• Journal of IKEEE
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• v.22 no.4
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• pp.1025-1030
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• 2018

The proposed modulator is designed by utilizing a conventional structure employing time division technique to realize the 4th order delta-sigma modulator using one op-amp. In order to reduce the influence of KT/C noise, the capacitance in the first and second integrators reused was chosen to be 20pF and capacitance of third and fourth integrators was designed to be 1pF. The stage variable technique in the low power reconfigurable op-amp was used to solve the stability issue due to different capacitance loads for the reduction of KT/C noise. This technique enabled the proposed modulator to reduce the power consumption of 15% with respect to the conventional one. The proposed modulator was fabricated with 0.18um CMOS N-well 1 poly 6 metal process and consumes 305uW at supply voltage of 1.8V. The measurement results demonstrated that SNDR, ENOB, DR, FoM(Walden), and FoM(Schreier) were 66.3 dB, 10.6 bits, 83 dB, 98 pJ/step, and 142.8 dB at the sampling frequency of 256kHz, oversampling ratio of 128, clock frequency of 1.024 MHz, and input frequency of 250 Hz, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.2
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• pp.21-31
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• 2010

This paper presents a design of PLL and SSCG for reducing the EMI effect at the electronic machinery and tools for DisplayPort application. This system is composed of the essential element of PLL and Charge-Pump2 and Reference Clock Divider to implement the SSCG operation. In this paper, 270MHz/162MHz dual-mode PLL that can provide 10-phase and 1.35GHz/810MHz PLL that can reduce the jitter are designed for 2.7Gbps/162Gbps DisplayPort application. The jitter can be reduced drastically by combining 270MHz/162MHz PLL with 2-stage 5 to 1 serializer and 1.35GHz PLL with 2 to 1 serializer. This paper propose the frequency divider topology which can share the divider between modes and guarantee the 50% duty ratio. And, the output current mismatch can be reduced by using the proposed charge-pump topology. It is implemented using 0.13 um CMOS process and die areas of 270MHz/162MHz PLL and 1.35GHz/810MHz PLL are $650um\;{\times}\;500um$ and $600um\;{\times}\;500um$, respectively. The VCO tuning range of 270 MHz/162 MHz PLL is 330 MHz and the phase noise is -114 dBc/Hz at 1 MHz offset. The measured SSCG down spread amplitude is 0.5% and modulation frequency is 31kHz. The total power consumption is 48mW.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.8
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• pp.117-124
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• 2009

This paper describes a 3 to 5 GHz frequency synthesizer for MB-OFDM (Multi-Band OFDM) UWB (Ultra- Wideband) application using 0.13 ${\mu}m$ CMOS process. The frequency synthesizer operates in the band group 1 whose center frequencies are 3432 MHz 3960 MHz, and 4488 MHz. To cover the overall frequencies of group 1, an efficient frequency planning minimizing a number of blocks and the power consumption are proposed. And, a high-frequency VCO and LO Mixer architecture are also presented in this paper. A new mixed coarse tuning scheme that utilizes the MIM capacitance, the varactor arrays, and the DAC is proposed to expand the VCO tuning range. The frequency synthesizer can also provide the clock for the ADC in baseband modem. So, the PLL for the ADC in the baseband modem can be removed with this frequency synthesizer. The single PLL and two SSB-mixers consume 60 mW from a 1.2 sV supply. The VCO tuning range is 1.2 GHz. The simulated phase noise of the VCO is -112 dBc/Hz at 1 MHz offset. The die area is 2 ${\times}$ 2mm$^2$.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.48 no.6
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• pp.18-26
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• 2011

Debates concerning the competitive edge of leading 3DTV technology of the shutter glasses (SG) 3D and the film-type patterned retarder (FPR) are flaring up. Although SG technology enables Full-HD 3D vision, it requires complex systems including the sync transmitter (emitter), the sync processor chip, and the LCD lens in the active shutter glasses. In addition, the transferred sync-signal is easily affected by the external noise and a 3DTV viewer may feel flicker-effect caused by cross-talk of the left and right image. The operating current of the sync processor in the 3DTV active shutter glasses is gradually increasing to compensate the sync reconstruction error. The proposed chip is a low-power hardware sync processor based discrete-event SoC(system on a chip) designed specifically for the 3DTV active shutter glasses. This processor implements the newly designed power-saving techniques targeted for low-power operation in a noisy environment between 3DTV and the active shutter glasses. This design includes a hardware pre-processor based on a universal edge tracer and provides a perfect sync reconstruction based on a floating-point timer to advance the prior commercial 3DTV shutter glasses in terms of their power consumption. These two techniques enable an accurate sync reconstruction in the slow clock frequency of the synchronization timer and reduce the power consumption to less than about a maximum of 20% compared with other major commercial processors. This article describes the system's architecture and the details of the proposed techniques, also identifying the key concepts and functions.

