truck and a trailer, is subjected to a large torque and hence requires both strength and endurance over the brake heat. This part should be therefore manufactured in dimensional accuracy. The practical manufacturing process of this irregular product requires the heat treatment process after hot forging and then the cold coining process for the dimensional accuracy. At the present study, the warm coning without the heat treatment process was proposed to employ the residual heat due to the hot forging process. And also the trimming and piercing process was designed using the rigid-plastic finite element method. The mechanical properties were discussed and also commented upon.

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Stopper 부품의 파인블랭킹공정에 관한 연구 (A Study on the Fine Blanking Process of Stopper Part)

  • 김영호;손경호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 추계학술대회 논문집
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    • pp.182-186
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    • 1996
  • In this work, a method is described to investigate the progressive and compound process in the coining and piercing operation for given conditions and parameters, using the FEM simulation and model experiment. The effect of the die shape on the compound process is established, and the die shape depends on the position of coining die and the width of the part coined. It is found that Progressive process is better than compound process, since material's filling into the die is not completed and the higher stress acts on the edge of the punch according to width being increased.

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