• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.21-21
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• 2010

• Plant Journal
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• v.14 no.1
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• pp.47-51
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• 2018

This study analyzed the effect of power output reduction in coal fired power generation on the change of system marginal price and green house gas emissions. Analytical method was used for electricity market forecasting system used in korea state owned companies. Operating conditions of the power system was based on the the 7th Basic Plan for Electricity Demand and Supply. This as a reference, I analyzed change of system marginal price and green house gas emission by reduced power output in coal fired power generation. The results, if the maximum output was declined as 29 [%] to overall coal-fired power plant, system marginal price is reduced 12 [%p] compared to before and decreasing greenhouse gas emissions were 9,966 [kton]. And if the low efficiency coal fired power plant that accounted for 30 [%] in overall coal-fired power plant stopped by year, system marginal price is reduced 14 [%p] compared to before and decreasing greenhouse gas emissions were 12,874 [kton].

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2008.10a
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• pp.228-229
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• 2008

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1288-1293
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• 2007

In this paper, a compact triplexer has been implemented for Cellular/GPS/USPCS applications. In order to realize the proposed triplexer, we use a low-temperature co-fired ceramic (LTCC) substrate to enable a fully compact integrated module using a multi-layer high-density architecture, and conjugate-match the channels instead of the open matching technique. The three dimensional design capability of LTCC substrates can reduce the overall size of the triplexer, resulting in dimensions on the order of $3.2\;mm\;{\times}\;2.5\;mm\;{\times}\;1\;mm$. The measured result shows that the triplexer has, in Cellular/GPS/USPCS bands, the insertion loss of less than 0.5dB, less than 1.7dB, and less than 0.9dB in order. Also, the triplexer has an isolation of more than 15dB in the cellular and USPCS bands and an isolation of more than 20dB in the GPS band.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• ETRI Journal
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• v.28 no.3
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• pp.347-354
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• 2006

The characteristic variation of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. Four different structures of a 3-D inductor are fabricated by using a low-temperature co-fired ceramic (LTCC) process, and their s-parameters are measured between 50 MHz and 5 GHz. The circuit model parameters of each building block are optimized and extracted using the partial element equivalent circuit method and an HSPICE circuit simulator. Based on the model parameters, the characteristics of the test structures such as self-resonant frequency, inductance, and quality (Q) factor are analyzed, and predictive modeling is applied to the structures composed of a combination of the modeled building blocks. In addition, characteristic variations of the 3-D inductors with different structures using extracted building blocks are also investigated. This approach can provide a characteristic estimation of 3-D solenoid embedded inductors for structural variations.