• Journal of Astronomy and Space Sciences
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• v.24 no.4
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• pp.349-366
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• 2007

We designed and developed a multi-purpose CCD camera system for three kinds of CCDs; KAF-0401E($768{\times}512$), KAF-1602E($1536{\times}1024$), KAF-3200E($2184{\times}1472$) made by KODAK Co.. The system supports fast USB port as well as parallel port for data I/O and control signal. The packing is based on two stage circuit boards for size reduction and contains built-in filter wheel. Basic hardware components include clock pattern circuit, A/D conversion circuit, CCD data flow control circuit, and CCD temperature control unit. The CCD temperature can be controlled with accuracy of approximately $0.4^{\circ}C$ in the max. range of temperature, ${\Delta}33^{\circ}C$. This CCD camera system has with readout noise $6\;e^-$, and system gain $5\;e^-/ADU$. A total of 10 CCD camera systems were produced and our tests show that all of them show passable performance.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.4
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• pp.1-9
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• 2009

In this paper, a small area 12-bit 300MSPS CMOS Digital-to-Analog Converter(DAC) is proposed for display systems. The architecture of the DAC is based on a current steering 6+6 segmented type, which reduces non-linearity error and other secondary effects. In order to improve the linearity and glitch noise, an analog current cell using monitoring bias circuit is designed. For the purpose of reducing chip area and power dissipation, furthermore, a noble self-clocked switching logic is proposed. To verify the performance, it is fabricated with $0.13{\mu}m$ thick-gate 1-poly 6-metal N-well Samsung CMOS technology. The effective chip area is $0.26mm^2$ ($510{\mu}m{\times}510{\mu}m$) with 100mW power consumption. The measured INL (Integrated Non Linearity) and DNL (Differential Non Linearity) are within ${\pm}3LSB$ and ${\pm}1LSB$, respectively. The measured SFDR is about 70dB, when the input frequency is 15MHz at 300MHz clock frequency.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.9
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• pp.14-23
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• 2010

This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.37-47
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• 2006

This work proposes a 10b 25MS/s $0.8mm^2$ 4.8mW 0.13um CMOS A/D Converter (ADC) for high-performance wireless communication systems such as DVB, DAB and DMB simultaneously requiring low voltage, low power, and small area. A two-stage pipeline architecture minimizes the overall chip area and power dissipation of the proposed ADC at the target resolution and sampling rate while switched-bias power reduction techniques reduce the power consumption of analog amplifiers. A low-power sample-and-hold amplifier maintains 10b resolution for input frequencies up to 60MHz based on a single-stage amplifier and nominal CMOS sampling switches using low threshold-voltage transistors. A signal insensitive 3-D fully symmetric layout reduces the capacitor and device mismatch of a multiplying D/A converter while low-noise reference currents and voltages are implemented on chip with optional off-chip voltage references. The employed down-sampling clock signal selects the sampling rate of 25MS/s or 10MS/s with a reduced power depending on applications. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates the measured DNL and INL within 0.42LSB and 0.91LSB and shows a maximum SNDR and SFDR of 56dB and 65dB at all sampling frequencies up to 2SMS/s, respectively. The ADC with an active die area if $0.8mm^2$ consumes 4.8mW at 25MS/s and 2.4mW at 10MS/s at a 1.2V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.48-57
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• 2006

This work describes a 12b 200KHz 0.52mA $0.47mm^2$ algorithmic ADC for sensor applications such as motor controls, 3-phase power controls, and CMOS image sensors simultaneously requiring ultra-low power and small size. The proposed ADC is based on the conventional algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. The input SHA with eight input channels for high integration employs a folded-cascode architecture to achieve a required DC gain and a sufficient phase margin. A signal insensitive 3-D fully symmetrical layout with critical signal lines shielded reduces the capacitor and device mismatch of the MDAC. The improved switched bias power-reduction techniques reduce the power consumption of analog amplifiers. Current and voltage references are integrated on the chip with optional off-chip voltage references for low glitch noise. The employed down-sampling clock signal selects the sampling rate of 200KS/s or 10KS/s with a reduced power depending on applications. The prototype ADC in a 0.18um n-well 1P6M CMOS technology demonstrates the measured DNL and INL within 0.76LSB and 2.47LSB. The ADC shows a maximum SNDR and SFDR of 55dB and 70dB at all sampling frequencies up to 200KS/s, respectively. The active die area is $0.47mm^2$ and the chip consumes 0.94mW at 200KS/s and 0.63mW at 10KS/s at a 1.8V supply.