• The Transactions of the Korean Institute of Power Electronics
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• v.10 no.6
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• pp.560-568
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• 2005

The proposed Multi-level PDP sustain Driver is composed of the semiconductor devices with low voltage rating compared to those used in the prior circuit proposed by L. Wether, and it has two resonant periods during the charging (rising period) and discharging (falling period) the PDP in the sustaining voltage waveforms. In accordance with the change of timing phase$(T_{r1},\;T_{i1},\;T_{r2})$, the performance characteristics of a commercial PDP module has been carried out and compared the characteristic with the 42V6, made of LG Electronics co., Experimental results show that the performance characteristics of PDP module are greatly influenced by the variation of $T_{i1}\;and\;T_{r2}$. The variation of $T_{r1}$ do not influence much on the performances of PDP. With the conditions that $T_{r1}=60ns,\;T_{i1}=120ns,\;and\;T_{r2}=350ns$, we could get the performances listed as the luminance is increased $14.6\%$, the power consumptions is decreased $5.9\%$, the panel efficiency is increased $24.2\%$, module efficiency is increased $21.2\%$, compared to those shown in the commercial PDP module (42V6). Therefore, the proposed multi-level PDP sustain driver expected to be suitable to actual PDP module application.

• International Journal of Highway Engineering
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• v.18 no.6
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• pp.161-171
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• 2016

OBJECTIVES : Many roadway departure crashes on the freeway interchange are due to the running speed being greater than the design speed. This study aims to ensure a safe and pleasant driving experience for the driver by increasing the superelevation based on the running speed on the highway interchange ramp. METHODS : The mean running speed for each type of ramp is calculated on site survey more than 10 interchanges. Using the mean running speed, we calculated the superelevation and the side friction using the method given in "A Policy on Geometric Design of Highways and Street" (Pages 145-166, 2001). Then, we applied the modified method to the superelevation range. Finally, we ensured safety using the Degree of Safety that is proven by the centrifugal acceleration ratio as suggested by Joseph Craus (1978). RESULTS : The mean running speeds are 50 km/h and 65 km/h when the design speeds are 40 km/h and 50 km/h, respectively. After the application of the new method used in this study, the superelevation will be increased by 9.0% and 10.0% when the mean running speeds are 50 km/h and 65 km/h, respectively. CONCLUSIONS : A higher superelevation can give the driver a more comfortable and safe driving environment. However, the driver needs to be aware of snow and low-temperature conditions.

• Fashion & Textile Research Journal
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• v.14 no.2
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• pp.261-268
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• 2012

The purpose of this study is to investigate problems of design, fitness, suitability for movement, and wearing comfort of jumper for Korean military tank drivers through analysis of actual wearing condition by questionnaire and field evaluation and to provide basic data for developing its improved design. The survey was done for 477 military tank drivers and evaluation was performed using thermal manikin to measure insulation. The overall satisfaction for design of jumper for military tank driver was over 3.5(likert scale). The overall satisfaction for fitness of jumper for military tank driver was also over 3.5. The satisfactions for material was between 2.39 and 3.13 and the satisfaction for pilling property was the lowest, followed by static property and shape stability after laundering. The satisfactions for movement suitability were standing(3.81), sitting(3,38), raising hand(forward: 2.90, sideward: 3.01), respectively. In insulation evaluation of jumper for military tank drivers and outwears(jacket, jumper), the insulation of jumper for military tank drivers was lower than outwear(jumper) and same with outwear(jacket). The insulation in dynamic and still condition(without wind) of jumper for military tank driver was 0.37clo and 0.31clo, respectively. Its decreation rate in dynamic condition comparing to still condition was 59% which was lower than jacket(0.73clo) and jumper(1.15clo).

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.592-595
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• 2008

This paper presents development of automatic image quality register optimization system using mobile TFT-LCD (Thin Film Transistor-Liquid Crystal Display) driver IC and embedded software. It optimizes automatically gamma adjustment and voltage setting registers in mobile TFT-LCD driver IC to improve gamma correction error, adjusting time, flicker noise and contrast ratio. Developed algorithms and embedded software are generally applicable for most of the TFT-LCD modules. The proposed optimization system contains module-under-test (MUT, TFT-LCD module), control program, multimedia display tester for measuring luminance, flicker noise and contrast ratio, and control board for interface between PC and TFT-LCD module. The control board is designed with DSP and FPGA, and it supports various interfaces such as RGB and CPU.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.541-543
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• 2008

현재 폭넓은 시장을 형성하고 있는 LED는 전 세계적으로 이슈화 되고 있는 친환경 조명기기로 각광받고 있으며, 향후 조명 산업의 50% 이상 시장 점유율을 차지할 것으로 예상된다. 본 논문에서는 Analog Dimming을 이용하여 Single-stage LED 구동 회로를 제안한다. 제안된 회로는 기존 방식과 달리 DC/DC단이 없으므로 가격 경쟁력 및 높은 전력 변환 효율을 확보할 수 있고, 고조파 규제 만족을 위한 역률 보정 기능이 있으며 휘도를 선형적으로 제어할 수 있는 Analog Dimming 기능을 가지고 있다. 최종적으로 제안된 Single-stage LED 구동 회로의 동작 및 Analog Dimming 제어 기법을 소개하고, 시뮬레이션 및 40W급 시작품을 제작, 동작 실험을 통하여 그 타당성을 검증한다.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.630-633
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• 2003

Integrating the driver circuitry directly onto the glass substrate would be one of the advantages of polycrystalline Si (poly-Si) TFT-(LCD). Low-temperature poly-Si TFT(LTPS) is well-suited for higher-definition display applications due to its intrinsically superior electrical characteristics. In order to improve LTPS electrical characteristics, currently the excimer laser-induced crystallization (ELC) processes and sequential lateral solidification method were developed. Grain size of the poly-Si is mainly affected by beam pitch and energy density. Key parameter for making a larger poly-Si using excimer laser annealing(ELA) and increasing a throughput is due to increase in beam pitch and energy density to a certain degree. Furthermore, thin $SiO_{2}$ capping is effective to suppress the protrusion of the poly-Si thin films and to reduce the interface state density. From the ELA process, we are able to control grain size by varying different parameters such as number of shots and energy density.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.4 s.334
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• pp.53-60
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• 2005

This work Proposes and describes an LCD backlight driver IC using a voltage feedback circuit which improves the brightness uniformity. The proposed circuit controls the brightness of a backlight by amplifying of sampling voltage at a lamp. To keep the uniformity of brightness, the circuit has a reference lamp. The output voltage of the reference lamp is supplied commonly to each lamp that reduces a resistance deviation of the lamps. As a result, the proposed circuit shows brightness uniformity improvement of about $40\%$ compared to the conventional ones.

• Journal of the Korean Wood Science and Technology
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• v.33 no.5 s.133
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• pp.13-20
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• 2005

This paper deals with flexural vibration techniques as a means of predicting bending strength properties for quarter-sawn and flat-sawn planes of red pine containing knots. Dynamic modulus of elasticity $(MOE_d)$ was calculated from resonance frequency obtained from the flexural vibration induced by a magnetic driver in quarter-sawn and flat-sawn planes of red pine containing knots. The dynamic MOE were well correlated to bending strength properties. Their correlation coefficients ranged from 0.866 to 0.800 for the regression between dynamic MOE and static bending MOE or MOR. The difference of the values between quarter-sawn and flat-sawn was very small. These values were higher than correlation between percentage of total knot diameter to total width of red pine specimen $(K_T(%))$ as well as $K_O(%)$ base upon ASTM D 3737 and static bending strength properties (correlation coefficient r = 0.448~0.704), and were similar to those between static bending MOE and bending MOR (r = 0.850). These results indicate that dynamic MOE obtained from resonance frequency induced by flexural vibration of magnetic driver is able to effectively use for predicting of static bending strength of red pine containing knots as well as static MOE.

• Journal of Power Electronics
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• v.16 no.2
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• pp.786-797
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• 2016

This paper describes the design and development of a novel semiconductor-based solid-state switch for damped oscillating voltage test system. The proposed switch is configured as two identical series-connected switch stacks, each of which comprising 10 series-connected IGBT function units. Each unit consists of one IGBT, a gate driver, and an auxiliary voltage sharing circuit. A single switch stack can block 20 kV-rated high voltage, and two stacks in series are proven applicable to 30 kV-rated high voltage. The turn-on speed of the switch is approximately 250 ns. A flyback topology-based power supply system with a front-end power factor correction is built for the drive circuit by loosely inductively coupling each unit with a ferrite core to the primary side of a power generator to obtain the advantages of galvanic isolation and compact size. After the simulation, measurement, and estimation of the parasitic effect on the gate driver, a prototype is assembled and tested under different operating regimes. Experimental results are presented to demonstrate the performance of the developed prototype.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).